• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1987년도 한국자동제어학술회의논문집; 한국과학기술대학, 충남; 16-17 Oct. 1987
• /
• pp.190-192
• /
• 1987

In the paper an multivariable decoupling self-tuning algorithm is proposed for controller design, by specifying the closed-loop behaviour of the system in the form of a reference model, so that the controller parameters can be estimated on-line as the process development. The effectiveness of this algorithm in controlling multivariable systems is demonstrated by simulation example in spite of the usual implementation problems of self-tuning controllers.

• 대한전자공학회논문지SD
• /
• 제43권7호
• /
• pp.29-37
• /
• 2006

본 논문에서는 온칩 디커플링 커패시터에 의한 파워/그라운드 라인에서의 RLC 공진현상을 감소시키기 위한 해석적인 모델을 제시한다. 패키지 인덕턴스와 온칩 디커플링 커패시터 및 출력 드라이버로 인하여 형성되는 RLC 공진 회로의 공진주파수를 정확하게 예측하였다. 예측된 공진주파수를 이용하여 회로 동작에 필요한 적절한 디커플링 커패시터의 크기를 결정할 수 있다. 본 논문에서 제시한 공진현상을 감소시킬 수 있는 새로운 설계 방법의 타당성은 $0.18{\mu}m$ 공정 HSPICE 모텔을 사용한 시뮬레이션을 통하여 검증하였다.

• Structural Engineering and Mechanics
• /
• 제64권4호
• /
• pp.473-485
• /
• 2017

An isolated building, composed of superstructure and isolation system which have very different damping properties, is typically non-classical damping system. This results in inapplicability of traditional response spectrum method for isolated buildings. A multidimensional response spectrum method based on complex mode superposition is herein introduced, which properly takes into account the non-classical damping feature in the structure and a new method is developed to estimate velocity spectra from the commonly used displacement or pseudo-acceleration spectra based on random vibration theory. The error of forced decoupling method, an approximated approach, is discussed in the viewpoint of energy transfer. From the base-isolated benchmark model, as a numerical example, application of the procedure is illustrated companying with comparison study of time-history method, forced decoupling method and the proposed method. The results show that the proposed method is valid, while forced decoupling approach can't reflect the characteristics of isolated buildings and may lead to insecurity of structures.

• 유통과학연구
• /
• 제17권8호
• /
• pp.77-85
• /
• 2019

Purpose - The use of celebrity endorsers is a strategy long-since used by companies to improve the persuasive impact of their company's advertising. However, much like anyone else, celebrities are flawed human beings, and therefore often find themselves involved in scandals. Companies must consider the potential of scandals when using a celebrity endorser to represent their brand or product. This research focuses on the process consumers use to justify scandals involving celebrity endorsers. Specifically, this research divides the justification processes used by consumers to maintain support for celebrities involved in a scandal into moral decoupling and moral rationalization and proposes antecedents and consequences for these processes. Methodology - To verify the hypotheses suggested by this study, an online survey was conducted, and data was analyzed using a structural equation model. Result - Results showed that consumer empathy for the celebrity endorser and external attribution of the scandal presented were positively related to moral decoupling and moral rationalization. In addition, moral rationalization was positively related to consumers' attitude towards the celebrity endorser, which also enhanced brand attitude. However, the relationship between moral decoupling and the consumer's attitude toward the celebrity endorser was not statistically significant. Conclusion - This research serves to expand the scope of available research on the persuasiveness of celebrity endorsers and provides practical guidelines for marketers.

• 마이크로전자및패키징학회지
• /
• 제29권1호
• /
• pp.1-6
• /
• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
• /
• pp.435-438
• /
• 2004

This paper presents a new analytical model to suppress RLC resonance effects in power/ground lines due to a decoupling capacitor. First, the resonance frequency of an RLC circuit which is composed of package inductance. decoupling capacitor, and output drivers is accurately estimated. Next, using the estimated resonance frequency, a suitable decoupling capacitor sire is determined. Then, a novel design methodology to suppress the resonance effects is developed. Finally, its validity is shown by using $0.18 {\mu}m$ process-based-HSPICE simulation.

• 한국해양공학회:학술대회논문집
• /
• 한국해양공학회 2001년도 추계학술대회 논문집
• /
• pp.169-173
• /
• 2001

This study presents the results of decoupling of free decay roll test data by discrete wavelet transform. Free roll decay test was performed to decide the coefficients of damping terms in equation of motion. During the experiment, a slight yaw motion was found while the model was in the free roll decay motion. Discrete wavelet transform was applied to the signal to extract the pure roll motion. The results were compared to those of the Fourier transform. DWT was able to decouple the two signals efficiently while the Fourier transform was not.

• ETRI Journal
• /
• 제33권1호
• /
• pp.121-124
• /
• 2011

Digital harmonics, which may reduce the radio frequency sensitivity of a system, can be coupled with an antenna in a mobile handset. This letter presents a decoupling method for increasing the isolation between digital harmonics on a flexible printed circuit board (FPCB) and an antenna in terms of the ground mode current and the concept of reaction. We model the signal and ground lines in an FPCB as a loop circuit exciting a ground mode current and demonstrate a simple but efficient decoupling method for reducing the excited ground mode current.

• Journal of Electrical Engineering and Technology
• /
• 제8권6호
• /
• pp.1551-1558
• /
• 2013

$H_2$ design of decoupled control systems is treated in the generalized plant model. The existence condition of a decoupling controller is stated and a parameterized form of all achievable decoupled closed loop transfer matrices is presented by using the directional interpolation approaches under the assumption of simple transmission zeros. The class of all decoupling controllers that yield finite cost function is obtained as a parameterized form and an illustrative example to find the optimal controller is provided.

• Journal of electromagnetic engineering and science
• /
• 제2권2호
• /
• pp.68-74
• /
• 2002

In this paper, a pre-layout design approach for high-speed microprocessor is proposed. For multilayer PCB stark up configuration as well as selection and placement of decoupling capacitors, an effective solution for reducing SSN and EMI is obtained by modeling and simulation of complete power distribution system. The system model includes VRM, decoupling capacitors, multiple power and ground planes for core voltage, vias, as well as microprocessor. Finally, the simulation results are verified by measurements data.