• 한국정보처리학회논문지
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• 제7권6호
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• pp.1973-1979
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• 2000

Driving the need for machine vision system is growing consumer demand for quality and defect-free products. Especially it is the most important in tarpaulin's manufacturing process achieves automatically by machine vision instead of by man vision. In this paper pinholes detection is performed by using morphology algorithms. Top hat transform is one of morphology applications. This transform take high performance of defect detection in the case that unexpected changes occur in some non-uniform background. For pinholes defect, automatic visual inspection system has been developed, which was composed by a line-scan camera, illumination, a frame grabber, a motor driver and control units. This system has excellent capacity to defect pinholes to the 0.1 mm by 0.5 mm in size and to work in moving objects by maximum 20 m/min in speed.

• 동력기계공학회지
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• 제15권4호
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• pp.37-41
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• 2011

This paper introduces the special eddy current sensor and its characteristic for bolt hole defect evaluation in gas turbine rotor. In the past, Fluorescent penetration inspection method was used for qualitative defect evaluation in gas turbine rotor bolt hole. This method can defect the bolt hole defect but can not evaluate the defect size. Nowadays, eddy current method is used quantitative defect evaluation due to advanced sensor design technology. And eddy current method is more time and cost saving than the old method. We developed bolt shape eddy current sensor for the rotor bolt hole defect detection and evaluation. The eddy current sensor moves to the bolt hole guided by screw nut and detects the defect on the bolt hole. The bolt hole mock-up and artificial defects were made and used for the signal detection & resolution analysis of eddy current sensor. The results show that signal detection capability is enough to detect 0.2 mm depth defect. And the resolution capability is enough to differentiate 02, 0.5, 1.0 and 2.0 mm depth defect.

• 대한임베디드공학회논문지
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• 제17권3호
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• pp.129-138
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• 2022

Collecting and labeling sufficient training data, which is essential to deep learning-based visual inspection, is difficult for manufacturers to perform because it is very expensive. This paper presents a steel plate surface defect detection system with industrial-grade detection performance by training a small amount of steel plate surface images consisting of labeled and non-labeled data. To overcome the problem of lack of training data, we propose two data augmentation techniques: program-based augmentation, which generates defect images in a geometric way, and generative model-based augmentation, which learns the distribution of labeled data. We also propose a 4-step semi-supervised learning using pseudo labels and consistency training with fixed-size augmentation in order to utilize unlabeled data for training. The proposed technique obtained about 99% defect detection performance for four defect types by using 100 real images including labeled and unlabeled data.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2015년도 추계학술발표대회
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• pp.1509-1511
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• 2015

Defect detection is one of the most challenging problems in industrial quality control. In this study we developed a vision-based defect detection system for wafer production. To achieve high-accuracy detection, Otsu method was improved so that it can handle both unimodal and bimodal distributions. After thresholding, detected defect regions in the wafer are classified and grouped into user-defined defect categories. The experimental result has proved the efficiency of our system.

• 제어로봇시스템학회논문지
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• 제10권6호
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• pp.487-493
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• 2004

In this Paper, we propose a lighting system for the stable detection of check defects of the CRT panel through the analysis of the lighting interaction between the lighting unit and the CRT panel. The check defect is very difficult to detect reliably because of its high sensitivity according to the direction of incident light. At first, we model the physical shape of check defects using SEM image. And then we apply physics based illumination model to investigate the optical characteristics of the check defect. Finally, we propose a lighting system for the stable detection of check defect. Experimental results show the feasibility of the proposed lighting system for check inspection.

• 한국공작기계학회논문집
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• 제15권2호
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• pp.87-92
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• 2006

This paper supplements shortcoming of radioactivity check by detecting defect of SWP weld zone using ultrasonic wave. Manufacture 2 stage robot detection systems that can follow weld bead of SWP by method to detect weld defects of SWP that shape of weld bead is complex for this as quantitative. Also, through signal processing ultrasonic wave defect signal system of GUI environment that can grasp easily existence availability of defect because do videotex compose. Ultrasonic wave signal of weld defects develops artificial intelligence style sightseeing system to enhance pattern recognition of weld defects and the classification rate using neural net. Classification of weld defects that do fan Planar defect and that do volume defect of by classify.

• 한국수자원학회논문집
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• 제55권spc1호
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• pp.1177-1185
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• 2022

상·하수도 시스템은 사람들에게 안전하고 깨끗한 물을 공급해주는 사회기반시설이며, 특히 상·하수도 관로는 지중에 매설되어 있기 때문에 시스템의 결함검출이 매우 어렵다. 이러한 이유로 상·하수도 관로의 진단은 관로 내부에 카메라 및 드론을 통한 촬영을 하여 사후에 촬영된 영상을 바탕으로 시스템 진단하는 등의 사후 결함검출로 제한되기 때문에, 작업자의 업무 효율 증대와 진단의 신속성을 위해서는 관로의 실시간 탐지기술이 필요하다. 최근 첨단장비 및 인공지능 기법을 활용한 시설물 진단 기술이 개발되고 있지만, 인공지능기반 결함검출 기술은 결함 데이터의 종류 및 형태, 수가 검출 성능에 영향을 주기 때문에 다양한 학습데이터가 필요하다. 따라서, 본 연구에서는 상·하수도 관로의 결함검출 시 탐지 성능 향상을 위해 다양한 결함 시나리오를 3D 프린트를 이용하여 구현하고 이를 수집된 결함 데이터와 함께 학습데이터로 사용한다. 이후 수집된 이미지는 위험도에 따른 분류 및 객체의 라벨링 등의 전처리 작업이 수행되고 실시간 결함탐지를 수행한다. 제안된 기법은 상·하수도시스템 결함검출 시 실시간 피드백을 제공함으로써, 작업자의 진단 누락 가능성을 최소화하며 기존의 상·하수도관 진단업무 처리능력을 향상할 수 있다.

• Nuclear Engineering and Technology
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• 제52권4호
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• pp.856-862
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• 2020

Defect inspection system for industrial applications takes the important portion. Non-destructive inspection method has been significantly improved. Infrared thermography, as one of method for non-destructive inspection, can provide relatively precise data and quick inspection time. This study, it was performed to measure defect according to the measurement limit of the non-visible areas such as the back surface of the pipe using reflection plate using reflection plate based on Infrared thermography. The materials of the reflection plate were determined in consideration of the space limitation and the thermal characteristics, and defects were detected by the manufactured reflection plate. Detection of defect in non-visible area using the candidate materials for reflection plate was conducted.

• 산업경영시스템학회지
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• 제46권2호
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• pp.1-12
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• 2023

To make semiconductor chips, a number of complex semiconductor manufacturing processes are required. Semiconductor chips that have undergone complex processes are subjected to EDS(Electrical Die Sorting) tests to check product quality, and a wafer bin map reflecting the information about the normal and defective chips is created. Defective chips found in the wafer bin map form various patterns, which are called defective patterns, and the defective patterns are a very important clue in determining the cause of defects in the process and design of semiconductors. Therefore, it is desired to automatically and quickly detect defective patterns in the field, and various methods have been proposed to detect defective patterns. Existing methods have considered simple, complex, and new defect patterns, but they had the disadvantage of being unable to provide field engineers the evidence of classification results through deep learning. It is necessary to supplement this and provide detailed information on the size, location, and patterns of the defects. In this paper, we propose an anomaly detection framework that can be explained through FCDD(Fully Convolutional Data Description) trained only with normal data to provide field engineers with details such as detection results of abnormal defect patterns, defect size, and location of defect patterns on wafer bin map. The results are analyzed using open dataset, providing prominent results of the proposed anomaly detection framework.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2011년도 추계학술대회
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• pp.382-386
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• 2011

RFID 태그 생산 분야에서 RFID 칩 본딩 과정 이후에 RFID 태그 불량 검출 기능을 수행하는 불량 검출 시스템 개발이 요구되어 왔다. 그러나 RFID 태그의 특징을 이해하면서 제대로 된 설계 개념을 가지고 구현된 시스템을 설계하기가 어렵고 사소한 기능의 변화에도 시스템을 처음부터 설계를 해야 하는 어려움이 있었다. 이 논문에서는 RFID 태그 불량 검출 기능을 수행하는 불량검출 시스템을 UML을 이용하여 객체지향 기법으로 설계하고 UML로 설계된 모델링을 객체지향을 지원하는 비주얼 언어인 LabVIEW OOP로 적용하는 방법을 제시한다. UML과 LabVIEW OOP로 설계되고 구현된 불량검출 시스템에 대한 성능과 시스템의 기능 변화에 따른 재설계 기법에 대한 기법도 제안한다.