• 제목/요약/키워드: Deposition process

검색결과 2,756건 처리시간 0.037초

용액성장법에서 자외선 조사를 이용한 CdS의 산소함량 제어 (Oxygen Control in CdS Thin Film by UV Illumination in Chemical Bath Deposition)

  • 백현지;오지아;서영은;신혜진;조성욱;전찬욱
    • Current Photovoltaic Research
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    • 제7권2호
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    • pp.33-37
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    • 2019
  • In this paper, we compared the performance of $Cu(In,Ga)(S,Se)_2$ (CIGSSe) thin film solar cell with CdS buffer layer deposited by irradiating 365 nm UV light with 8 W power in Chemcial Bath Deposition (CBD) process. The effects of UV light irradiation on the thin film deposition mechanism during CBD-CdS thin film deposition were investigated through chemical and electro-optical studies. If the UV light is irradiated during the solution process, the hydrolysis of Thiourea is promoted even during the same time, thereby inhibiting the formation of the intermediate products developed in the reaction pathway and decreasing the pH of the solution. As a result, it is suggested that the efficiency of the CdS/CIGSSe solar cell is increased because the ratio of the S element in the CdS thin film increases and the proportion of the O element decreases. This is a very simple and effective approach to control the S/O ratio of the CdS thin film by the CBD process without artificially controlling the process temperature, solution pH or concentration.

부산의 지형적 특성을 고려한 $O_3$의 건성 침적속도 시뮬레이션 (A Simulation of the $O_3$Dry Deposition Velocity Considering Topographical Characteristics in Pusan)

  • 원경미;이화운
    • 한국대기환경학회지
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    • 제14권5호
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    • pp.421-432
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    • 1998
  • Deposition processes limit the life time of pollutants in the atmosphere and control the distance travelled before deposition. Thus the understanding about atmospheric deposition processes is essential for a proper assessment of the environmental impacts due to the anthropogenic pollutants. The dry deposition velocities are related to surface types, atmospheric stabilities, friction velocities, air pollutants and so on. In this study we simulated the dry deposition velocities of O3 in Pusan region. The calculated deposition velocities compared to the observed O3 data obtained during the summer of 1988 over a deciduous forest in Canada. The comparison showed that the model somewhat overpredicted deposition velocities for the average diurnal variations with maxima in daytime and minima in nighttime mostly due to the turbulence intensity.

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용융잉크 적층공정을 이용한 내부채색형상을 포함한 광조형물 제작에 관한 연구 (A Study on Fabrication of Internally Colored Shape in Stereolithography Parts using Molten Ink Deposition Process)

  • 박종철;박석희;강상일;양동열
    • 한국정밀공학회지
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    • 제27권6호
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    • pp.98-104
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    • 2010
  • Rapid Prototypes with internally colored objects are convenient by visualizing. A rapid prototyping method has been developed to fabricate mono-colored or multi-colored objects. In this work, a new process was proposed that can fabricate internally visible colored 3D objects in stereolithography parts. The process consists of projection stereolithography process using transparent photocurable resin for outer shapes and molten ink deposition process using molten solid ink for internal shapes. In molten ink deposition process, molten solid ink could be deposited uniformly in a designed pattern. To make molten solid ink uniform over a designed region, parametric study through a patterning solid ink was performed. By laminating resin and solid ink in sequence, the process can make colored 3D objects in StereoLithography(SL) parts. The practicality and effectiveness of the proposed process were verified through fabrication of colored basic 3D objects in SL parts.

Physical Vapour Deposition Fundamentals and Technical Aspects

  • Juhn, Hermann A.
    • 한국표면공학회지
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    • 제21권3호
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    • pp.114-129
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    • 1988
  • The principles of the physical vapour deposition processes(PVC); evaporation, sputting, and ion plating are presented and compared with each other with respect to coating properties, deposition rate and process control. The significance of coating sources and vacuum equipment for hard materials coating is discussed.

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Chemical Vapor Deposition 공정으로 제작한 CuI p-type 박막 트랜지스터 (p-type CuI Thin-Film Transistors through Chemical Vapor Deposition Process)

  • 이승민;장성철;박지민;윤순길;김현석
    • 한국재료학회지
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    • 제33권11호
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    • pp.491-496
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    • 2023
  • As the demand for p-type semiconductors increases, much effort is being put into developing new p-type materials. This demand has led to the development of novel new p-type semiconductors that go beyond existing p-type semiconductors. Copper iodide (CuI) has recently received much attention due to its wide band gap, excellent optical and electrical properties, and low temperature synthesis. However, there are limits to its use as a semiconductor material for thin film transistor devices due to the uncontrolled generation of copper vacancies and excessive hole doping. In this work, p-type CuI semiconductors were fabricated using the chemical vapor deposition (CVD) process for thin-film transistor (TFT) applications. The vacuum process has advantages over conventional solution processes, including conformal coating, large area uniformity, easy thickness control and so on. CuI thin films were fabricated at various deposition temperatures from 150 to 250 ℃ The surface roughness root mean square (RMS) value, which is related to carrier transport, decreases with increasing deposition temperature. Hall effect measurements showed that all fabricated CuI films had p-type behavior and that the Hall mobility decreased with increasing deposition temperature. The CuI TFTs showed no clear on/off because of the high concentration of carriers. By adopting a Zn capping layer, carrier concentrations decreased, leading to clear on and off behavior. Finally, stability tests of the PBS and NBS showed a threshold voltage shift within ±1 V.

대향타겟식 스퍼터링 장치의 공정 조건에 따른 SiO2 가스 차단막의 특성 (Characteristics of SiO2 Gas Barrier Films as a Function of Process Conditions in Facing Target Sputtering (FTS) System)

  • 배강;왕태현;손선영;김화민;홍재석
    • 한국전기전자재료학회논문지
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    • 제22권7호
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    • pp.595-601
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    • 2009
  • For the silicon oxide $(SiO_x)$ films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration$(O_2/Ar+O_2)$ introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the $SiO_x$ films are as follows: $d_{TS}\;and\;d_{TT}$ are 90mm and 120mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3%. Under this optimum conditions, it was found that the $SiO_x$ film was grown with a very high deposition rate of $250{\AA}$/min by rf-power of $4.4W/cm^2$, which was significantly enhanced as compared with a deposition rate (${\sim}55{\AA})$/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

원자력 사고 중 핵종의 건. 습침적에 따른 농작물 오염 영향 (Influence of Radioactive Contamination to Agricultural Products Due to Dry and Wet Deposition Processes During a Nuclear Emergency)

  • 황원태;김은한;서경석;한문희;최용호;이창우
    • Journal of Radiation Protection and Research
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    • 제27권3호
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    • pp.165-170
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    • 2002
  • 핵종의 지표 침적 모델의 고찰과 함께 방사성물질의 공기중 농도로부터 건침적 뿐 아니라 습침적에 따른 농작물 오염 영향을 분석, 고찰하였다. 이를 위해 방사성물질의 지표 침적량으로부터 농작물의 오염을 평가하는 기존 동적 섭식경로모델을 공기중 농도 또는 지표 침적량으로부터 평가할 수 있도록 개선하였다. 평가결과, 방사성물질의 지표 침적량은 습침적에 의한 영향이 건침적에 의한 영향보다 뚜렷이 높으나, 농작물의 오염정도는 핵종, 강우율 등에 따라 다르게 나타났다. 이러한 현상은 방사성물질의 지표 침적과 농작물에로의 차단중 어느 과정이 농작물 오염에 보다 지배적으로 작용하는가에 기인한다.

a-Si 막의 Band-gap과 Deposition-rate간의 비선형 거동을 통한 플라즈마 영역의 경계 규명 (Differentiating Plasma Regions Through the non-Linear Relationship between the Band-gap and the Deposition-rate of a-Si Thin Films)

  • 박성렬;김희원;김상덕;김종환;김범성;이돈희
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.72.1-72.1
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    • 2010
  • Thin film a-Si solar cells deposited by PECVD have many advantages compared to the traditional crystalline Si solar cells. They do not require expensive Si wafer, the process temperature is relatively low, possibility of scaling up for mass production, etc. In order to produce thin film solar cells, understanding the relationship between the material characteristics and deposition conditions is important. It has been reported by many groups that the band gap of the a-Si material and the deposition rate has an linear relationship, when RF power is used to control both. However, when the process pressure is changed in order to control the deposition rate and the band gap, a diversion from the well known linear relationship occurs. Here, we explain this diversion by the deposition condition crossing different plasma regions in the Paschen curve with a simple model. This model will become a guide to which condition a-Si thin films must be fabricated in order to get a high quality film.

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