• Journal of Electrical Engineering and Technology
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• 제1권3호
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• pp.396-405
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• 2006

The visual analysis of buried channel (Be) devices such as buried channel MOSFETs and CCDs (Charge Coupled Devices) is investigated to give better understanding and insight for their electrical behaviours using a 3-dimensional (3-D) numerical simulation. This paper clearly demonstrates the capability of the numerical simulation of 'EVEREST' for characterising the analysis of a depletion mode MOSFET and BC CCD, which is a simulation software package of the semiconductor device. The inverse threshold and punch-through voltages obtained from the simulations showed an excellent agreement with those from the measurement involving errors of within approximately 1.8% and 6%, respectively, leading to the channel implanted doping profile of only approximately $4{\sim}5%$ error. For simulation of a buried channel CCD an advanced adaptive discretising technique was used to provide more accurate analysis for the potential barrier height between two channels and depletion depth of a deep depletion CCD, thereby reducing the CPU running time and computer storage requirements. The simulated result for the depletion depth also showed good agreement with the measurement. Thus, the results obtained from this simulation can be employed as the input data of a circuit simulator.

• 대한전자공학회논문지SD
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• 제48권10호
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• pp.62-66
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• 2011

본 연구에서는 측정된 S-파라미터를 사용하여 드레인-소스 전압 Vds에 무관한 게이트-소스 overlap 캐패시턴스를 추출하고, 이를 바탕으로 deep-submicron MOSFET의 Vds 종속 게이트-벌크 캐패시턴스 곡선을 추출하는 RF 방법이 새롭게 개발 되었다. 추출된 캐패시턴스 값들을 사용한 등가회로 모델과 측정된 데이터가 잘 일치하는 것을 관찰함으로써 추출방법의 정확도가 검증되었다. 추출된 데이터로부터 overlap과 depletion 길이의 Vds 종속 곡선이 얻어졌으며, 이를 통해 drain 영역의 채널 도핑 분포를 실험적으로 측정하였다.

• Journal of Electrical Engineering and Technology
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• 제2권2호
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• pp.267-273
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• 2007

A depletion-mode MOSFET has been analyzed to evaluate its electrical behavior using a novel 3-D numerical simulation package. The characterizing analysis of the BC MOSFET was performed through short-channel narrow-channel and small-geometry effects that are investigated, in detail, in terms of the threshold voltage. The DIBL effect becomes significant for a short-channel device with a channel length of $<\;3({\mu}m)$. For narrow-channel devices the variation of the threshold voltage was sharp for $<4({\mu}m)$ due to the strong narrow-channel effect. In the case of small-geometry devices, the shift of the threshold voltage was less sensitive due to the combination of the DIBL and substrate bias effects, as compared with that observed from the short-channel and narrow-channel devices. The characterizing analysis of the narrow-channel and small-geometry devices, especially with channel width of $<\;4({\mu}m)$ and channel area of $<\;4{\times}4({\mu}m^2)$ respectively, can be accurately performed only from a 3-D numerical simulation due to their sharp variations in threshold voltages.