• 제목/요약/키워드: Deep Etching

검색결과 134건 처리시간 0.025초

Study on deep Si etching mechanism using in-situ surface temperature monitoring in $SF_6/O_2$ plasma

  • 임영대;이승환;유원종
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.405-405
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    • 2010
  • Thermocouple 을 통해 Inductively coupled plasma 에 노출된 실리콘 기판 표면온도를 공정조건 변화 에 따라 실시간 (in-situ) 측정하였다. 이를 바탕으로 공정변화에 따른 플라즈마 내 활성종의 거동을 연구하였다. 더 나아가 기판의 표면온도변화 및 활성종의 거동해석을 토대로 공정변화에 의한 딥 실리콘 구조형성 메커니즘을 해석하였다. 플라즈마에 노출된 기판표면 온도를 상승시키는 주 활성종은 positive ion 이며 ICP power, Bias power, 플라즈마 압력 변화에 따라 positive ion 의 밀도 및 가속에너지가 변화하는데 이러한 거동변화는 기판의 표면온도를 변화시킴을 알 수 있었다. 딥 실리콘 구조의 측벽 및 바닥에 형성되어 있는 passivaiton layer 즉 $SiO_xF_y$(silicon oxyflouride) 는 온도에 매우 민감한 물질이며 이는 딥 실리콘 구조 내부로 입사하는 positive ion 거동변화에 따라 그 성질이 변화하여 deep Si 구조 형상을 변화시킴을 알 수 있었다. 기판표면 온도가 $0^{\circ}C$ 이하의 극저온으로 유지된 상황에서 플라즈마를 방전할 경우 positive ions 의 가속에너지로 인해 기판표면온도가 상승하며 액화질소 유량증가를 통해 다시 기판의 표면온도를 유지시킬 수 있었다. 이를 통해 플라즈마 방전 전과 방전 후의 기판 표면온도는 상온의 기판뿐만 아니라 극저온의 기판에서도 다름을 알 수 있었다. 냉각환경 변화에 따른 딥 실리콘 구조형성 메커니즘을 positive ions 거동 그리고 온도 감소에 의한 $SiO_xF_y$ 성질 변화를 이용해 해석할 수 있었다.

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접착성(接着性) 레진 세멘트가 가견치수조직(家犬齒髓組織)에 미치는 영향(影響) (The EFFECT OF DENTAL ADHESIVE R~SIN CEMENT ON THE DOGS' DENTAL PULP)

  • 양정옥;조규징
    • Restorative Dentistry and Endodontics
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    • 제12권2호
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    • pp.101-108
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    • 1987
  • The purpose of this study was to investigate the pulpal responses of dental adhesive resins. A total of 40 cavities of the permanent healthy teeth from 4 dogs were prepared. In the experimental group, the cavities were etched for 1 minute with citric acid and filled with experimental resins (ie. Super-Bond C & B$^{(R)}$). In the control group, the cavities were filled with calcium hydroxide base materials (ie. Dycal$^{(R)}$) without etching. The dogs were sacrificed at one, two, three and four weeks after the time of filling and the specimens were routinely prepared and stained with Hematoxylin-Eosin. The microscopic findings were as follows: Infiltration of inflammatory cells was not observed in both experimental and control groups. Change in the odontoblastic layer was not observed in all control groups but severe swelling was observed in deep dental pulp tissue of the control two and three week cases. Pulp tissue was recovered with plenty of fibrous component in the control four week case and reparative dentin formation was not occurred in all cases. Slight changes of the odontoblastic layer beneath the cavity were observed in the experimental one week case. In experimental two and three week cases, swelling of deep pulp tissue was increased and localized reparative dentin formation was observed. In the experimental four week case, odontoblastic layer was recovered with regular appearance and fibrous component of the pulp was increased, but reparative dentin formation was not evident.

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3D Lithography using X-ray Exposure Devices Integrated with Electrostatic and Electrothermal Actuators

  • Lee, Kwang-Cheol;Lee, Seung S.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제2권4호
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    • pp.259-267
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    • 2002
  • We present a novel 3D fabrication method with single X-ray process utilizing an X-ray mask in which a micro-actuator is integrated. An X-ray absorber is electroplated on the shuttle mass driven by the integrated micro-actuator during deep X-ray exposures. 3D microstructures are revealed by development kinetics and modulated in-depth dose distribution in resist, usually PMMA. Fabrication of X-ray masks with integrated electrothermal xy-stage and electrostatic actuator is presented along with discussions on PMMA development characteristics. Both devices use $20-\mu\textrm{m}$-thick overhanging single crystal Si as a structural material and fabricated using deep reactive ion etching of silicon-on-insulator wafer, phosphorous diffusion, gold electroplating, and bulk micromachining process. In electrostatic devices, $10-\mu\textrm{m}-thick$ gold absorber on $1mm{\times}1mm$ Si shuttle mass is supported by $10-\mu\textrm{m}-wide$, 1-mm-long suspension beams and oscillated by comb electrodes during X-ray exposures. In electrothermal devices, gold absorber on 1.42 mm diameter shuttle mass is oscillated in x and y directions sequentially by thermal expansion caused by joule heating of the corresponding bent beam actuators. The fundamental frequency and amplitude of the electrostatic devices are around 3.6 kHz and $20\mu\textrm{m}$, respectively, for a dc bias of 100 V and an ac bias of 20 VP-P (peak-peak). Displacements in x and y directions of the electrothermal devices are both around $20{\;}\mu\textrm{m}$at 742 mW input power. S-shaped and conical shaped PMMA microstructures are demonstrated through X-ray experiments with the fabricated devices.

기포를 이용한 마이크로 액츄에이터 개발 (The Micro-Actuator Development of using the Bubble)

  • 최종필;반준호;전병희;장인배;김헌영;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 추계학술대회논문집
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    • pp.381-385
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    • 2003
  • This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated by a micro-heater under pulse heating. The micro-actuator is consist of three plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive ion Etching) process. The middle plate includes the chamber and diaphragm, and the upper plate is the micro-heater. The micro-heater designed non-uniform width and results in periodic generation of stable single bubbles in D.I water. The single bubble appears precisely on the narrow part of the micro-heater and control is recorded.

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광디스크용 마이크로미러의 설계 및 제작에 관한 연구 (A Study on the Design and Fabrication for the Micro-Mirror of Optical Disk System)

  • 손덕수;김종완;임경화;서화일;이우영
    • 한국정밀공학회지
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    • 제19권11호
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    • pp.211-220
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    • 2002
  • Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.

SDB와 전기화학적 식각정지에 의한 블크 마이크로머신용 3차원 미세구조물 제작 (Fabrication of 3-dementional microstructures for bulk micromachining by SDB and electrochemical etch-stop)

  • 정연식;정귀상
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1890-1892
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    • 2001
  • This paper described on the fabrication of microstructures by DRIE(Deep Reactive Ion Etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -750 mm Hg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing(1000$^{\circ}C$, 60 min.), the SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated microstructures by DRIE as well as a accurate thickness control and a good flatness.

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Microcolumn 을 위한 새로운 개념의 초소형 전자빔 deflector (A New Miniaturized Electron-Beam deflector for Microcolumn)

  • 한창호;김학;전국진
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.1037-1040
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    • 2003
  • 본 논문에서는 microcolumn 을 위한 초소형 전자빔 deflector 의 제작방법과 microcolumn array 에서 deflector 의 외부 패드를 최소화 할 수 있는 새로운 배선방법을 기술하였다. 배선의 통로 및 절연체 역할을 하는 Pyrex glass 의 양쪽에 각각 실리콘 웨이퍼의 양극접합 및 deep reactive ion etching(DRIE)과 금속 전기 도금을 이용하여 다층배선을 하였다. 이 배선방법을 이용하면 microcolumn array 가 수백개가 되더라도 deflector 의 외부 패드는 항상 8개를 유지할 수 있다.

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An Etch-Stop Technique Using $Cr_2O_3$ Thin Film and Its Application to Silica PLC Platform Fabrication

  • Shin, Jang-Uk;Kim, Dong-June;Park, Sang-Ho;Han, Young-Tak;Sung, Hee-Kyung;Kim, Je-Ha;Park, Soo-Jin
    • ETRI Journal
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    • 제24권5호
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    • pp.398-400
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    • 2002
  • Using $Cr_2O_3$ thin film, we developed a novel etch-stop technique for the protection of silicon surface morphology during deep ion coupled plasma etching of silica layers. With this technique we were able to etch a silica trench with a depth of over 20 ${\mu}m$ without any damage to the exposed silicon terrace surface. This technique should be well applicable to fabricating silica planar lightwave circuit platforms for opto-electronic hybrid integration.

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대면적 광 정보저장매체의 나노성형에 대한 기술 개발 (Nano Molding Technology for Optical Storage Media with Large-area Nano-pattern)

  • 신홍규;반준호;조기철;김헌영;김병희
    • 한국정밀공학회지
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    • 제23권4호
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    • pp.162-167
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    • 2006
  • Hot embossing lithography(HEL) has the production advantage of comparatively few process step, simple operation, a relatively low cost for embossing tools(Si), and high replication accuracy for small features. In this paper, we considered the nano-molding characteristic according to molding parameters(temperature, pressure, times, etc) and induced a optimal molding condition using HEL. High precision nano-patter master with various shapes were designed and manufactured using the DRIE(Deep Reactive ion Etching), LPCVD(Low Pressure Chemical Vapor Deposition) and thermal oxidation process, and we investigated the molding characteristic of DVD and Blu-ray nickel stamp. We induced flow behaviors of polymer, rheology by shapes and sizes of the pattern through various molding experiments. Finally, with achieving nano-structure molding with high aspect ratio, we will secure a basic technology about the molding of large-area nano-pattern media.

마이크로펌프를 이용한 PCR Chip의 구동 (Operation of PCR chip by micropump)

  • 최종필;반준호;장인배;김헌영;김병희
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2004년도 추계학술대회 논문집
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    • pp.463-467
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    • 2004
  • This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated b micro-heater under pulse heating. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, he middle plate, the upper plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The middle plate includes the chamber and diaphragm d the upper plate is the micro-heater. The Micropump is fabricated by bonding process of the three layer. This paper resented the possibility of the PCR chip operation by the fabricated micropump.

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