• Title/Summary/Keyword: Deep-RIE

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Integration of a micro lens on a in-plane positioning actuator with 2-DOF (마이크로 렌즈가 집적된 2-자유도 평면구동기의 설계 및 제작)

  • Kim, Che-Heung;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 1999.07g
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    • pp.3322-3324
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    • 1999
  • This paper studies on the design and fabrication of a micro in-plane positioning actuator integrated with a microlens. Proposed in-plane actuator is a micro XY-stage which is composed of two linear comb drive actuators being orthogonal to each other. In the fabrication of actuator, the single crystalline silicon substrate anodically bonded with a #7740 glass substrate is used because of simple release and passivation. The structure of actuator is formed on the silicon facet of bonded fixture by chlorine-based deep RIE and then released by isotropic wet etching of glass (#7740) in hydrofluoric acid solution. Fabricated actuator has a large travel range up to $30({\pm}15){\mu}m$ and high resolution less than 0.01f1l1l in each direction. Experimented resonant frequency of this actuator is 630Hz. The micro-Fresnel lens is fabricated on the square-shape glass structure prepared in the center of actuator.

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Design and fabrication of mirror for optical pick-up head (광기록장치의 pick-up 헤드용 미러의 설계 및 제작)

  • Chon, Joong-Hyun;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 1999.07g
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    • pp.3292-3294
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    • 1999
  • In this paper, electrostatic scanner mirror for optical pick-up head is designed and fabricated. The mirror size is $20{\mu}m{\times}2400{\mu}m{\times}2400{\mu}m$ and torsional beam size is $10{\mu}m{\times}20{\mu}m{\times}500{\mu}m$. Static deflection angle is calculated ${\pm}0.4$ degrees when the maximum driving voltage is 20 V. Silicon mirror was fabricated using KOH etching and deep RIE. For passivation of the patterned mirror from KOH solution, parylene thin film was used and its usefulness has been verified. Driving electrode was fabricated using UV LIGA process. Mirror and electrode were bonded.

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Coupled Boundary Effects on a Gas Lubricated Bearing far a Scaled-Up Micro Gas Turbine

  • Hyunduck Kwak;Lee, Yong-Bok;Kim, Chang-Ho;Gunhee Jang
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2000.11a
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    • pp.243-249
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    • 2000
  • In case of the limitation of Deep RIE fabrication for Micro Gas Turbine, bearing aspect ratio is limited in very small value. The characteristics such as pressure distribution load capacity and non-linearity of a short bearing of L/D=0.083 and a conventional bearing of L/D=1.0 with coupled boundary effects are investigated far Micro Gas Tlubine bearings. The coupled efffect was analyzed by mass conservation at coupled end area. The results, increasing load capacity and non-linearity due to the coupled effect of thrust and journal bearing, are obtained and the selection of journal bearing type is discussed.

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Development of micro check valve with polymer MEMS process for medical cerebrospinal fluid (CSF) shunt system (Polymer MEMS 공정을 이용한 의료용 미세 부품 성형 기술 개발)

  • Chang, J.K.;Park, C.Y.;Chung, S.;Kim, J.K.;Park, H.J.;Na, K.H.;Cho, N.S.;Han, D.C.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2000.05a
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    • pp.1051-1054
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    • 2000
  • We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2*0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5*2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

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Method to control the Sizes of the Nanopatterns Using Block Copolymer (블록 공중합체를 이용한 나노패턴의 크기제어방법)

  • Kang, Gil-Bum;Kim, Seong-Il;Han, Il-Ki
    • Journal of the Korean Vacuum Society
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    • v.16 no.5
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    • pp.366-370
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    • 2007
  • Nano-scopic holes which are distributed densely and uniformly were fabricated on $SiO_2$ surface. Self-assembling resists were used to produce a layer of uniformly distributed parallel poly methyl methacrylate (PMMA) cylinders in a polystyrene (PS) matrix. The PMMA cylinders were degraded and removed by acetic acid rinsing. Subsequently, PS nanotemplates were fabricated. The patterned holes of PS template were approximately $8{\sim}30\;nm$ wide, 40 nm deep, and 60 nm apart. The porous PS template was used as a dry etching mask to transfer the pattern of PS template into the silicon oxide thin film during reactive ion etching (RIE) process. The sizes of the patterned holes on $SiO_2$ layer were $9{\sim}33\;nm$. After pattern transfer by RIE, uniformly distributed holes of which size were in the range of $6{\sim}22\;nm$ were fabricated on Si substrate. Sizes of the patterned holes were controllable by PMMA molecular weight.

Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with $75{\mu}m$ Cu Via ($75{\mu}m$ Cu via가 형성된 3D 스택 패키지용 interconnection 공정 및 접합부의 전기적 특성)

  • Lee Kwang-Yong;Oh Teck-Su;Won Hye-Jin;Lee Jae-Ho;Oh Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.111-119
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    • 2005
  • Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

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Experimental Study on Moisture Content According to Addition of Surfactants (계면활성제 첨가에 따른 함수율에 관한 실험적 연구)

  • Kim, Nam-Kyun;Rie, Dong-Ho
    • Fire Science and Engineering
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    • v.29 no.2
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    • pp.79-83
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    • 2015
  • The fire accident is a representative type of disaster that can largely impact on business. Therefore, precautionary measures and rapid initial response is very important when a disaster occurs. The storage of porous combustibles is inevitable in coal yard, plywood processing industry, and others that are currently operating. Initial fire fighting of fire and identifying the ignition point in such a porous combustible storage space are so difficult that if the initial response is failed, being led to deep-seated fire, surface fire is likely to result in secondary damage. In addition, deep-seated fire can cause personal injuries and property damage due to a large amount of toxic gases and reignition. Therefore damage reduction measures is required around the storage space to handle a porous flammable. Improving the penetration performance of the concentration of the surfactant is carried out as underlying study, which is about an deep-seated fire extinguishing efficiency augmentation when using wetting agents. The porous materials used in the experiments is radiata pine wood flour, which occupies more than 75% of the domestic wood market. Fire fighting water is selected as Butyl Di Glycol (BDG), which is being used for infiltration extinguishing agent, and the experiment was carried out by producing a standard solution. The experiment was carried out on the basis of the Deep-Seated Fire Test of NFPA 18. The amount of watering, porous material to the internal amount of penetration, and runoff measurement out of the porous material was conducted. According to experimental results, as the surface tension is reduced, the surfactant concentration macroscopic penetration rate decreases, but infiltration to a porous material is shown to have growth characteristics.

Fabrication of Probe Beam by Using Joule Heating and Fusing (절연절단법을 이용한 프로브 빔의 제작)

  • Hong, Pyo-Hwan;Kong, Dae-Young;Lee, Dong-In;Kim, Bonghwan;Cho, Chan-Seob;Lee, Jong-Hyun
    • Journal of Sensor Science and Technology
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    • v.22 no.1
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    • pp.89-94
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    • 2013
  • In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of $400{\mu}m$ was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of $15{\mu}m$. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of $150{\mu}m^2$. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.

Nanowire Patterning for Biomedical Applications

  • Yun, Young-Sik;Lee, Jun-Young;Yeo, Jong-Souk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.382-382
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    • 2012
  • Nanostructures have a larger surface/volume ratio as well as unique mechanical, physical, chemical properties compared to existing bulk materials. Materials for biomedical implants require a good biocompatibility to provide a rapid recovery following surgical procedure and a stabilization of the region where the implants have been inserted. The biocompatibility is evaluated by the degree of the interaction between the implant materials and the cells around the implants. Recent researches on this topic focus on utilizing the characteristics of the nanostructures to improve the biocompatibility. Several studies suggest that the degree of the interaction is varied by the relative size of the nanostructures and cells, and the morphology of the surface of the implant [1, 2]. In this paper, we fabricate the nanowires on the Ti substrate for better biocompatible implants and other biomedical applications such as artificial internal organ, tissue engineered biomaterials, or implantable nano-medical devices. Nanowires are fabricated with two methods: first, nanowire arrays are patterned on the surface using e-beam lithography. Then, the nanowires are further defined with deep reactive ion etching (RIE). The other method is self-assembly based on vapor-liquid-solid (VLS) mechanism using Sn as metal-catalyst. Sn nanoparticle solutions are used in various concentrations to fabricate the nanowires with different pitches. Fabricated nanowries are characterized using scanning electron microscopy (SEM), x-ray diffraction (XRD), and high resolution transmission electron microscopy (TEM). Tthe biocompatibility of the nanowires will further be investigated.

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A study on the Thermopneumatic Actuator with Phase Change for Micro Pump (상변화를 이용한 열공압형 마이크로 펌프용 액츄에이터 성능에 관한 연구)

  • Park, S.;Hwang, J.Y.;Lee, S.;Kang, K.;Kang, H.;Jang, J.;Lee, H.;Kang, S.
    • 한국신재생에너지학회:학술대회논문집
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    • 2006.11a
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    • pp.425-428
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    • 2006
  • Recently, Direct Methanol Fuel Cell (DMFC) for portable devices has been received much attention because DMFC has a possibility of higher energy density than electrical batteries and smaller size than other fuel cells. This paper presents the fabrication and test of a thermopneumatic microactuator with a phase change for DMFC. A microactuator consists of an inlet an outlet a chamber, a heater and a sensor of resistance temperature detector(RTD). The micoractuator is fabricated by the spin-coating process, the lithograph process, the deep RIE process and so on. The total size of microactuator is $20{\times}20{\times}0.53mm^3$. When the current is applied, the heater heats liquid in chamber. As a result the liquid vaporizes. The response of temperature in the chamber was measured using thermocouple The changed temperature is $3^{\circ}C$ for 5 sec at 0.032W.

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