• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.177-177
• /
• 2009

이동통신 시스템의 소형화 경량화 다기능화 추세에 따라 세라믹 모듈의 정밀도 및 집적도가 중요한 요소로 부각되고 있다. 이러한 모듈의 고집적화 추세에 대응하기 위하여 세라믹 소성시 수축율 제어가 필수적인 요소로 부각되고 있으며, 이에 따라 X, Y축의 소성 수축율을 0에 근접하게 제어하는 무수축 소성 기술이 요구되고 있다. 선행연구를 통하여 $Al_2O_3$/Glass/$Al_2O_3$ 구조의 glass infiltration법에 의한 무수축 소성 기술 구현 가능성을 확인하였으나, 아직 해결해야 할 문제점들이 있다. glass가 $Al_2O_3$층으로 infiltration되는 과정에서 glass층이 de-lamination 되는 결함이 발견되었으며 이는 유전체 기판의 Q값을 낮추고 기판의 신뢰성에 악영향을 줄 수 있어 이에 대한 개선이 필요한 실정이다. 본 연구에서는 $Al_2O_3$/Glass/$Al_2O_3$ 구조의 glass infiltration법에 의한 선행 실험에서 관찰된 기판 내부의 de-lamination 현상에 대한 원인을 규명하고 해결책을 제시하고자 하였다. glass 유동과 바인더 burn-out이 동시에 진행됨에 따라 기공이 생성되며 glass가 점성유동함에 따라 이 기공이 glass층으로 모이게 되어 de-lamination 현상이 발생하는 것으로 사료된다. 이를 해결하기 위하여 de-lamination층에 $Al_2O_3$의 tamping을 시도하여 glass층의 기공이 빠져 나갈 수 있는 channel 을 형성하고, 남아있는 기공을 $Al_2O_3$로 채우는 효과를 얻을 수 있었다. 이에 따라 기판의 밀도와 Quality factor 값이 향상되었으며 미세구조가 치밀한 무수축 기판을 제작할 수 있었다.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.850-850
• /
• 2006

• Transactions on Electrical and Electronic Materials
• /
• v.12 no.1
• /
• pp.32-34
• /
• 2011

A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.3
• /
• pp.77-82
• /
• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.329-329
• /
• 2010

적층 액츄에이터는 우수한 압전특성 및 그 재료가 가진 고유한 특성 때문에 최근 이동통신 단말기용 햅틱 소자 및 PC 와 그 주변기기로 수요가 폭발적으로 증대되고 있으며, 향후에도 CATV 네트워크와 무선통신기기를 비롯한 디지털 통신분야로 응용분야가 확대되리라 예상된다. 적층 액츄에이터에서 발생되는 에너지는 세라믹 그린시트 두께와 전극 면적에 비례하여 변위 및 응력이 증가하게 되므로 고적층형에 대한 필요성이 증대되고 있다. 이러한 고적층 액츄에이터의 경우 소성과정에 서 warpage 및 de-lamination 같은 결함이 발생하기 쉬우므로 그린시트의 균일성 및 전극과의 matching성 확보가 중요한 요소이다. 본 연구에서는 슬러리의 분산성과 시트 내 유기물 함량 최적화 실험을 진행하여 적층 액츄에이터용 그린시트를 최적화 한 후 공정 적용성 및 저온소성 전극인 Ag-Pd 전극과의 매칭성을 확보하고자 하였다. 이러한 후막공정 기술 개선을 통해 적층 액츄에이터를 제조하여 압전 특성을 측정하였다.

• Journal of the Korean Wood Science and Technology
• /
• v.47 no.2
• /
• pp.200-209
• /
• 2019

To improve the water resistance of melamine-urea-formaldehyde (MUF) resins, different levels of blocked polymeric 4,4 diphenyl methane diisocyanate (B-pMDI) were blended with MUF resins to prepare B-pMDI/MUF hybrid adhesives, and their adhesion performances were evaluated for the surface lamination of fancy veneer on plywood. FT-IR spectra showed that the de-blocked -NCO groups reacted with the -OH of hydroxymethyl groups of the MUF resins to form urethane bonds at 2% B-pMDI/MUF, which was detected before and after their hydrolysis. The mass loss after the hydrolysis consistently decreased as the B-pMDI level increased, indicating an improvement in the water resistance. As the B-pMDI level increased, the activation energy of hybrid adhesives decreased, which improved the reactivity of the hybrid adhesives. Additionally, the water resistance improvement of the hybrid adhesives increased the tensile shear strength of the surface laminated plywood in semi-water proof and water-proof by 23 % and 8 %, respectively, at 2% B-pMDI level. This was likely due to the urethane linkages in the hybrid adhesives. However, the formaldehyde emission from plywood panels bonded with the hybrid adhesives increased in the dry state, indicating incomplete curing of the hybrid adhesives.

• Advances in materials Research
• /
• v.7 no.2
• /
• pp.119-136
• /
• 2018

In this paper, static and vibration analysis for anti-symmetric cross-ply and angle- ply carbon/glass hybrid laminates rectangular composite plate are presented. In this analysis, the equations of motion for simply supported thick laminated hybrid rectangular plates are derived and obtained through the use of Hamilton's principle. The closed-form solutions of anti-symmetric cross-ply and angle- ply laminates are obtained using Navier solution. The effects of side-to-thickness ratio, aspect ratio, and lamination schemes on the fundamental frequencies loads are investigated. The study concludes that shear deformation laminate theories accurately predict the behavior of composite laminates, whereas the classical laminate theory over predicts natural frequencies. The excellent accuracy of the present analytical solution is confirmed by making some comparisons of the present results with those available in the literature. It can be concluded that the proposed theory is accurate and simple in solving the free vibration behaviors of anti-symmetric cross-ply and angle- ply hybrid laminated composite plates.

• Structural Engineering and Mechanics
• /
• v.70 no.5
• /
• pp.535-549
• /
• 2019

This study aimed to develop a high-order shear deformation theory to predict the free vibration of hybrid cross-ply laminated plates under different boundary conditions. The equations of motion for laminated hybrid rectangular plates are derived and obtained by using Hamilton's principle. The closed-form solutions of anti-symmetric cross-ply and angle-ply laminates are obtained by using Navier's solution. To assess the validity of our method, we used the finite element method. Firstly, the analytical and the numerical implementations were validated for an antisymmetric cross-ply square laminated with available results in the literature. Then, the effects of side-to-thickness ratio, aspect ratio, lamination schemes, and material properties on the fundamental frequencies for different combinations of boundary conditions of hybrid composite plates are investigated. The comparison of the analytical solutions with the corresponding finite element simulations shows the good accuracy of the proposed analytical closed form solution in predicting the fundamental frequencies of hybrid cross-ply laminated plates under different boundary conditions.

• Transactions on Electrical and Electronic Materials
• /
• v.13 no.1
• /
• pp.23-26
• /
• 2012

A zero-shrinkage sintering process in which the shrinkage of x-y axis is controlled to be zero is in great demand due to the trend of high integration in the ceramic modules. Among the zero-shrinkage sintering processes that are available, the proposed glass infiltration method where the viscous but fluidic glass infiltrates of the $Al_2O_3$ particles in the structure of $Al_2O_3$/glass/$Al_2O_3$ during firing is one of the applicable methods. However, the above proposed glass infiltration method has the problem of the warpage-like delamination. This occurred at the outermost surface of the multiple-bundle substrate. It is thought that the decomposed gas rapidly expands in low viscous glass to create vacant space. To solve this problem, the vacant space was tamped with $Al_2O_3$ particles to lead to the actual improvement of the sintered properties. With 15 wt% of tamping $Al_2O_3$ particles in glass, most of the vacant space disappeared. Fully densified zero-shrinkage substrate without delamination can be obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.330-330
• /
• 2010

이동통신 시스템의 소형화, 경량화, 다기능화 추세에 따라 이동통신 부품도 단위 부피당 소자의 집적도를 증가시키기 위하여 고집적화 추세로 급진전되고 있다. 이에 따라 세라믹 공정 기술도 고집적 추세로 다층화 되고 있어 수동소자의 내장화에 대한 필요성이 증대되고 있다. 이를 위하여 다양한 유전율 대역의 이종소재간 접합을 시도하지만 de-lamination, 내부 crack 등의 결함들이 발생하므로 열팽창계수 조절이 용이한 동종의 글라스를 사용하는 것이 유용하다. 본 연구에서는 공통의 글라스를 개발한 후 다양한 필러들을 혼합하여 mm파 대역에서 다양한 유전율을 갖는 LTCC 소재를 개발함으로써, 수동소자의 내장화에 따른 이종접합시의 매칭성을 극대화하고자 하였다. 이를 위하여 CaO-$Al_2O_3-SiO_2-B_2O_3$계 공통글라스에 $CaZrO_3$, $1.3MgTiO_3$, $2La_2O_3TiO_2$ 필러를 혼합하여 소결체의 미세구조, 유전특성 및 열기계적 특성을 고찰하였다. 이때 유전율 6에서 20에 이르는 저손실 소재를 개발할 수 있었다.