• Title/Summary/Keyword: Degree of Cure

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A multi Step Cure Process to Prevent Residual Bubbles in LED Encapsulation Silicone Resin (LED Encapsulation 실리콘의 기포잔류방지를 위한 Step 경화공정 연구)

  • Song, M.J.;Kim, H.K.;Yoon, G.S.;Kim, K.H.
    • Transactions of Materials Processing
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    • v.21 no.2
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    • pp.101-106
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    • 2012
  • Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

Prediction of Temperature and Degree of Cure of Carbon Fiber Composites Considering Thermal Chemical Reaction (화학 반응열을 고려한 탄소 섬유 복합재 온도와 경화도 예측)

  • Jae-Woo Yu;Wie-Dae Kim
    • Composites Research
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    • v.36 no.5
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    • pp.315-320
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    • 2023
  • In the manufacturing process of thermosetting carbon fiber composite materials using an autoclave, the internal temperature changes according to the set temperature cycle. This temperature change causes the resin in the composite material to cure. Heat is generated through the chemical reaction of the resin, which can result in a difference between the temperature inside the autoclave and the temperature of the composite material. Previous research assumed that the temperatures of the composite material and the autoclave were the same and analyzed to predict the residual stress and thermal deformation after manufacturing. However, these stresses and deformations depend on the temperature and degree of cure of the composite material. Therefore, this study verifies a thermal-chemical model analysis technique that takes into account the heat generated by the chemical reaction of the resin to accurately calculate the temperature and degree of cure. Additionally, case studies were conducted for different thicknesses to investigate whether this model exhibits similar trends across varying thicknesses.

A STUDY ON THE CHANGES IN DEGREE OF CONVERSION OF DUAL-CURE RESTORATIVE MATERIALS WITH TIME-ELAPSE (이중중합 수복재의 시간경과에 따른 중합도 변화)

  • Yang, Chul-Ho;Kim, Shin;Jeong, Tae-Sung
    • Journal of the korean academy of Pediatric Dentistry
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    • v.26 no.3
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    • pp.554-563
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    • 1999
  • For the purpose of elucidating the polymerization modes of dual-cure restorative materials and comparing them with single-cure restorative materials, a study was performed on the light-cured composite resin, dual-cure composite resin, dual-cure glass ionomer cement and chemical-cure glass ionomer cement. By measuring the microhardness of each material at 0mm, 1mm and 3mm depth during initial 24 hours with predetermined interval, the state of polymerization and degree of conversion was indirectly evaluated for each material, and obtained results are as follows : 1. All of four materials tested showed significant increase in microhardness after 24hrs compared with just after curing starts. 2. In all materials except Ketac-fil, there showed a significant difference in microhardness between each depth at each time interval. 3. In the test of lap time till final curing for each material, the polymerization process was revealed to last longer in the dual-cure type materials than in single-cure type materials at 3mm depth. Based on the results above, it was demonstrated with materials of dual-cure mode that the degree of conversion increases by successive curing reactions even in the deeper layers where sufficient curing light is impermeable.

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Study of Cure Kinetics of Vacuum Bag Only Prepreg Using Differential Scanning Calorimetry (시차주사열량계를 이용한 진공백 성형 프리프레그의 경화 거동 연구)

  • Hyun, Dong Keun;Lee, Byoung Eon;Shin, Do Hoon;Kim, Ji Hoon
    • Composites Research
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    • v.33 no.2
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    • pp.44-49
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    • 2020
  • The cure kinetics of carbon fiber-reinforced prepreg for Vacuum Bag Only(VBO) process was studied by differential scanning calorimetry (DSC). The total heat of reaction (ΔHtotal = 537.1 J/g) was defined by the dynamic scanning test using prepregs and isothermal scanning tests were performed at 130℃~180℃. The test results of isothermal scanning were observed that the heat of reaction was increased as the temperature elevated. The Kratz model was applied to analyze the cure kinetics of resin based on the test results. To verify the simulation model, the degree of cure from panels using different cure cycles were compared with the measurement. The simulation model showed that the error against the experimental value was less than 3.4%.

A STUDY ON THE DEGREE OF CONVERSION OF LIGHT CURING COMPOSITE RESIN ACCORDING TO THE DEPTH OF CURE AND LIGHT CURING TIME (수종 광중합 복합 레진의 중합 깊이와 광조사 시간에 따른 중합률에 관한 연구)

  • Kim, Kyung-Hyun;Kwon, Oh-Sung;Kim, Hyun-Gee;Baek, Kyu-Chul;Um, Chung-Moon;Kwon, Hyuk-Choon
    • Restorative Dentistry and Endodontics
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    • v.22 no.1
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    • pp.35-60
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    • 1997
  • Physical properties of composite resins such as strength, resistance to wear, discoloration, etc, depend on the degree of conversion of the resin components. The clinical behavior of restorative resins varies brand to brand. Part of this variation is associated with the filler and differences in the polymer matrix. The polymer matrix of resins may differ because the involved monomers are dissimilar and because of variation in the catalyst system. The purpose of this study was to evaluate the degree of conversion of the composite resins according to the depth of cure and light curing time. 7mm diameter cylindrical aluminum molds were filled with each of five different hybrid light curing composite resins(Z-100, Charisma, Herculite XRV, Prisma TPH, Veridonfil) on the thin resin films. The molds were 1mm, 2mm, 3mm, 4mm, and 5mm in depth to produce resin films of various heights. Each sample was given 20sec, 40sec, and 60sec illumination with a light source. The degree of conversion of carbon double bonds to single bonds in the resin films was examined by means of Fourier Transform Infrared Spectrometer. The results were obtained as follows; 1. There was difference in the degree of conversion among five light curing composite resins according to the depth of cure for 20sec, 40sec, and 60sec illumination with light source with statistical significance(P<0.05). 2. Five light curing composite resins show lower degree of conversion at surface of the resin than depth of 1mm. 3. The degree of conversion of five light curing composite resins was siginificantly reduced from the maximum for the resin film when the light passed through as little as 1mm of each composite. 4. The degree of conversion of five light curing composite resins decrease significantly at the depth of 4mm, and polymerization was not occured at the depth of 5mm except for Prisma TPH. 5. The degree of conversion of five light curing composite resins was increased with increased light curing time, and there was no significant differences in the degree of conversion above 4mm in Z-100, 3mm in Charisma, and at depth of 5mm in Herculite XRV and Veridonfil(P>0.05).

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Cure Behavior of a DGEBF Epoxy using Asymmetric Cycloaliphatic Amine Curing Agent (비대칭 고리형 지방족 아민 경화제를 이용한 DGEBF 계열 에폭시의 경화 거동)

  • Kim, Hongkyeong
    • Korean Chemical Engineering Research
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    • v.46 no.1
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    • pp.200-204
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    • 2008
  • The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

Cure Shrinkage Characteristics of Resin Formulations by Thermomechanical Analysis (열기계적 분석법으로 측정된 레진 포뮬레이션의 경화 수축 특성)

  • Seo, Ahn Na;Lee, Jong-Hyun
    • Korean Journal of Metals and Materials
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    • v.50 no.9
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    • pp.629-636
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    • 2012
  • Volume shrinkage behavior accompanying the cure of resin formulations might be a critical factor when assembly processes using polymer materials are considered. In this study, cure shrinkage behavior with respect to resin formulation type and heating method was measured on sandwich structure samples by a thermomechanical analyzer (TMA). Quartz, used as a cover material for the sandwich structure, indicated the coefficient of thermal expansion close to $0ppm/^{\circ}C$. When a dynamic heating mode was conducted, a squeeze-out region and a cross-linking region for each resin formulation could be separated clearly with overlapping differential scanning calorimeter results on the TMA results. In addition, a cure shrinkage dominant region and a thermal expansion dominant region in the cross-linking region were distinguished. Consequently, the degree of cure at the initiation of the thermal expansion dominant region was successfully measured. Measurement of all resin formulations indicated the thermal expansion behavior exceeded cure shrinkage before full cure.

Finite Element Analysis of Residual Stress Evolution during Cure Process of Silicone Resin for High-power LED Encapsulant (고출력 LED 인캡슐런트용 실리콘 레진의 경화공정중 잔류응력 발달에 대한 유한요소해석)

  • Song, Min-Jae;Kim, Heung-Kyu;Kang, Jeong-Jin;Kim, Kwon-Hee
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.2
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    • pp.219-225
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    • 2011
  • Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

Studies on Cure Behaviors, Dielectric Characteristics and Mechanical Properties of DGEBA/Poly(ethylene terephthalate) Blends

  • Park, Soo-Jin
    • Macromolecular Research
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    • v.17 no.8
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    • pp.585-590
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    • 2009
  • The cure behaviors, dielectric characteristics and fracture toughness of diglycidylether of bisphenol-A (DGEBA)/poly(ethylene terephthalate) (PET) blend system were investigated. The degree of conversion for the DGEBA/PET blend system was measured using Fourier transform infrared (FTIR) spectroscopy. The cure kinetics were investigated by measuring the cure activation energies ($E_a$) with dynamic differential scanning calorimetry (DSC). The dielectric characteristic was examined by dielectric analysis (DEA). The mechanical properties were investigated by measuring the critical stress intensity factor ($K_{IC}$), critical strain energy release rate ($G_{IC}$), and impact strength test. As a result, DGEBAIPET was successfully blended. The Ea of the blend system was increased with increasing PET content to a maximum at 10 phr PET. The dielectric constant was decreased with increasing PET content. The mechanical properties of the blend system were also superior to those of the neat DGEBA. These results were attributed to the increased cross-linking density of the blend system, resulting from the interaction between the epoxy group of DGEBA and the carboxyl group of PET.

Curing Induced Residual Stresses in Laminated Cylindrical Shells

  • Lee, Soo-Yong
    • Journal of Mechanical Science and Technology
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    • v.14 no.1
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    • pp.19-29
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    • 2000
  • A viscoelastic finite element analysis is presented to investigate residual stresses occurred in a laminated cylindrical shell during cure. An incremental viscoelastic constitutive equation that can describe stress relaxation during the cure is derived as a recursive formula which can be used conveniently for a numerical analysis. The finite element analysis program is developed on the basis of a 3-D degenerated shell element and the first order shear deformation theory, and is verified by comparing with an one dimensional exact solution. Viscoelastic effect on the residual stresses in the laminated shell during the cure is investigated by performing both the viscoelastic and linear elastic analyses considering thermal deformation and chemical shrinkage simultaneously. The results show that there is big difference between viscoelastic stresses and linear elastic stresses. The effect of cooling rates and cooling paths on the residual stresses is also examined.

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