• Title/Summary/Keyword: Delamination Map

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Evaluation on the Delamination Life of Isothermally Aged Plasma Sprayed Thermal Barrier Coating (플라즈마 용사 열차폐 코팅의 박리수명 평가에 관한 연구)

  • Kim, Dae-Jin;Shin, In-Hwan;Koo, Jae-Mean;Seok, Chang-Sung;Kim, Moon-Young
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.33 no.2
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    • pp.162-168
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    • 2009
  • In this study, disk type of thermal barrier coating system for gas turbine blade was isothermally aged in the furnace changing exposure time and temperature. The aging conditions that delamination occurs were determined by the extensive microscopic analyses and bond tests for each aging condition. The delamination map was drawn from the time-temperature matrix form which summarize the delamination conditions. Finally, a method to draw the delamination life diagram of a thermal barrier coating system by using the delamination map was suggested.

Evaluation on the Delamination Life of Isothermally Aged Plasma Sprayed Thermal Barrier Coating (플라즈마 용사 열차폐 코팅의 박리수명 평가에 관한 연구)

  • Kim, Dae-Jin;Shin, In-Hwan;Koo, Jae-Mean;Seok, Chang-Sung;Kim, Mun-Young
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.216-221
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    • 2008
  • In this study, disk type of thermal barrier coating system for gas turbine blade was isothermally aged in the furnace changing exposure time and temperature. The aging conditions that determination occurs were determined by the extensive microscopic analyses and bond tests for each aging condition. The delamination map was drawn from the time-temperature matrix form which summarize the delamination conditions. Finally, a method to draw the delamination life diagram of a thermal barrier coating system by using the delamination map was suggested

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Delamination Evaluation of Thermal Barrier Coating on Turbine Blade owing to Isothermal Degradation Using Ultrasonic C-scan Image (초음파 C-scan을 이용한 터빈 블레이드 열차폐코팅의 등온열화에 의한 박리 평가 기법)

  • Lee, Ho-Girl;Kim, Hak-Joon;Song, Sung-Jin;Seok, Chang-Sung
    • Journal of the Korean Society for Nondestructive Testing
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    • v.36 no.5
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    • pp.353-362
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    • 2016
  • Thermal barrier coating (TBC) is an essential element consisting of a super-alloy base and ceramic coating designed to achieve long operational time under a high temperature and pressure environment. However, the top coat of TBC can be delaminated at certain temperatures with long operation time. As the delamination of TBC is directly related to the blade damage, the coupling status of the TBC should be assured for reliable operation. Conventional studies of nondestructive evaluation have been made for detecting generation of thermally grown oxide (TGO) or qualitatively evaluating delamination in TBC. In this study, the ultrasonic C-scan method was developed to obtain the damage map inside TBC by estimating the delamination in a quantitative way. All specimens were isothermally degraded at $1,100^{\circ}C$ with different time, having different partial delamination area. To detect partial delamination in TBC, the C-scan was performed by a single transducer using pulse-echo method with normal incidence. Partial delamination coefficients of 1 mm to 6 mm were derived by the proportion of the surface reflection signal and flaw signal which were theoretical signals using Rogers-Van Buren and Kim's equations. Using the partial delamination coefficients, the partial delamination maps were obtained. Regardless of the partial delamination coefficient, partial delamination area was increased when degradation time was increased in TBC. In addition, a decrease in partial delamination area in each TBC specimen was observed when the partial delamination coefficient was increased. From the portion of the partial delamination maps, the criterion for delamination was derived.

The Development of Pattern Classification for Inner Defects in Semiconductor Packages by Self-Organizing Map (자기조직화 지도를 이용한 반도체 패키지 내부결함의 패턴분류 알고리즘 개발)

  • 김재열;윤성운;김훈조;김창현;양동조;송경석
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.12 no.2
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    • pp.65-70
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    • 2003
  • In this study, researchers developed the estimative algorithm for artificial defect in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages : Crack, Delamination and Normal. According to the results, we were confirmed that estimative algerian was provided the recognition rates of 75.7% (for Crack) and 83.4% (for Delamination) and 87.2 % (for Normal).

The Intelligence Algorithm of Semiconductor Package Evaluation by using Scanning Acoustic Tomograph (Scanning Acoustic Tomograph 방식을 이용한 지능형 반도체 평가 알고리즘)

  • Kim J. Y.;Kim C. H.;Song K. S.;Yang D. J.;Jhang J. H.
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2005.05a
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    • pp.91-96
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    • 2005
  • In this study, researchers developed the estimative algorithm for artificial defects in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-Organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages: Crack, Delamination and Normal. According to the results, we were confirmed that estimative algorithm was provided the recognition rates of $75.7\%$ (for Crack) and $83_4\%$ (for Delamination) and $87.2\%$ (for Normal).

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The Development of Pattern Classification for Inner Defects in Semiconductor packages by Self-Organizing map (자기조직화 지도를 이용한 반도체 패키지 내부결함의 패턴분류 알고리즘 개발)

  • 김재열;윤성운;김훈조;김창현;송경석;양동조
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.10a
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    • pp.80-84
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    • 2002
  • In this study, researchers developed the est algorithm for artificial defects in the semic packages and performed to it by pattern recogn technology. For this purpose, this algorithm was I that researcher made software with matlab. The so consists of some procedures including ultrasonic acquistion, equalization filtering, self-organizing backpropagation neural network. self-organizing ma backpropagation neural network are belong to metho neural networks. And the pattern recognition tech has applied to classify three kinds of detective pa semiconductor packages. that is, crack, delaminat normal. According to the results, it was found estimative algorithm was provided the recognition r 75.7%( for crack) and 83.4%( for delamination) 87.2 % ( for normal).

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Effects of the buried lamellar tears on the mechanical strength in the welded T joints (T형상용접 이음에서 매몰된 라멜라균열이 용접부의 기계적 강도에 미치는 영향)

  • 고진현
    • Journal of Welding and Joining
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    • v.6 no.4
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    • pp.44-53
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    • 1988
  • The mechanical strengths of buried lamellar tears located near the weld toe in the welded tee joints were evaluated in terms of the loss of load carrying capacity as a function of tear area. In static loading, the load carrying capacity was significantly reduced when tear intercepted over 10% of the cross-sectional area of the welded joints. However, the welded joints containing buried tears still failed at stresses over the yield strength of the base metal in the through-thickness direction in spite of the presence of tears up to 20-25% of the area. Fatigue strength of welded joints containing tears markedly reduced with increasing tear areas. Lehigh lamellar tearing test used in this study to produce speicmens was described in detail. The load carrying cpapacity in static loading was influenced by the reduction of supporting area whereas that in fatigue loading was influenced by the stress-concentration effects of lamellar tears and the reduction of supporting area. In bend tests, the pre-existing lamellar tears always grew up toward the weld toe. However, in fatigue loading, cracks grew up and down simultaneously form both the weld toe and the top of lamellar tears because of stress concentration. In fatigue loading, delaminations and decohesion of inclusion/matrix interface generated in multipass welds provided crack propagation paths and enhanced crack propagation because the tips of delaminations and deconhesios acted as stress raisers.

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Evaluation and Application of T-Ray Nondestructive Characterization of FRP Composite Materials (FRP 복합재료의 T-Ray 비파괴특성 평가 및 적용)

  • Im, Kwang-Hee;Hsu, David K.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.5
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    • pp.429-436
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    • 2010
  • Recently, (terahertz ray) applications have emerged as one of the most promising new powerful nondestructive evaluation (NDE) techniques. In this study, a new T-ray time-domain spectroscopy system was utilized for detecting and evaluating layup effect and flaw in FRP composite laminates. Extensive experimental measurements in reflection and thru-transmission modes were made to map out the T-ray images. Especially this was demonstrated in thick GFRP laminates containing double saw slots. In carbon composites the penetration of terahertz waves is limited to some degree and the detection of flaws is strongly affected by the angle between the electric field(E-field) vector of the terahertz waves and the intervening fiber directions. The artificial defects investigated by terahertz waves were bonded foreign material, simulated disbond and delamination and mechanical impact damage. The effectiveness and limitations of terahertz radiation for the NDE of composites are discussed.