• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1992년도 하계학술대회 논문집 B
• /
• pp.832-834
• /
• 1992

Using the PECVD method, the silicon nitride films were deposited by changing the $SiH_4/NH_3$ gas flow ratio from 0.2 to 1.4 at an interval of 0.2, AES, FTIR, and Spectroscopic Ellipsomter were used to analyze the film composition and structure, the refractive index, and the deposition rate. Also the C-V analysis was used to estimate the memory performance in the capacitor type MNOS memory devices, which utilized native oxide as the tunneling barrier, with the silicon nitride by the above deposition conditions. As a result, it was confirmed that the performance of MNOS memory devices with PECVD silicon nitride was comparable to that with LPCVD or APCVD silion nitride.

• Transactions on Electrical and Electronic Materials
• /
• 제10권5호
• /
• pp.147-151
• /
• 2009

For integrated passive device (IPD) applications, we have successfully developed and characterized metalinsulator-metal (MIM) capacitors with 2000 $\AA$ plasma-enhanced chemical vapor deposition (PECVD) silicon nitride which are deposited with the $SiH_4/NH_3$ gas mixing rate, working pressure, and RF power of PECVD at $250^{\circ}C$. Five PECVD process parameters are designed to lower the refractive index and lower the deposition rate of $Si_3N_4$ films for the high breakdown electric field. For the PECVD process condition of gas mixing rate (0.957), working pressure (0.9 Torr), and RF power (60 W), the atomic force microscopy (AFM) root mean square (RMS) value of about 2000 $\AA$ $Si_3N_4$ on the bottom metal is lowest at 0.862 nm and the breakdown electric field is highest at about 8.0 MV/cm with a capacitance density of 326.5 pF/$mm^2$. A pretreatment of metal electrodes is proposed, which can reduce the peeling of nitride in the harsh test environment of heat, pressure, and humidity.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.148-148
• /
• 2008

Low-k dielectric materials are an alternative plan to improve the signal propagation delay, crosstalk, dynamic power consumption due to resistance and parasitic capacitance generated the decrease of device size. Now, various materials is studied for the next generation. Diethoxymethlysiliane (DEMS) precursor using this study has two ethoxy groups along with one methyl group attached to the silicon atoms. SiCOH thin films were deposited on p-type Si(100) substrate by Plasma Enhanced Chemical Vapor Deposition (PECVD) using DEMS. In this study, we studied the effect of oxygen($O_2$) flow rate for DEMS to characteristics of thin films. The characteristics of thin films deposited using DEMS and $O_2$ evaluated through refractive index, dielectric constant(k), surface roughness, I-V(MIM:Al / SiCOH / Ag), C-V(MIM), deposition rate.

• 대한기계학회논문집B
• /
• 제23권5호
• /
• pp.670-677
• /
• 1999

An analysis of generation and growth of multicomponent particles has been carried out to predict the size and composition distributions of particles generated in the Modified Chemical Vapor Deposition(MCVD) process. In MCVD process. scale-up of sintering and micro-control of refractive index may need the Information about the size and composition distributions of $SiO_2-GeO_2$ particles that are generated and deposited. The present work solved coupled steady equations (axi-symmetric two dimensions) for mass conservation, momentum balance. energy and species(such as $SiCl_4$, $GeCl_4$, $O_2$, $Cl_2$) conservations describing fluid flow. heat and mass transfer in a tube. Sectional method has been applied to obtain multi-modal distributions of multicomponent aerosols which vary in both radial and axial directions. Chemical reactions of $SiCl_4$ and $GeCl_4$ were included and the effects of variable properties have also been considered.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.168.2-168.2
• /
• 2014

반사방지막 코팅(Anti-reflection coating)은 태양전지(Solar cell), 발광다이오드(LED) 등의 반사율을 낮추어 효율을 증대시키기 위하여 사용되고 있다. 본 실험에서는 유리 기판 위에 실리콘 타겟을 이용한 반응성 high power impulse magnetron sputtering (HIPIMS) 장비를 활용하여, 높은 공정 압력(High-pressure)에서 펄스폭(Pulse width)을 조절하여 $SiO_2$ 반사방지막 코팅층을 형성하였다. 또한, 기공이 더 많은 박막을 제작하기 위해 빗각증착(Oblique-angle deposition)을 적용하여 더 좋은 광학 특성을 갖는 반사방지막 코팅층을 형성하였다. UV-Vis spectrometer를 이용하여, 380~800 nm 파장에서 투과율(Transmittance)을 측정하여 비교, 분석하였다. Ellipsometer를 이용하여 $SiO_2$ 박막층의 굴절률(Refractive index)을 측정한 결과, 반사방지막 코팅층 내부 기공에 따라 다양한 굴절률을 가지는 것을 확인할 수 있었다. 또한, 코팅층 내부 기공의 형상을 확인하기 위해 SEM(Secondary electron microscopy)을 활용하여 코팅층 단면(Cross section)을 측정하였다. 이를 활용하여 낮은 굴절률을 갖는 반사방지용 $SiO_2$ 코팅층을 형성하여 태양전지의 광 변환 효율을 상승 시킬 수 있고, 발광다이오드의 광 추출 효율을 증가시킬 있을 것으로 여겨진다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
• /
• pp.785-789
• /
• 2005

Low temperature deposition of silicon and silicon nitride films by catalytic CVD technique was studied for application to thin film transistors on plastic substrates for flexible AMOLEDs. The substrate temperature initially held at room temperature, and was controlled successfully below $150^{\circ}C$ during the entire deposition process. Amorphous silicon films having good adhesion, good surface morphology and sufficiently low content of atomic hydrogen were obtained and could be successfully crystallized using excimer laser without a prior dehydrogenation step. $SiN_x$ films showed a good refractive index, a high deposition rate, a moderate breakdown field and a dielectric constant. The Cat-CVD silicon and silicon nitride films can be good candidates for fabricating thin films transistors on plastic substrates to drive active-matrix organic light emitting display.

• 반도체디스플레이기술학회지
• /
• 제13권4호
• /
• pp.21-25
• /
• 2014

The silicon nitride ($SiN_x$) film for surface passivation and anti-reflection coating of crystalline silicon solar cell is very important and it is generally deposited by plasma enhanced chemical vapor deposition (PECVD). PECVD can be divided into low and high frequency method. In this paper, the $SiN_x$ film deposited by low and high frequency PECVD method was studied. First, to optimize the $SiN_x$ film deposited by low frequency PECVD method, the refractive index was measured by varying the process conditions like $SiH_4$, $NH_3$, $N_2$ gas rate, and RF power. When $SiH_4$ gas rate was increased and $NH_3$ gas rate was decreased, the refractive index was increased. The refractive index was also increased with RF power decline. Second, to compare the characteristics of the low and high frequency PECVD $SiN_x$ film, the refractive index was measured by varying $NH_3/SiH_4$ gas ratio and RF power and the minority carrier lifetime of before and after high temperature treatment process was also measured. The refractive index of both low and high frequency PECVD $SiN_x$ film was decreased with increase in $NH_3/SiH_4$ gas ratio and RF power. After high temperature treatment process, the minority carrier lifetime of both low and high frequency PECVD $SiN_x$ film was increased and increased degree was similar. The minority carrier lifetime of low frequency PECVD $SiN_x$ was increased from $11.03{\mu}m$ to $28.24{\mu}m$ and that of high frequency PECVD $SiN_x$ was increased from $11.60{\mu}m$ to $27.10{\mu}m$.

• 한국세라믹학회지
• /
• 제31권6호
• /
• pp.601-608
• /
• 1994

Aluminum oxide thin films were deposited on p-type(100) silicon substrates by electron cyclotron resonance plasma enhanced CVD(ECR-PECVD) using TMA[Al(CH3)3] and oxygen as reactant gases at 16$0^{\circ}C$ or lower temperatures. The aluminum oxide films deposited by ECR-PECVD have the amorphous structure with the refractive index of 1.62~1.64 and the O/Al ratio of 1.6~1.7. Oxygen flow rate necessary for the stable deposition of the aluminum oxide films increases as the deposition temperature increases. It was found from the OES analysis that the ECR plasma had les cooling effect by introducing the TMA reactant gas in comparison with the RF plasma. The properties of aluminum oxide films prepared by ECR-PECVD were compared with those prepared by RF-PECVD. The ECR-PECVD aluminum oxide films have the higher refractive indices, the lower contents of impurities (H and C) and the stronger wet etch resistance than those deposited by RF-PECVD.

• 대한전자공학회논문지
• /
• 제26권8호
• /
• pp.1197-1202
• /
• 1989

In this study, physical properties of silicon dioxide film deposited on GaAs by photo excitation are evaluated using ellisometry, ESCA and AES. Under the pressure of 2-8 torr, silicon dioxide film is deposited on GaAs by photo excitation at 200\ulcorner using gas mixtures of SiH4 and N2O. The measured results show refractive index varies from 1.37 to 1.42 and stoichiometry from 1.97 to 2.09 with process pressure. The observed characteristics of deposition rate are divided into three different regions with process pressure and possible deposition mechanism are also discussed, qualitatively.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 E
• /
• pp.2456-2458
• /
• 1999

The polarization mode dispersion (PMD) that restricts the transmission bandwidth was investigated in standard long single mode fiber which optimized at 1.3${\mu}m$. Although fiber has perfect circular symmetry, each optical fiber has different refractive index profiles. The investigation of PMD with random mode couplings were conducted in three kinds of fiber by the time-domain interferometric method. By using two manufacturing methods, MCVD(Modified Chemical Vapor Deposition) method and VAD(Vapor Phase Axial Deposition) method, the property of mechanical asymmetric lateral pressure, bending and twisting induced polarization mode dispersion were measured. The concatenated optical fibers were compared with other types.