• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.433-441
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• 2007

This work investigated the stability of a Sn-modified Pt electrode, which was used for reduction of nitrate, fabricated by an adsorption or electro-deposition of Sn on Pt. In order to find the causes for instability of the electrode, the effects of the solutions in which the electrode was used and the potential applied to the electrode on the electrochemical and metallurgical behaviors of Sn on Pt were studied. The Sn of freshly- prepared modified-Sn Pt electrode existed as Sn hydroxide form, which brought about an easy loss of the electro-activity of the electrode even staying in water, especially in acid solution. When the Sn-modified Pt electrode was used for the reduction of nitrate, the electro-activity of the electrode was affected depending on the potential applied to the electrode. When a more negative potential than the redox equilibrium potential between $Sn(OH)_2$ and Sn was applied to the electrode, the Sn hydroxide was converted to Sn that could diffused into Pt, which leaded to the loss of electro-activity of the electrode as well. The solid diffusion of Sn increased linearly with the applied potential. The Sn-electrodeposited Pt electrode which had more Sn on the electrode was more favorable to maintaining the integrity of the electrode during the reduction of nitrate than the Sn-adsorbed Pt electrode prepared in the under-potential deposition way.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.671-676
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• 2009

The $Sr_{0.7}Bi_{2.3}Nb_2O_9$(SBN) thin films are deposited on Pt-coated electrode(Pt/Ti/$SiO_2$/Si) using RF sputtering method at various deposition conditions. We investigated the effect of deposition condition on the surface morphology and dielectric properties of SBN thin films. The optimum of the rougness showed about 4.33 nm in 70/30 of Ar/$O_2$ ratio. The crystallinity and rougness of SBN thin films were increased with the increase of rf power. Also, Deposition rate of SBN thin films was about 4.17 nm/min in 70 W of rf power. The capacitance of SBN thin films were increased with the increase of Ar/$O_2$ ratio, rf power and deposition temperature respectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.3
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• pp.544-547
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• 2009

The $Sr_{0.7}Bi_{2.3}Nb_{2}O_{9}$(SBN) thin films are deposited on Pt-coated electrode(Pt/Ti/$SiO_2$/Si) using RF sputtering method at various deposition temperature. The optimum conditions of RF power and Ar/$O_2$ ratio were 60[W] and 70/30, respectively. Deposition rate of SBN thin films was about 4.17[nm/min]. The crystallinity of SBN thin films were increased with increase of deposition temperature in the temperature range of $100{\sim}400[^{\circ}C]$, the surface rougness showed about 4.33[nm]. The capacitance of SBN thin films were increased with the increase of deposition temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.246-246
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• 2012

Smart catalyst design though novel catalyst preparation methods can improve catalytic activity of transition metals on reducible oxide supports such as titania by enhancement of metal oxide interface effects. In this work, we investigated Pt nanoparticles/titania catalysts under CO oxidation reaction by using novel preparation methods in order to enhance its catalytic activity by optimizing metal oxide interface. Arc plasma deposition (APD) and metal impregnation techniques are employed to achieve Pt metal deposition on titania supports which are prepared by multi-target sputtering and Sol-gel techniques. In order to tailor metal-support interface for catalytic CO oxidation reaction, Pt nanoparticles and thin films are deposited in varying surface coverages on sputtered titania films using APD. To assess the role of oxide support at the interface, APD-Pt is deposited on sputtered and Sol-gel prepared titania films. Lastly, characteristics of APD-Pt process are compared with Pt impregnation technique. Our results show that activity of Pt nanoparticles is improved when supported over Sol-Gel prepared titania than sputtered titania film. It is suggested that this enhanced activity can be partly ascribed to a very rough titania surface with the higher free metal surface area and higher number of sites at the interface between the metal and the support. Also, APD-Pt shows superior catalytic activity under CO oxidation as compared to Pt impregnation on sputtered titania support. XPS results show that bulk oxide is formed on Pt when deposited through impregnation and has higher proportion of oxidized Pt in the form of $Pt^{2+/4+}$ oxidation states than Pt metal. APD-Pt shows, however, mild oxidation with large proportion of active Pt metal. APD-Pt also shows trend of increasing CO oxidation activity with number of shots. The activity continues to increase with surface coverage beyond 100%, thus suggesting a very rough and porous Pt films with higher active surface metal sites due to an increased surface area available for the reactant CO and $O_2$ molecules. The results suggest a novel approach for systematic investigation into metal oxide interface by rational catalysts design which can be extended to other metal-support systems in the future.

• Proceedings of the Korean Magnestics Society Conference
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• 2010.06a
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• pp.70-71
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• 2010

In this study, We fabricated FePt-based perpendicular patterned media using a selective combination of E-beam lithography and either Ar plasma etching (deposition-first process) or FePt lift-off (deposition-last process). We employed the deposition-last process to avoid chemical and structural disordering by impinging Ar ions (deposition-first process). For a patterned medium with 100 nm patterns made by this process, the out-of-plane coercivity was measured to be 5 fold larger than its in-plane value. The deposition-last process may be a promising way to achieve ultra-high density patterned media.

• Journal of Powder Materials
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• v.27 no.1
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• pp.63-71
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• 2020

It is necessary to fabricate uniformly dispersed nanoscale catalyst materials with high activity and long-term stability for polymer electrolyte membrane fuel cells with excellent electrochemical characteristics of the oxygen reduction reaction and hydrogen oxidation reaction. Platinum is known as the best noble metal catalyst for polymer electrolyte membrane fuel cells because of its excellent catalytic activity. However, given that Pt is expensive, considerable efforts have been made to reduce the amount of Pt loading for both anode and cathode catalysts. Meanwhile, the atomic layer deposition (ALD) method shows excellent uniformity and precise particle size controllability over the three-dimensional structure. The research progress on noble metal ALD, such as Pt, Ru, Pd, and various metal alloys, is presented in this review. ALD technology enables the development of polymer electrolyte membrane fuel cells with excellent reactivity and durability.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.189-193
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• 1997

(S $r_{0.85}$/C $a_{0.15}$)Ti $O_3$(SCT) thin films at various deposition temperature and rf power were grown by rf magnetron sputtering method on optimized Pt-based electrodes (Pt/TiN/ $SiO_2$/Si). The crystallinity of the films increases with increasing deposition temperature. SCT thin film is depend on the surface morphology and crystallinity of Pt films for bottom electrode. Dielectric constant of (S $r_{0.85}$C $a_{0.15}$)Ti $O_3$ thin films deposited on Si wafer substrate are larger with the increase of deposition temperature and gain size.in size.

• Korean Chemical Engineering Research
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• v.60 no.2
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• pp.202-207
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• 2022

The study on electrode degradation of Proton Exchange Membrane Fuel Cell (PEMFC) was mainly studied on the particle growth and active area reduction of Pt on the electrode. The degradation of the electrode catalyst Pt in contact with the membrane affects the deterioration of the polymer membrane, but there are not many studies related to this. In this study, the phenomenon of the deposition of deteriorated Pt inside the polymer membrane during the accelerated electrode catalyst degradation test and its effects were studied. The voltage change (0.6 V ↔ 0.9 V) was repeated up to 30,000 cycles to accelerate the platinum degradation rate. When the voltage change cycle was repeated while oxygen was introduced into the cathode, the amount of Pt deposited inside the film was larger than when nitrogen was introduced. As the number of voltage change cycles increased, the amount of Pt deposited inside the membrane increased, and Pt dissolved in the cathode moved toward the anode, showing a uniform distribution throughout the membrane at 20,000 cycles. In the process of the accelerated electrode catalyst degradation test, the hydrogen crossover current density of the membrane did not change, and it was confirmed that the deposited Pt did not affect the durability of the membrane.

• Journal of the Korean institute of surface engineering
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• v.48 no.2
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• pp.38-42
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• 2015

Atomic layer deposition (ALD) is essential for the fabrication of nanoscale electronic devices because it has excellent conformality, atomic scale thickness control, and large area uniformity. Metal thin films are one of the important material components for electronic devices as a conductor. As the size of electronic devices shrinks, the thickness of metal thin films is decreased down to few nanometers, and the metal films become non-continuous due to inherent island growth of metal below a critical thickness. So, fabrication of continuous metal thin films by ALD is fundamentally and practically important. Since ALD films are grown through self-saturated reactions between precursors on surface, initial growth characteristics significantly depend on the surface properties and the selection of precursors. In this work, we investigated ALD Pt on $TiO_2$ substrate by using trimethyl-methyl-cyclopentadienyl-Platinum ($MeCpPtMe_3$) precursor and $O_3$ reactant. By using $O_3$ instead of $O_2$, initial nucleation rate of ALD Pt was increased on $TiO_2$ surface, resulting in formation of continuous thin Pt films. Morphologies of ALD Pt on $TiO_2$ were characterized by using Scanning Electron Microscope (SEM) and Energy-Dispersive X-ray Spectroscopy (EDS). Crystallinity of ALD Pt on $TiO_2$ correlated with its growth characteristics was analyzed by X-Ray Diffraction (XRD).

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.41-45
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• 2007

The (SrCa)$TiO_3$(SCT) thin films were deposited on Pt-coated electrode(Pt/TiN/$SiO_2$/Si) using RF sputtering method according to the deposition condition. The crystallinity of SCT thin films were increased with increase of deposition temperature in the temperature range of $100{\sim}500[^{\circ}C]$. The optimum conditions of RF power and Ar/$O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about $18.75[{\AA}/min]$ at the optimum condition. The composition of SCT thin films deposited on Si substrate is close to stoichiometry (1.081 in A/B ratio). The maximum dielectric constant of SCT thin film was obtained by annealing at $600[^{\circ}C]$.