• 제목/요약/키워드: DRE(damage removal etching)

검색결과 2건 처리시간 0.014초

표면결함식각 및 반사방지막 열처리에 따른 태양전지의 효율 개선 (Silicon Solar Cell Efficiency Improvement with surface Damage Removal Etching and Anti-reflection Coating Process)

  • 조찬섭;오정화;이병렬;김봉환
    • 반도체디스플레이기술학회지
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    • 제13권2호
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    • pp.29-35
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    • 2014
  • In this study general solar cell production process was complemented, with research on improvement of solar cell efficiency through surface structure and thermal annealing process. Firstly, to form the pyramid structure, the saw damage removal (SDR) processed surface was undergone texturing process with reactive ion etching (RIE). Then, for the formation of smooth pyramid structure to facilitate uniform doping and electrode formation, the surface was etched with HND(HF : HNO3 : D.I. water=5 : 100 : 100) solution. Notably, due to uniform doping the leakage current decreased greatly. Also, for the enhancement and maintenance of minority carrier lifetime, antireflection coating thermal annealing was done. To maintain this increased lifetime, front electrode was formed through Au plating process without high temperature firing process. Through these changes in two processes, the leakage current effect could be decreased and furthermore, the conversion efficiency could be increased. Therefore, compared to the general solar cell with a conversion efficiency of 15.89%, production of high efficiency solar cell with a conversion efficiency of 17.24% was made possible.

Micro blaster를 이용한 태양전지용 재생웨이퍼의 표면 개선에 관한 연구 (A study on improving the surface morphology of recycled wafer forsolar cells using micro_blaster)

  • 이윤호;조준환;김상원;공대영;서창택;조찬섭;이종현
    • 센서학회지
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    • 제19권4호
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    • pp.291-296
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    • 2010
  • Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.