• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.43-50
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• 2014

전자 제품의 경박 단소화 및 고집적화가 이루어 지면서 실리콘 집과 인쇄회로기판의 인터커넥션의 고신뢰도가 요구되고 있다. 본 연구는 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 다양한 무전해 Ni-P 도금 두께에서의 high speed shear 에너지 및 파괴 모드를 연구하였다. 파괴 모드 분석을 위하여 집속이온빔(FIB) 분석이 이용되었다. 질산 기상 처리하지 않은 $1{\mu}m$ Ni-P 시편에서 낮은 shear 에너지가 나왔으며, 이는 솔더레지스트 선단에서 파단의 원인을 제공하는 것이 확인되었다. 질산 기상 처리한 시편에서 무전해 Ni-P 도금 두께가 커질수록 취성 파괴 모드는 감소한다. 또 Ni-P 도금 두께와 표면 거칠기(Ra)는 반비례 관계를 가진다. 이는 Ni-P 도금의 표면 거칠기를 낮추면 SAC405 솔더 조인트의 신뢰도를 향상시킨다는 사실을 나타낸다.

• 한국표면공학회지
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• 제29권5호
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• pp.301-313
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• 1996

The texture of vapor deposits(PVD and CVD) changes from the orientation that places the lowest energy lattice plane parallel to the substrate under the condition of low atom or ion concentration adjacent to the deposit, to the orientation that places the higher energy crystal planes parallel to the substrate as the atom or ion concentration adjacent to the deposit increases. However, in the early stage of deposition, the deposit-substrate interface energy and the surface energy constitute the most important energies of the system. Therefore, if the lattice match is established between the substrate and the deposit without generating much strain energy, the epitaxial growth takes place to reduce the interfacial energy. When the epitaxial growth does not take place, the surface energy is dominant in the early stage of deposition and the lowest energy crystal plane tends to be placed parallel to the substrate up to a critial thickness. The thickness depends on the deposition condition. If the deposition condition does not favor placing the lowest energy crystal plane parallel to the substrate, the initial texture will change to that compatible with the deposition condition as the film thickness increases, and the texture turnover thickness will be short. The microstructure and surface topography of deposits are related to their texture.

• 한국표면공학회지
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• 제27권5호
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• Korean Chemical Engineering Research
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• 제54권1호
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

• Journal of Welding and Joining
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• 제32권3호
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Corrosion Science and Technology
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• 제15권2호
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• pp.78-83
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• 2016

The e-coating to inhibit induced corrosion can deposit a coating not only on the exterior surface but also on the inside of whole metallic components of body-in-white (BIW). But it is difficult to deposit paint films on the inside area because metallic components are multi layered. It may cause shortness of e-coating thickness. The only way to properly verify e-coating thickness is by performing the use of tear-down prototypes. When paint films' thickness is inadequate, a structural modification on each metallic component is needed. Verification of the thickness improvement for a structural modification requires much manual effort and leads to increasing development time. Recently, the simulation technology has been developed to predict the e-coating thickness in e-coating field. By applying the simulation to BIW, improvement in paint thickness quality and shortening of development period are expected. The paper explains a validated solution that allows simulating the effect of design changes to the e-coating thickness and current density, thereby delivering results within a time frame of a few days.

• 한국표면공학회지
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• 제36권2호
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• pp.155-160
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• 2003

The effect of the temperature, current density and deposit time on hard chromium deposition in trivalent chromium bath was investigated. Cathode current efficiency increased with increasing current density. Increasing bath temperature from $20^{\circ}C$ to $50^{\circ}C$, chromium deposits were produced in higher current density and the maximum current efficiency was increased. At the plating conditions of $40^{\circ}C$, $30A/dm\m^2$, the deposition thickness increased in proportion to increasing electrolysis time The rate is$ 90\mu\textrm{m}$/hrs. for 2 hours. Microhardness of chromium deposits increased with increasing bath temperature and decreasing current density, and it was constant with electrolysis time. All of bath conditions, microstructure of chromium deposits has nodular structure with some cracking pattern and nodule size increased with increasing deposit thickness.

• 한국지반신소재학회논문집
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• 제16권2호
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• pp.109-119
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• 2017

본 연구에서는 낙동강 하구 델타지역에 위치한 연구지역의 상부퇴적사질토층이 샌드매트와 같은 수평배수재로서의 통수능 기능을 수행할 수 있는지를 검토하였다. 상부퇴적사질토에 대한 입도분포분석 및 투수시험 결과 일부 기준을 만족시키지 못하는 것으로 나타나 수치해석연구가 추가로 수행되었다. 델타지역 연약지반위에 샌드매트 1m 포설할 때와 연약지반위에 퇴적사질토층이 1, 2, 3, 4m 두께로 형성된 경우에 대한 압밀해석을 실시하였다. 그 결과 두께가 2m 이상이 되면 델타지역 퇴적사질토층은 샌드매트처럼 수평배수층으로 기능을 수행할 수 있는 것으로 나타났다. PVD를 설치한 경우 퇴적사질토층의 수평배수층 역할이 더욱 증가되었다. 본 연구를 통해 낙동강 델타 지역의 상부퇴적사질토층의 수평배수재로서의 기능이 확인되었다.

• 비파괴검사학회지
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• 제32권5호
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• pp.545-550
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• 2012

원자력발전소 증기발생기 세관은 방사성물질이 외부로 누출되지 않도록 압력경계 역할을 하는 주요부품이다. 설비 운전기간이 증가함에 따라 이차측에서 유입된 슬러지가 증기발생기 2차측 유체 흐름을 따라 상부로 이동하면서 유체비등과 난류에 의해 세관 외면에 스케일이 부착되어 세관열화, 유로홈 막힘 및 열전달을 감소시키는 파울링을 유발하는 원인으로 작용한다. 따라서, 원전 운영자는 세관 외면에 쌓인 스케일의 두께를 확인하여 일정시점이 되면 화학세정 등의 정비를 수행한다. 본 논문에서는 보빈코일 와전류신호를 이용하여 세관 외면에 부착된 스케일 두께를 정량적으로 평가하는 기술을 개발하고자 스케일 시험편을 제작하여 스케일 두께와 와전류신호 진폭 간의 상관관계를 분석하였고, 이를 바탕으로 스케일의 두께를 정량적으로 평가하는 기법과 대량의 와전류 데이터를 평가할 수 있는 프로그램을 개발하였다.

• 한국해양학회지:바다
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• 제7권1호
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• pp.32-42
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• 2002

한국 서해 천수만 조간대 퇴적체는 약 20m 두께에 달하며, 지난 빙하기동안 노출되어 형성된 부정합면을 경계로 상위의 현세 조간대 퇴적층(Unit M1)과 하위의 후기 플라이스토세 간월도층(Unit M2)으로 구성된다. 퇴적단위 M1은 간월도층을 하부층으로하는 부정합면 위로 니질의 상부 조간대층과 사니질 또는 니사질의 혼합 조간대층이 순차적으로 발달하는 상향조립화의 해침층서를 갖는다. 퇴적단위 M2 퇴적층은 그 두께가 약 14 m에 이르며, 퇴적후 노출에 의한 풍화의 정도에 따라 상부 산화대층과 하부의 비산화대층으로 구분된다. 전반적으로 퇴적물은 니질 또는 사니질 입자로 구성되며, 조수 리듬 퇴적구조, 플라저층리, 엽층리, 게 구멍 화석, 천해성 와편모조류 등과 같은 조수퇴적 기원의 증거들을 함유하고 있다. 이러한 결과들은 퇴적단위 M2의 간월도 퇴적층이 상대적으로 해수면이 높았던 선현세 간빙기 동안 퇴적된 조간대 퇴적층임을 지시한다. 한편, 퇴적단위 M2의 상부 3${\sim}$4 m는 퇴적 후 초기현세까지 계속되는 저해수면 동안 대기중에 노출되어 풍화 및 산화작용으로 인하여 퇴적물의 특성이 변질된 층으로 해석되며, 이는 서해 연안 퇴적층에서 현세와 선현세를 구분해주는 뚜렷한 층서적 건층으로 제시된다.