• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.43-50
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• 2014

By the trends of electronic package to be smaller, thinner and more integrative, the reliability of interconnection between Si chip and printed circuit board is required. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with different the thicknesses of electroless Ni-P deposit. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. The high speed shear energy of SAC405 solder joint with $1{\mu}m$ Ni-P deposit was found to be lower without $HNO_3$ vapor, compared to those of over $3{\mu}m$ Ni-P deposit. This could be due to the edge of solder resist in $1{\mu}m$ Ni-P deposit, which provides a fracture location for the weakened shear energy of solder joints and brittle fracture in high speed shear test. With $HNO_3$ vapor, the brittle fracture mode in high speed shear test decreased with increasing the thickness of Ni-P deposit. Then the roughness (Ra) of Ni-P deposits decreased with increasing its thickness. Thus, this gives the evidence that the decrease in roughness of Ni-P deposit for Eelectroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface play a critical role for improving the robustness of SAC405 solder joint.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.301-313
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• 1996

The texture of vapor deposits(PVD and CVD) changes from the orientation that places the lowest energy lattice plane parallel to the substrate under the condition of low atom or ion concentration adjacent to the deposit, to the orientation that places the higher energy crystal planes parallel to the substrate as the atom or ion concentration adjacent to the deposit increases. However, in the early stage of deposition, the deposit-substrate interface energy and the surface energy constitute the most important energies of the system. Therefore, if the lattice match is established between the substrate and the deposit without generating much strain energy, the epitaxial growth takes place to reduce the interfacial energy. When the epitaxial growth does not take place, the surface energy is dominant in the early stage of deposition and the lowest energy crystal plane tends to be placed parallel to the substrate up to a critial thickness. The thickness depends on the deposition condition. If the deposition condition does not favor placing the lowest energy crystal plane parallel to the substrate, the initial texture will change to that compatible with the deposition condition as the film thickness increases, and the texture turnover thickness will be short. The microstructure and surface topography of deposits are related to their texture.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• Korean Chemical Engineering Research
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• v.54 no.1
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Corrosion Science and Technology
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• v.15 no.2
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• pp.78-83
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• 2016

The e-coating to inhibit induced corrosion can deposit a coating not only on the exterior surface but also on the inside of whole metallic components of body-in-white (BIW). But it is difficult to deposit paint films on the inside area because metallic components are multi layered. It may cause shortness of e-coating thickness. The only way to properly verify e-coating thickness is by performing the use of tear-down prototypes. When paint films' thickness is inadequate, a structural modification on each metallic component is needed. Verification of the thickness improvement for a structural modification requires much manual effort and leads to increasing development time. Recently, the simulation technology has been developed to predict the e-coating thickness in e-coating field. By applying the simulation to BIW, improvement in paint thickness quality and shortening of development period are expected. The paper explains a validated solution that allows simulating the effect of design changes to the e-coating thickness and current density, thereby delivering results within a time frame of a few days.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.155-160
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• 2003

The effect of the temperature, current density and deposit time on hard chromium deposition in trivalent chromium bath was investigated. Cathode current efficiency increased with increasing current density. Increasing bath temperature from $20^{\circ}C$ to $50^{\circ}C$, chromium deposits were produced in higher current density and the maximum current efficiency was increased. At the plating conditions of $40^{\circ}C$, $30A/dm\m^2$, the deposition thickness increased in proportion to increasing electrolysis time The rate is$ 90\mu\textrm{m}$/hrs. for 2 hours. Microhardness of chromium deposits increased with increasing bath temperature and decreasing current density, and it was constant with electrolysis time. All of bath conditions, microstructure of chromium deposits has nodular structure with some cracking pattern and nodule size increased with increasing deposit thickness.

• Journal of the Korean Geosynthetics Society
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• v.16 no.2
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• pp.109-119
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• 2017

In this research, it was investigated that whether the upper sand deposited in Nakdong River Estuary Delta region has the role of horizontal drains like sand mat. The results from tests for particle size distribution and permeability of the upper sand deposit did not meet completely the criteria for the horizontal drain material. Thus, numerical analysis has been conducted additionally. Numerical analyses of consolidation of soft soils with upper layer of sand deposit are conducted in both the sand mat with a thickness of 1m and the upper sand deposit with 1, 2, 3, and 4 m of thickness and their results are compared. As the results of numerical analysis, the upper sand deposit with a thickness of 2m or more may play the role of horizontal drains similar to a sand mat. If a PVD is installed, the ability of upper sand deposit as horizontal drains is increased. Form this study, it was concluded that the upper sand deposited in Nakdong River Estuary Delta has the role of horizontal drain.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.5
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• pp.545-550
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• 2012

Steam generator is one of the major components of nuclear power plant and steam generator tubes are the pressure boundary between primary and secondary side, which makes them critical for nuclear safety. As the operating time of nuclear power plant increases, not only damage mechanisms but also scaled deposits on steam generator tubes are known to be problematic causing tube support flow hole blockage and heat fouling. The ability to assess the extent and location of scaled deposits on tubes became essential for management and maintenance of steam generator and eddy current bobbin data can be utilized to measure thickness of scale on tubes. In this paper, tube reference standards with various thickness of scaled deposit has been set up to provide information about the overall deposit condition of steam generator tubes, providing essential tool for steam generator management and maintenance to predict and prevent future damages. Also, methodology to automatically measure scale thickness on tubes has been developed and applied to field data to estimate overall scale amount.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.7 no.1
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• pp.32-42
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• 2002

The late Quaternary deposit of Cheonsu Bay, up to 20 m in thickness above the Jurassic granite basement, consists of two sedimentary units: an upper Holocene mud and sandy mud deposit (Unit M1), and a lower late Pleistocene sand and mud deposit (Unit M2; 'Kanweoldo Deposit&apos). Unit M1 is a typical Holocene tidal-flat deposit of Cheonsu Bay, showing a coarsening upward, retrogradational facies trend. This retrograding facies trend is probably due to a relative low sedimentation rate during Holocene transgression. Overlain unconformably by Unit M1, Unit M2 deposit reaches up to 14 m in thickness and is mainly composed of muddy sediment with yellow to gray color. This unit is characterized by a variety of tide-influenced signatures such as rhythmic bedding, flaser bedding, crab burrow fossil, marine dinoflagellate assemblage and authigenic glauconite mineral, indicating very similar depositional environment to those of Unit M1 deposit. It suggests that Unit M2 was probably accumulated under the tidal-flat environment during a pre-Holocene sea-level highstand. In particular, the uppermost 3-4 m of Unit M2 appears to have undergone subaerial exposure and subsequent weathering during the sea-level lowstand after deposition. Therefore, stratigraphic unconformity between Holocene and late Pleistocene sediments is highlighted by the desiccated and weathered surface of Unit M2.