• 대한기계학회논문집A
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• 제33권2호
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• pp.162-168
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• 2009

In this study, disk type of thermal barrier coating system for gas turbine blade was isothermally aged in the furnace changing exposure time and temperature. The aging conditions that delamination occurs were determined by the extensive microscopic analyses and bond tests for each aging condition. The delamination map was drawn from the time-temperature matrix form which summarize the delamination conditions. Finally, a method to draw the delamination life diagram of a thermal barrier coating system by using the delamination map was suggested.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.216-221
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• 2008

In this study, disk type of thermal barrier coating system for gas turbine blade was isothermally aged in the furnace changing exposure time and temperature. The aging conditions that determination occurs were determined by the extensive microscopic analyses and bond tests for each aging condition. The delamination map was drawn from the time-temperature matrix form which summarize the delamination conditions. Finally, a method to draw the delamination life diagram of a thermal barrier coating system by using the delamination map was suggested

• 비파괴검사학회지
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• 제36권5호
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• pp.353-362
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• 2016

가스터빈 블레이드는 고온 고압의 환경 아래 장시간 가동하기 위하여 초합금 모재에 세라믹 코팅으로 이루어진 열차폐코팅(thermal barrier coating, TBC)은 필수요소이다. 하지만 TBC 또한 가스터빈 가동 중 일정 열화온도 및 가동시간에서 top coat의 박리현상이 일어난다. TBC의 박리는 블레이드의 손상과 직결되므로 가스 터빈의 안정적인 가동을 위해서 TBC의 박리 평가가 선행되어야 한다. 기존 비파괴평가 기법 연구는 산화알루미늄층(thermally grown oxide, TGO)의 생성 유무 또는 완전 박리의 정성적 평가가 이루어져 왔다. 본 연구에서는 TBC 박리를 정량적으로 평가하기 위해 초음파검사의 C-scan기법을 이용한 TBC의 부분박리손상 map을 구현하였다. 시편들은 $1,100^{\circ}C$로 등온열화하여 각각 열화시간을 변화시킨 시편들을 사용하였다. 단일 탐촉자를 이용한 펄스-에코법으로 C-scan을 수행하였고 TBC 내 부분박리를 검출하기 위해 초음파를 수침법으로 시편에 수직 탐상하였다. 그리고 Rogers-Van Buren과 Kim의 이론 반사식을 이용하여 부분박리영역 지름이 1 mm부터 6 mm까지 부분박리지수를 도출했다. 이를 적용하여 각 부분박리지수에 따른 부분박리 손상 map을 영상화하였다. TBC는 열화시간이 증가할수록 부분박리지수에 관계없이 부분박리영역이 모두 증가함을 확인할 수 있었다. 또한 단일 시편 내에서 부분박리지수가 증가할수록 부분박리영역이 감소하는 것을 확인하였다. 부분박리손상 map의 부분박리영역에 따른 분포를 이용하여 TBC의 완전박리 기준과 잔여 수명을 또한 도출할 수 있었다.

• 한국공작기계학회논문집
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• 제12권2호
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• pp.65-70
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• 2003

In this study, researchers developed the estimative algorithm for artificial defect in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages : Crack, Delamination and Normal. According to the results, we were confirmed that estimative algerian was provided the recognition rates of 75.7% (for Crack) and 83.4% (for Delamination) and 87.2 % (for Normal).

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2005년도 춘계학술대회 논문집
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• pp.91-96
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• 2005

In this study, researchers developed the estimative algorithm for artificial defects in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-Organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages: Crack, Delamination and Normal. According to the results, we were confirmed that estimative algorithm was provided the recognition rates of $75.7\%$ (for Crack) and $83_4\%$ (for Delamination) and $87.2\%$ (for Normal).

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.80-84
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• 2002

In this study, researchers developed the est algorithm for artificial defects in the semic packages and performed to it by pattern recogn technology. For this purpose, this algorithm was I that researcher made software with matlab. The so consists of some procedures including ultrasonic acquistion, equalization filtering, self-organizing backpropagation neural network. self-organizing ma backpropagation neural network are belong to metho neural networks. And the pattern recognition tech has applied to classify three kinds of detective pa semiconductor packages. that is, crack, delaminat normal. According to the results, it was found estimative algorithm was provided the recognition r 75.7%( for crack) and 83.4%( for delamination) 87.2 % ( for normal).

• Journal of Welding and Joining
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• 제6권4호
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• pp.44-53
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• 1988

The mechanical strengths of buried lamellar tears located near the weld toe in the welded tee joints were evaluated in terms of the loss of load carrying capacity as a function of tear area. In static loading, the load carrying capacity was significantly reduced when tear intercepted over 10% of the cross-sectional area of the welded joints. However, the welded joints containing buried tears still failed at stresses over the yield strength of the base metal in the through-thickness direction in spite of the presence of tears up to 20-25% of the area. Fatigue strength of welded joints containing tears markedly reduced with increasing tear areas. Lehigh lamellar tearing test used in this study to produce speicmens was described in detail. The load carrying cpapacity in static loading was influenced by the reduction of supporting area whereas that in fatigue loading was influenced by the stress-concentration effects of lamellar tears and the reduction of supporting area. In bend tests, the pre-existing lamellar tears always grew up toward the weld toe. However, in fatigue loading, cracks grew up and down simultaneously form both the weld toe and the top of lamellar tears because of stress concentration. In fatigue loading, delaminations and decohesion of inclusion/matrix interface generated in multipass welds provided crack propagation paths and enhanced crack propagation because the tips of delaminations and deconhesios acted as stress raisers.

• 비파괴검사학회지
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• 제30권5호
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• pp.429-436
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• 2010

최근에는 T-ray(terahertz ray)를 이용한 비파괴기술이 새로운 분야로 주목을 받고 있다. 본 연구에서는 FRP 복합재료의 내재결함이나 레이업(lay-up) 특성을 검사 및 평가하기 위한 T-ray 시간영역 분광기(time-domain spectroscopy)를 활용하였으며 또한 이 T-ray 분광기의 일반적인 반사 및 투과모드를 이용하여 T-ray 이미지를 구현하였다. 특히, 2개의 톱날 인공결함이 내재한 GFRP 복합재의 평가방법을 제시하였다. CFRP 복합재료에 대해서는 T-ray 전파는 탄소섬유로 인해 진행 장해를 받는다. 이에 따라 T-ray의 전기장(E-field)의 방향과 탄소섬유 방향의 의존성을 분석하였다. 한편 인공결함인 알루미늄 테이프, 박리, 충격손상, 이물혼입 등을 T-ray를 이용하여 비파괴 검사 및 평가하였다. 이를 통해 FRP 복합재료의 T-ray비파괴평가의 적용 가능성 및 한계 등을 확인 할 수 있었다.