• Title/Summary/Keyword: Defects Pattern

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A New Inspection Method of PDP Electrode Pattern Defects

  • Kim, Taehong;Sunkyu Yang;Tak Eun;Park, Sehwa;Ilhong Suh
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.457-457
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    • 2000
  • The display module of PDP consists of a pair of fine electrode patterned panels. For example, in case of 42" PDP, thousands of electrode patterns should be placed on panel, where length, width, and height of each pattern m one meter, 50${\mu}{\textrm}{m}$, and 30${\mu}{\textrm}{m}$ respectively. And pitch between patterns is around 200${\mu}{\textrm}{m}$. Electrode patterns are frequently damaged during the production process, and thus might be broken. These breakage will result in open-circuited electrical characteristic of a pattern and/or open-circuited electrical characteristic between patterns. Therefore, inspection of pattern defects is the inevitable process to improve production yield rate of the panel. In this paper, we first review several types of PDP pattern defects which affects yield-rate of PDP. And, problems of inspecting such pattern defects by a typical inspection method is addressed. Then, a novel inspection method is proposed to overcome the difficulties, where some new components and the algorithm to detect the electrode defects are explored.ored.

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Development and Characterization of Pattern Recognition Algorithm for Defects in Semiconductor Packages

  • Kim, Jae-Yeol;Yoon, Sung-Un;Kim, Chang-Hyun
    • International Journal of Precision Engineering and Manufacturing
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    • v.5 no.3
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    • pp.11-18
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    • 2004
  • In this paper, the classification of artificial defects in semiconductor packages is studied by using pattern recognition technology. For this purpose, the pattern recognition algorithm includes the user made MATLAB code. And preprocess is made of the image process and self-organizing map, which is the input of the back-propagation neural network and the dimensionality reduction method, The image process steps are data acquisition, equalization, binary and edge detection. Image process and self-organizing map are compared to the preprocess method. Also the pattern recognition technology is applied to classify two kinds of defects in semiconductor packages: cracks and delaminations.

Classification of Welding Defects in Austenitic Stainless Steel by Neural Pattern Recognition of Ultrasonic Signal (초음파신호의 신경망 형상인식법을 이용한 오스테나이트 스테인레스강의 용접부결함 분류에 관한 연구)

  • Lee, Gang-Yong;Kim, Jun-Seop
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.4
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    • pp.1309-1319
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    • 1996
  • The research for the classification of the natural defects in welding zone is performd using the neuro-pattern recognition technology. The signal pattern recognition package including the user's defined function is developed to perform the digital signal processing, feature extraction, feature selection and classifier selection, The neural network classifier and the statistical classifiers such as the linear discriminant function classifier and the empirical Bayesian calssifier are compared and discussed. The neuro-pattern recognition technique is applied to the classificaiton of such natural defects as root crack, incomplete penetration, lack of fusion, slag inclusion, porosity, etc. If appropriately learned, the neural network classifier is concluded to be better than the statistical classifiers in the classification of the natural welding defects.

A Study on Weldability Estirmtion of Laser Welded Specimens by Vision Sensor (비전 센서를 이용한 레이져 용접물의 용접성 평가에 관한 연구)

  • 엄기원;이세헌;이정익
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.1101-1104
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    • 1995
  • Through welding fabrication, user can feel an surficaial and capable unsatisfaction because of welded defects, Generally speaking, these are called weld defects. For checking these defects effectively without time loss effectively, weldability estimation system setup isan urgent thing for detecting whole specimen quality. In this study, by laser vision camera, catching a rawdata on welded specimen profiles, treating vision processing with these data, qualititative defects are estimated from getting these information at first. At the same time, for detecting quantitative defects, whole specimen weldability estimation is pursued by multifeature pattern recognition, which is a kind of fuzzy pattern recognition. For user friendly, by weldability estimation results are shown each profiles, final reports and visual graphics method, user can easily determined weldability. By applying these system to welding fabrication, these technologies are contribution to on-line weldability estimation.

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Detection and Classification of Defect Signals from Rotator by AE Signal Pattern Recognition (AE 신호 형상 인식법에 의한 회전체의 신호 검출 및 분류 연구)

  • Kim, Ku-Young;Lee, Kang-Yong;Kim, Hee-Soo;Lee, Hyun
    • Journal of the Korean Society for Railway
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    • v.4 no.3
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    • pp.79-86
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    • 2001
  • The signal pattern recognition method by acoustic emission signal is applied to detect and classify the defects of a journal bearing in a power plant. AE signals of main defects such as overheating, wear and corrosion are obtained from a small scale model. To detect and classify the defects, AE signal pattern recognition program is developed. As the classification methods, the wavelet transformation analysis, the frequency domain analysis and time domain analysis are used. Among three analyses, the wavelet transformation analysis is most effective to detect and classify the defects of the journal bearing..

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A Study on Cause of Defects in NIL Molding Process using FEM (유한요소 해석을 이용한 나노임프린트 가압 공정에서 발생하는 결함 원인에 대한 연구)

  • Song, N.H.;Son, J.W.;Kim, D.E.;Oh, S.I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.10a
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    • pp.364-367
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    • 2007
  • In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

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Pattern Matching for Automatic Defects Detection of the Light Guide Panel (도광판의 자동 결함 검출을 위한 패턴 매칭)

  • Cho, Sang-Hee;Park, Young-Deok;Oh, Choon-Suk;Ryu, Young-Kee
    • Proceedings of the KIEE Conference
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    • 2004.11c
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    • pp.580-582
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    • 2004
  • As the demand of large and high-resolution display panels is increased, the black light units (BLU) of the display devices play an important roles. In this study we'll deal with various defects of BLUs. Patterns of defects can be classified by the scratches, the non-uniform misprinting for the diffused reflection, the surface stains, spots and etc. Due to these distorted patterns the high-resolution and high-precision could be impeded. We'll propose the visual inspection system to detect various defects by pattern-matching.

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Study of Shearography Imaging for Quantity Evaluation Defects in Woven CFRP Composite Materials (직조 CFRP 복합재료 내부결함의 정량적 평가를 위한 Shearography 영상처리 기법 연구)

  • 최상우;이준현;이정호;변준형
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.05a
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    • pp.211-214
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    • 2001
  • Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively. In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

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Application of Shearography for Nondestructive Evaluation of Internal Defects in CFRP (CFRP에 내재된 결함의 비파괴 평가를 위한 Shearography기법 적용)

  • 최상우;이준현
    • Proceedings of the Korean Reliability Society Conference
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    • 2002.06a
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    • pp.245-251
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    • 2002
  • Electronic Speckle Pattern Interferometry(ESPI) is one of optical technique to measure displacement precisely, uses CCD camera to show result image in real time. General ESPI system measures in-plane or out-of-plane displacement. Shearography is one of electronic speckle pattern interferometric methods which allow full-field observation of surface displacement derivatives and it is robust in vibration. The shearography provides non-contacting technique of evaluating defects nondestructively In this study, the shearography was used to evaluate defects in Carbon Fiber Reinforced Plastic(CFRP). Various sizes of artificial defects were embedded in various depths of woven CFRP plate. Effects due to the variation of size and depth of defects were evaluated in this study.

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A New Defect Inspection Method for TFT-LCD Panel using Pattern Comparison (패턴 비교를 통한 TFT-LCD 패널의 결함 검출 방법)

  • Lee, Kyong-Min;Jang, Moon-Soo;Park, Poo-Gyeon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.2
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    • pp.307-313
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    • 2008
  • In this paper, we propose a novel defects inspection algorithm for TFT-LCD panels. We first compensate the distorted image caused by the camera distortion and the uneven illumination environment using the least squares method and the bezier surface. We find a starting point of each pattern for restricting each pattern. A clean image is compared to each pattern to find defects using modified PCSR-G algorithm. The simulation example shows that our algorithm not only inspects the defects well, but also is robust to the 1-pixel error.