• Tribology and Lubricants
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• v.35 no.1
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• pp.1-8
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• 2019

Demand for plastic gears are increasing in many industries due to their low production cost, light weight, applicability without lubricant, corrosion resistance and high resilience. Despite these benefits, utilizing plastic gears is limited due to their poor material properties. In this work, DLC coating was applied to improve the tribological properties of polyamide66 gear. 0 V, 40 V, and 70 V of negative bias voltages were selected as a deposition parameter in DC magnetron sputtering system. Pin-on-disk experiment was performed in order to investigate the wear characteristics of the gears. The results of the pin-on-disk experiment showed that DLC coated polyamide66 with 40 V of negative bias voltage had the lowest friction coefficient value (0.134) and DLC coated PA66 with 0 V of negative bias voltage showed the best wear resistance ($9.83{\times}10^{-10}mm^3/N{\cdot}mm$) among all the specimens. Based on these results, durability tests were conducted for DLC coated polyamide66 gears with 0 V of negative bias voltage. The tests showed that the temperature of the uncoated polyamide66 gear increased to about $37^{\circ}C$ while the DLC coated gear saturated at about $25^{\circ}C$. Also, the power transmission efficiency of the DLC coated gear increased by about 6% compared to those without coating. Weight loss of the polyamide66 gears were reduced by about 73%.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.747-754
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• 2008

Recently, the requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. Therefore, it is important to examine the surface state of substrate depending on the processing parameter during the anodic oxidation. This study investigated the effect of the various electrolyte concentrations on anodizing of titanium anode prior to copper electrodeposition. Different surface morphology of anodized titanium was obtained at different electrolytic concentration 0.5 M to 3.0 M. In addition, the effect that the surfaces and the electrical characteristics on the electrodeposited copper layer was observed. In this study, surface anodized in the group containing 0.5M $H_2SO_4$ shows more uniform copper crystals with low surface roughness. the surface roughness and sheet resistance for 0.5M $H_2SO_4$ group were $1.353{\mu}m$ and $0.104m{\Omega}/sq$, respectively.

• Journal of Sensor Science and Technology
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• v.10 no.1
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• pp.62-70
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• 2001

The ZnSe sample grown by chemical bath deposition (CBD) method were annealed in Ar gas at $45^{\circ}C$. Using extrapolation method of X-ray diffraction pattern, it was found to have zinc blend structure whose lattice parameter $a_o$ was $5.6687\;{\AA}$. From Hall effect, the mobility was likely to be decreased by impurity scattering at temperature range from 10 K to 150 K and by lattice scattering at temperature range from 150 K to 293 K. The band gap given by the transmission edge changed from $2.700{\underline{5}}\;eV$ at 293 K to $2.873{\underline{9}}\;eV$ at 10 K. Comparing photocurrent peak position with transmission edge, we could find that photocurrent peaks due to excition electrons from valence band, ${\Gamma}_8$ and ${\Gamma}_7$ and to conduction band ${\Gamma}_6$ were observed at photocurrent spectrum. From the photocurrent spectra by illumination of polarized light on the ZnSe thin film, we have found that values of spin orbit coupling splitting ${\Delta}so$ is $0.098{\underline{1}}\;eV$. From the PL spectra at 10K, the peaks corresponding to free bound excitons and D-A pair and a broad emission band due to SA is identified. The binding energy of the free excitons are determined to be $0.061{\underline{2}}\;eV$ and the dissipation energy of the donor -bound exciton and acceptor-bound exciton to be $0.017{\underline{2}}\;eV$, $0.031{\underline{0}}\;eV$, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.293-293
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• 2014

Over last decade InGaN alloy structures have become the one of the most promising materials among the numerous compound semiconductors for high efficiency light sources because of their direct band-gap and a wide spectral region (ultraviolet to infrared). The primary cause for the high quantum efficiency of the InGaN alloy in spite of high threading dislocation density caused by lattice misfit between GaN and sapphire substrate and severe built-in electric field of a few MV/cm due to the spontaneous and piezoelectric polarizations is generally known as the strong exciton localization trapped by lattice-parameter-scale In-N clusters in the random InGaN alloy. Nonetheless, violet-emitting (390 nm) conventional low-In-content InGaN/GaN multi-quantum wells (MQWs) show the degradation in internal quantum efficiency compared to blue-emitting (450 nm) MQWs owing higher In-content due to the less localization of carrier and the smaller band offset. We expected that an improvement of internal quantum efficiency in the violet region can be achieved by replacing the conventional low-In-content InGaN/GaN MQWs with ultra-thin, high-In-content (UTHI) InGaN/GaN MQWs because of better localization of carriers and smaller quantum-confined Stark effect (QCSE). We successfully obtain the UTHI InGaN/GaN MQWs grown via employing the GI technique by using the metal-organic chemical vapor deposition. In this work, 1 the optical and structural properties of the violet-light-emitting UTHI InGaN/GaN MQWs grown by employing the GI technique in comparison with conventional low-In-content InGaN/GaN MQWs were investigated. Stronger localization of carriers and smaller QCSE were observed in UTHI MQWs as a result of enlarged potential fluctuation and thinner QW thickness compared to those in conventional low-In-content MQWs. We hope that these strong carrier localization and reduced QCSE can turn the UTHI InGaN/GaN MQWs into an attractive candidate for high efficient violet emitter. Detailed structural and optical characteristics of UTHI InGaN/GaN MQWs compared to the conventional InGaN/GaN MQWs will be given.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.134-134
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• 2011

High-k dielectric materials such as $HfO_2$, $ZrO_2$ and $Al_2O_3$ increase gate capacitance and reduce gate leakage current in MOSFET structures. This behavior suggests that high-k materials will be promise candidates to substitute as a tunnel barrier. Furthermore, stack structure of low-k and high-k tunnel barrier named variable oxide thickness (VARIOT) is more efficient.[1] In this study, we fabricated the $WSi_2$ nanocrystals nonvolatile memory device with $SiO_2/HfO_2/Al_2O_3$ tunnel layer. The $WSi_2$ nano-floating gate capacitors were fabricated on p-type Si (100) wafers. After wafer cleaning, the phosphorus in-situ doped poly-Si layer with a thickness of 100 nm was deposited on isolated active region to confine source and drain. Then, on the gate region defined by using reactive ion etching, the barrier engineered multi-stack tunnel layers of $SiO_2/HfO_2/Al_2O_3$ (2 nm/1 nm/3 nm) were deposited the gate region on Si substrate by using atomic layer deposition. To fabricate $WSi_2$ nanocrystals, the ultrathin $WSi_2$ film with a thickness of 3-4 nm was deposited on the multi-stack tunnel layer by using direct current magnetron sputtering system [2]. Subsequently, the first post annealing process was carried out at $900^{\circ}C$ for 1 min by using rapid thermal annealing system in nitrogen gas ambient. The 15-nm-thick $SiO_2$ control layer was deposited by using ultra-high vacuum magnetron sputtering. For $SiO_2$ layer density, the second post annealing process was carried out at $900^{\circ}C$ for 30 seconds by using rapid thermal annealing system in nitrogen gas ambient. The aluminum gate electrodes of 200-nm thickness were formed by thermal evaporation. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer with HP 41501A pulse generator, an Agillent 81104A 80MHz pulse/pattern generator and an Agillent E5250A low leakage switch mainframe. We will discuss the electrical properties for application next generation non-volatile memory device.

• Magazine of the Korean Society of Agricultural Engineers
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• v.22 no.4
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• pp.108-114
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• 1980

A deterministic conceptual erosion model which simulates detachment, entrainment, transport and deposition of eroded soil particles by rainfall impact and flowing water is presented. Both upland and channel phases of sediment yield are incorporated into the erosion model. The algorithms for the soil erosion and sedimentation processes including land and crop management effects are taken from the literature and then solved using a digital computer. The erosion model is used in conjunction with the modified Kentucky Watershed Model which simulates the hydrologic characteristics from watershed data. The two models are linked together by using the appropriate computer code. Calibrations for both the watershed and erosion model parameters are made by comparing the simulated results with actual field measurements in the Four Mile Creek watershed near Traer, Iowa using 1976 and 1977 water year data. Two water years, 1970 and 1978 are used as test years for model verification. There is good agreement between the mean daily simulated and recorded streamflow and between the simulated and recorded suspended sediment load except few partial differences. The following conclusions were drawn from the results after testing the watershed and erosion model. 1. The watershed and erosion model is a deterministic lumped parameter model, and is capable of simulating the daily mean streamflow and suspended sediment load within a 20 percent error, when the correct watershed and erosion parameters are supplied. 2. It is found that soil erosion is sensitive to errors in simulation of occurrence and intensity of precipitation and of overland flow. Therefore, representative precipitation data and a watershed model which provides an accurate simulation of soil moisture and resulting overland flow are essential for the accurate simulation of soil erosion and subsequent sediment transport prediction. 3. Erroneous prediction of snowmelt in terms of time and magnitute in conjunction with The frozen ground could be the reason for the poor simulation of streamflow as well as sediment yield in the snowmelt period. More elaborate and accurate snowmelt submodels will greatly improve accuracy. 4. Poor simulation results can be attributed to deficiencies in erosion model and to errors in the observed data such as the recorded daily streamflow and the sediment concentration. 5. Crop management and tillage operations are two major factors that have a great effect on soil erosion simulation. The erosion model attempts to evaluate the impact of crop management and tillage effects on sediment production. These effects on sediment yield appear to be somewhat equivalent to the effect of overland flow. 6. Application and testing of the watershed and erosion model on watersheds in a variety of regions with different soils and meteorological characteristics may be recommended to verify its general applicability and to detact the deficiencies of the model. Futhermore, by further modification and expansion with additional data, the watershed and erosion model developed through this study can be used as a planning tool for watershed management and for solving agricultural non-point pollution problems.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.34 no.6
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• pp.713-719
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• 2001

The aim of this study is to check the application criteria of the conventional techniques and clarify the effects of breaker depth, seabed conditions on the stability in relation to the effects of uncertainty of storm duration and directional irregular waves. The typical damage modes were divided by the direct wave force on the armor unit and by the local scouring around the toe of a breakwater head by the model experiments. The destruction modes are defined, and some criteria on the damage modes and scouring/deposition at the toe of a breakwater head in relating the wave-bottom-structural conditions can be checked using the multi-directonal irregular wave generator system. According to the results, it is emphasized that the 3-D effects on the stability should be analyzed in the design of multi-purpose/function coastal structures in consideration of the evaluation of spatial variation of damage modes and hydraulic characteristics as well as the wave distribution along the structures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Journal of Animal Science and Technology
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• v.50 no.3
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• pp.293-300
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• 2008

Muscle fat content including intramuscular fat content(IMF) is the most important parameter in meat quality of cattle. Triacylglycerol is the major component of fat and is found in adipocyte and skeletal muscle. In present study, we carried out the determined of triacylglycerol contents and mRNA expression patterns of genes related with triacylglycerol biosynthesis such as ACSS2, GPAT, MGAT and DGAT in Hanwoo longissimus muscle using the real-time PCR. The triacylglycerol contents were continuously increased during the fattening stages. Interestingly, the contents of triacylglycerol were 7.4 fold higher(0.34 vs. 2.51, P<0.01) in 27 months old group than 12 months old group. The mRNA levels of ACSS2, GPAT and DGAT genes were also increased during fattening stages, whereas that of MGAT gene did not show difference among the stages. Thus, these results suggested that increasing of the triacylglycerol contents in longissimus muscle during fattening stages may be related with increased expressions of triacylglycerol biosynthesis genes(ACSS2, GPAT and DGAT). These results will be helpful to understand the mechanism of muscle fat deposition in skeletal muscle.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.139-139
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• 2010

금속 실리사이드 나노입자는 열적 및 화학적 안정성이 뛰어나고, 절연막내에 일함수 차이에 따라 깊은 양자 우물구조가 형성되어 비휘발성 메모리 소자를 제작할 수 있다. 그러나 단일 $SiO_2$ 절연막을 사용하였을 경우 저장된 전하의 정보 저장능력 및 쓰기/지우기 시간을 향상시키는 데 물리적 두께에 따른 제한이 따른다. 본 연구에서는 터널장벽 엔지니어링을 통하여 물리적인 두께는 단일 $SiO_2$ 보다는 두꺼우나 쓰기/지우기 동작을 위하여 인가되는 전기장에 의하여 상대적으로 전자가 느끼는 상대적인 터널 절연막 두께를 감소시키는 방법으로 동작속도를 향상 시킨 $SiO_2/Si_3N_4/SiO_2$ 및 $Si_3N_4/SiO_2/Si_3N_4$ 터널 절연막을 사용한 금속 실리사이드 나노입자 비휘발성 메모리를 제조하였다. 제조방법은 우선 p-type 실리콘 웨이퍼 위에 100 nm 두께로 증착된 Poly-Si 층을 형성 한 이후 소스와 드레인 영역을 리소그래피 방법으로 형성시켜 트랜지스터의 채널을 형성한 이후 그 상부에 $SiO_2/Si_3N_4/SiO_2$ (2 nm/ 2 nm/ 3 nm) 및 $Si_3N_4/SiO_2/Si_3N_4$ (2 nm/ 3 nm/ 3 nm)를 화학적 증기 증착(chemical vapor deposition)방법으로 형성 시킨 이후, direct current magnetron sputtering 방법을 이용하여 2~5 nm 두께의 $WSi_2$ 및 $TiSi_2$ 박막을 증착하였으며, 나노입자 형성을 위하여 rapid thermal annealing(RTA) system을 이용하여 $800{\sim}1000^{\circ}C$에서 질소($N_2$) 분위기로 1~5분 동안 열처리를 하였다. 이후 radio frequency magnetron sputtering을 이용하여 $SiO_2$ control oxide layer를 30 nm로 증착한 후, RTA system을 이용하여 $900^{\circ}C$에서 30초 동안 $N_2$ 분위기에서 후 열처리를 하였다. 마지막으로 thermal evaporator system을 이용하여 Al 전극을 200 nm 증착한 이후 리소그래피와 식각 공정을 통하여 채널 폭/길이 $2{\sim}5{\mu}m$인 비휘발성 메모리 소자를 제작하였다. 제작된 비휘발성 메모리 소자는 HP 4156A semiconductor parameter analyzer와 Agilent 81101A pulse generator를 이용하여 전기적 특성을 확인 하였으며, 측정 온도를 $25^{\circ}C$, $85^{\circ}C$, $125^{\circ}C$로 변화시켜가며 제작된 비휘발성 메모리 소자의 열적 안정성에 관하여 연구하였다.