• The Optical Journal
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• s.153
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• pp.47-62
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• 2014

${\blacksquare}$ 목적 * 우리나라 주력산업분야(자동차, 조선, 항공, 기계, 로봇, 반도체 등)에 절단, 가공, 용접, 리소그라피, 마킹, 열처리, 합성, 표면처리 등의 방식으로 활용되고, 융 복합산업(의료, 에너지, 영상, 군수, 신소재, 센서)에 광원으로 응용되는 산업용 고출력 레이저의 산업 생태계 분석을 통하여 기존 산업의 고부가화와 신산업의 경쟁력을 견인 ${\blacksquare}$ 주요현황 * (시장현황) 2011년부터 2014년까지 고출력 레이저의 시장규모는 4,452백만불(5조 463억원)에서 5,255백만불(5조 9,565억원)으로 연평균 5.7% 성장 전망 * (제품기술동향) 3세대 레이저인 광섬유 레이저와 고출력 다이오드 레이저, DPSS 레이저 등이 기술혁신을 거듭하면서 1, 2세대 레이저를 대체해 가면서 높은 수준의 성장을 거듭할 것으로 전망. 산업용레이저의 주요선진국 대비 국내 기술수준은 전체적으로 44.5%정도로 취약 * (기업동향) Coherent, Trumpf, Cymer, IPG Photonics, Rofin-Sinar 5개사가 전체시장의 55%이상을 점유하고 있으며 대부분 수직계열화를 통해 경쟁력 확보. 최근 중국의 Han's 사가 자국정부의 지원을 통해 급 부상 ${\blacksquare}$ 시사점 * 산업용 레이저를 이용한 응용기술 부분 투자가 과거에는 단기 경제적 성취는 이로웠으나, 현재에 이르러 레이저 혹은 레이저 시스템이 필요할 때마다 외국에서 관련 핵심부품, 모듈 등을 수입해야하는 실정에 이르렀음. 향후 레이저 국산화를 위한 노력과 함께 후방 소재.부품의 전략적 투자를 통해 산업의 건강한 선순환생태 환경을 조성하여 산업 경쟁력을 갖추어야 함.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• Smart Structures and Systems
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• v.22 no.2
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• pp.223-230
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• 2018

This study examines a non-contact laser scanning-based ultrasound system, called an angular scan pulse-echo ultrasonic propagation imager (A-PE-UPI), that uses coincided laser beams for ultrasonic sensing and generation. A laser Doppler vibrometer is used for sensing, while a diode pumped solid state (DPSS) Q-switched laser is used for generation of thermoelastic waves. A high-speed raster scanning of up to 10-kHz is achieved using a galvano-motorized mirror scanner that allows for coincided sensing and for the generation beam to perform two-dimensional scanning without causing any harm to the surface under inspection. This process allows for the visualization of longitudinal wave propagation through-the-thickness. A pulse-echo ultrasonic wave propagation imaging algorithm (PE-UWPI) is used for on-the-fly damage visualization of the structure. The presented system is very effective for high-speed, localized, non-contact, and non-destructive inspection of aerospace structures. The system is tested on an aluminum honeycomb sandwich with disbonds and a carbon fiber-reinforced plastic (CFRP) honeycomb sandwich with a layer overlap. Inspection is performed at a 10-kHz scanning speed that takes 16 seconds to scan a $100{\times}100mm^2$ area with a scan interval of 0.25 mm. Finally, a comparison is presented between angular-scanning and a linear-scanning-based pulse-echo UPI system. The results show that the proposed system can successfully visualize defects in the inspected specimens.

• Current Optics and Photonics
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• v.3 no.6
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• pp.577-582
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• 2019

We report on a continuous-wave (cw) optical parametric oscillator (OPO) optimized for mid-infrared emission above 5.0 ㎛. The OPO is based on a magnesium-oxide-doped periodically poled LiNbO₃(MgO:PPLN) crystal with a fan-out grating design. A linear two-mirror cavity resonating both at the pump and signal wavelengths is stabilized to the pump laser by using the modified Pound-Drever-Hall (PDH) method. The idler wavelength is continuously tunable from 4.7 ㎛ up to 5.3 ㎛ by varying the poling period of the fan-out grating crystal. Pumped by a diode-pumped solid state (DPSS) laser with a power of 1.1 W at 1064 nm, the maximum idler output power is measured to be 5.3 mW at 4.8 ㎛. The output power above 5.0 ㎛ is reduced to the hundreds of ㎼ level due to increased absorption in the crystal, but is stable and strong enough to be measured with a conventional detector.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.9-17
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• 2010

The FPCB is used for electronic products such as LCD display. The process of manufacturing FPCB includes a cutting process, in which each single FPCB is cut and separated from the panel where a series of FPCBs are arrayed. The most-widely used cutting method is the mechanical punching, which has the problem of creating burrs and cracks. In this paper, the cutting characteristics of the FPCB have been experimented using Nd:YAG DPSS UV laser as a way of solving this problem. To maximize the industrial application of this laser cutting process, test samples of the multilayered FPCB have been chosen as it is actually needed in industry. The cutting area of the FPCB has four different types of layer structure. First, to cut the test sample, the threshold laser cut-off fluence has been found. Various combinations of laser and process parameters have been made to supply the acquired laser cut-off fluence. The cutting characteristics in terms of the variation of the parameters are analyzed. The laser and process parameters are optimized, in order to maximize the cutting speed and to reach the best quality of the cutting area. The laser system for the process automation has been also developed.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.23-28
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• 2010

Resistance trimming and cutting processes of printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also laser-based application system with high flexibility and complex has been designed and adopted power controller, auto beam size control, auto-focusing and control program developed for ourselves. The function of each module shows that they can be reliable for industrial equipments. Resistance trimming method used a plunge and double cut process with $20{\mu}m$ spot size beam. Results show that double cut process is more effective to control resistance trimming in precision than plunge cut process.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.104-109
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• 2007

Photochemical patterning of self-assembled mono layers (SAMs) has been performed by diode pumped solid state (DPSS) 3rd harmonic Nd:$YVO_4$ laser with wavelength of 355 nm. SAMs patternings of parallel lines have subsequently been used either to generate compositional chemical patterns or fabricate microstructures by a wet etching. This paper describes a selective etching process with patterned SAMs of alkanetiolate molecules on the surface of gold. SAMs formed by the adsorption of alkanethiols onto gold substrate employs as very thin photoresists. In this paper, the influence of the interaction between the functional group of SAMs and the etching solution is studied with optimal laser irradiation conditions. The results show that hydrophobic functional groups of SAMs are more effective for selective chemical etching than the hydrophilic ones.

• Laser Solutions
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• v.9 no.3
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• pp.7-13
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• 2006

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber are 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.20-24
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• 2010

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.41-45
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• 2006

Auto focusing system to find optimized focal position of laser beam used for material process has been investigated by using fiber confocal method. Wavelength of laser diode (LD) and diameter of single-mode fiber we 780nm and $5.3{\mu}m$, respectively. Intensity distributions of beam reflected from the surface of mirror and silicon bare wafer have been observed in a gaussian form. Experimental results show that focal position obtained by LD is shifted from one observed from surface scribed by laser about $80{\mu}m$. It is due to the difference of wavelength and each divergence of between LD and laser used for material process. It is confirmed that auto focusing control system through position calibration has operated steadily.