• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.80-84
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• 2000

A mesh superposition technique is presented for an efficient analysis of structural behavior. Refined child mesh is superimposed over parent elements for the region of interest. It is a kind of adaptive mesh refinement, which allows locally refined mesh without introducing transition region or multipoint constraints. Proper boundary condition is necessary to avoid redundant rigid body motion and kinematic compatibility between neighbor elements. Delamination buckling analysis is conducted to demonstrate accuracy and efficiency of the present method.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.8
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• pp.1277-1286
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• 2001

Aluminum 5052/Aramid Fiber Reinforced Plastic(Al5052/AFRP) laminates are applied to the fuselage-wing intersection. The Al5052/AFRP laminates suffer from the cyclic bending moment of variable amplitude during the service. Therefore, the influence of cyclic bending moment on the delamination and the fatigue crack propagation behavior in Al5052/AFRP laminate was investigated in this study. Al5052/AFRP laminate composite consists of three thin sheets of Al5052 and two layers of unidirectional aramid fibers. The cyclic bending moment fatigue tests were performed with five different levels of bending moment. The shape and size of the delamination zone formed along the fatigue crack between Al5052 sheet and aramid fiber-adhesive layer were measured by an ultrasonic C-scan. The relationships between da/dN and ΔK, between the cyclic bending moment and the delamination zone size, and between the fiber bridging mechanism and the delamination zone were studied. Fiber failures were not observed in the delamination zone in this study. It represents that the fiber bridging modification factor should turn out to increase and that the fatigue crack growth rate should decrease. The shape of delamination zone turns out to be semi-elliptic with the contour decreased non-linearly toward the crack tip.

• Progress in Superconductivity and Cryogenics
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• v.17 no.3
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• pp.13-17
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• 2015

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with delamination problem of multi-layered CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal cycling. The CC tape might also experience cyclic loading due to the energizing scheme (on - off) during operation. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in REBCO CC tapes becomes critical. In this study, transverse tensile tests were conducted under different loading conditions using different size of upper anvils on the GdBCO CC tapes. The mechanical and electromechanical delamination strength behaviors of the CC tapes under transverse tensile loading were examined and a two-parameter Weibull distribution analysis was conducted in statistical aspects. As a result, the CC tape showed similar range of mechanical delamination strength regardless of cross-head speed adopted. On the other hand, cyclic loading might have affected the CC tape in both upper anvil sizes adopted.

• Structural Engineering and Mechanics
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• v.30 no.6
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• pp.699-712
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• 2008

The effectiveness of wavelet transform in detecting delamination damages in multilayered composite beams and plates is studied here. The damaged composite beams and plates are modeled in finite element software ABAQUS and the first few mode shapes are obtained. The mode shapes of the damaged structures are then wavelet transformed. It is observed that the distribution of wavelet coefficients can identify the damage location of beams and plates by showing higher values of wavelet coefficients at the position of damage. The effectiveness of the method is studied for different boundary conditions, damage location and size for single as well as multiple delaminations in composite beams and plates. It is observed that both discrete wavelet transform (DWT) and continuous wavelet transform (CWT) can detect the presence and location of the damaged region from the mode shapes of the structures. DWT may be used to approximately evaluate the size of the delamination area, whereas, CWT is efficient to detect smaller delamination areas in composites.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.85-88
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• 2002

We have implemented a system of falling weight impact tester. Absorbed energy of orthotropic composites with using T300 fiber, which are composed of the same fiber and stacking number is higher than that of quasi-isotropic specimen over impact energy 7J, but in case of using T700 fiber, much difference does not show. Also, absorbed energy of orthotropic composites with using T300 fiber, which are composed of stacking number and orientation became more than that of T700 fiber specimen; however great change doesn't show in case of quasi-isotropic specimens. Delamination area of impacted specimens was measured with ultrasonic C-scanner to find correlation between impact energy and delamination area. Delamination area and frequency responses was evaluated between impacted and unimpacted specimens. There is a strong correlation between frequency responses and impact-induced delamination. The presence and scale of damages have been investigated based on the variations of frequency responses.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.69-74
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• 2001

Steel plate or fiber composite plate are mainly used in externally bonding method. Shear strengthening by externally bonding method is to confirm shear safety and to avoid brittle failure. In case of strengthening by externally bonding method, a failure of structure occurs frequently due to delamination between strengthening plate and concrete. Therefore, it is important to consider the delamination in the strengthening design. The objective of this study is to propose a modified shear strength evaluation by considering the delamination. The delamination criteria of strengthening plate is established by the ultimate strain and shear stress. And shear strength of RC beams is proposed in terms of the delamination criteria. The proposed shear strength is compared with test results and verified through the comparison.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.64-66
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• 2005

In order to evaluate impact characteristics for the laminates with or without delaminations, carbon fiber/epoxy laminated composite were fabricated. After trying several ways to develop delaminations within the laminates, an insertion of teflon-tape was found to be most effective. The locations for delamination was determined after several trial-and-error experiments. The low impact energy did not produce measurable difference for composites with or without delamination, which indicated the presence of impact energy threshold. The impact chacteristics for composites with the delamination were found to be different from those for composites with other type of defect including fiber failures.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.7
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• pp.315-318
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• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.4 s.97
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• pp.395-403
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• 2005

The dynamic characteristics of delaminated smart composite laminates are studied using animproved layerwise laminate theory. The theory is capable of capturing interlaminar shear stresses that are critical to delamination. The presence of discrete delamination is modeled through the use of Heaviside unit step functions. Stress free boundary conditions are enforced at all free surfaces. Continuity in displacement field and transverse shear stresses are enforced at each ply level. In modeling piezoelectric composite plates, a coupled piezoelectric-mechanical formulation is used in the development of the constitutive equations. Numerical analysis is conducted to investigate the effect of nonlinearity in the transient vibration of bimodular behavior caused by the contact impact of delaminated interfaces. Composite plates with delamination, subject to external loads and voltage history from surface bonded sensors, are investigated and the results are compared with corresponding experimental results and plates without delamination.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.