• Title/Summary/Keyword: DMA-DMA

Search Result 498, Processing Time 0.036 seconds

Development and Evaluation of Hy-CPC (Hy-CPC의 개발 및 성능평가)

  • Lee, Hong-Ku;Hwang, In-Kyu;Ahn, Kang-Ho
    • Particle and aerosol research
    • /
    • v.10 no.3
    • /
    • pp.93-97
    • /
    • 2014
  • Condensation particle counter (CPC) has been one of the most important basic instrument for measuring number concentration of submicron aerosols. The principle of the CPC is to expose aerosols to a supersaturated vapor and cool down which causes adiabatic expansion. The particles grow by heterogenous nucleation to a sufficient size for easy detection by optical method. However, for growth by condensation, CPC essentially needs both saturater and condensor causing a heavy system. Therefore, it is hard to install commercial CPC to tethered balloon package system. In this study, we developed customized CPC for tethered balloon package system called Hy-CPC which is lighter and smaller in structure than commercial CPCs, and evaluated activation efficiency and detection efficiency by Hy-CPC using electrostatic method (electrometer and Faraday cup).

A Study on Design and Implementation of Embedded System for speech Recognition Process

  • Kim, Jung-Hoon;Kang, Sung-In;Ryu, Hong-Suk;Lee, Sang-Bae
    • Journal of the Korean Institute of Intelligent Systems
    • /
    • v.14 no.2
    • /
    • pp.201-206
    • /
    • 2004
  • This study attempted to develop a speech recognition module applied to a wheelchair for the physically handicapped. In the proposed speech recognition module, TMS320C32 was used as a main processor and Mel-Cepstrum 12 Order was applied to the pro-processor step to increase the recognition rate in a noisy environment. DTW (Dynamic Time Warping) was used and proven to be excellent output for the speaker-dependent recognition part. In order to utilize this algorithm more effectively, the reference data was compressed to 1/12 using vector quantization so as to decrease memory. In this paper, the necessary diverse technology (End-point detection, DMA processing, etc.) was managed so as to utilize the speech recognition system in real time

KIM-1 microcomputer를 이용한 low-cost image processor 설계에 관하여

  • 유근호
    • 전기의세계
    • /
    • v.30 no.12
    • /
    • pp.793-796
    • /
    • 1981
  • 최근 우리나라에도 digital image processing에 대한 연구가 활발이 진행되고 있다. 또한 digital image processing의 생체공학에의 응용도 괄목할 만하다. 이러한 연구와 응용에 도움이 되고자 microcomputer를 이용한 image processor설계의 실례를 기술하고자 한다. 이 설계는 목적 image를 stationary image로 가정하여 TV카메라의 영상신호를 sample하여 computer 기억장치에 저장하므로 가격이 저렴하게 된다. 이러한 장치로서는 DMA연결 (Direct Memory Access interface)을 사용하여 빠른 data transfer를 달성할 수 있다. Digital image processing계는 기본적으로 microcomputer가 TV카메라와 TV모니터에 연결된 구조를 하고 있다. Computer가 기억장치에 저장된 data를 처리하여 필요한 정보를 얻게 된다. 이러한 data 처리를 하므로서 image를 사용자가 해석하기 쉽도록 image질을 향상시키거나 computer가 image를 인식하게 한다. 이와같이 처리된 image는 TV모니터를 통해서 볼 수 있다. 본지에서는 256x256개의 pixel들로 이루어지고, 각개의 pixel은 4개의 bit로 구성된 image processor의 설계를 기술한다.

  • PDF

A Design and Implementation of MP3 player using DSPA module of DB-X (DB-X의 DSPA를 이용한 MP3 플레이어 설계 및 구현)

  • Kim, Sung-Hun;Son, Yong-Ki;Yoo, Jin-Ho;Lee, Jeun-Woo;Han, Dong-Won
    • Proceedings of the KIEE Conference
    • /
    • 2001.11c
    • /
    • pp.369-371
    • /
    • 2001
  • 이 논문에서는 디지털 시그널 프로세싱에 적합하지 않은 RISC타입의 DB-X 마이크로콘트롤러를 이용하여 MP3 플레이어를 구현한 방법을 제안한다. DB-X 에는 DSPA 모듈이 있어 FIR, FFT 등 계산이 많이 요구되는 부분을 DSP 수준으로 빨리 연산해 줄 수가 있으며 SSI 모듈이 있어서 44.1khz의 샘플링 주기를 가지는 D/A 코덱과 연결할 수가 있다. 또한 SSI와 음성 데이터가 저장되어 있는 메모리 사이를 CPU 부담없이 데이터를 전송하기 위한 DMA 모듈이 있어 MP3 데이터를 프레임 단위로 디코딩할 때 더블 버퍼링 기법을 쉽게 사용할 수가 있다.

  • PDF

Thermal and Mechanical Properties for Micro-and-Nano- Mixture Composites Based Epoxy (에폭시기반 나노와 마이크로 혼합 콤포지트의 열적 그리고 기계적특성)

  • O, Chung-Youn;Yu, Byoung-Bok;Park, Jae-Jun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2010.03b
    • /
    • pp.31-31
    • /
    • 2010
  • Nano particles (10nm $SiO_2$) were silane-treated in order to modify the surface characteristics in a epoxy nanocomposite. Then, micro particles ($3{\mu}m$ SiO2) were poured into the epoxy nanocomposite using various mixing process and epoxy/micro-and-nanomixed composites (EMNC) were prepared. The thermal (Tg) and mechanical (tensile and flexural strength) properties were measured by DSC, DMA and UTM and the data was estimated by Weibull plot.

  • PDF

Mechanical Properties for Micro-and-Nano- Mixture Composites Based Epoxy Resins (에폭시기반 마이크로 그러고 나노입자가 혼합된 콤포지트의 기계적특성)

  • Kwon, Sun-Suk;Choi, Bo-Sung;Baek, Kwan-Hyun;Lee, Chang-Hoon;Park, Jae-Jun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2010.06a
    • /
    • pp.84-84
    • /
    • 2010
  • Nano particles (10nm SiO2) were silane-treated in order to modify the surface characteristics in a epoxy nanocomposite. Then. micro particles ($3{\mu}m$ SiO2) were poured into the epoxy nanocomposite using various mixing process and epoxy/ micro-and-nano- mixed composites (EMNC) were prepared. The thermal (Tg) and mechanical (tensile and flexural strength) properties were measured by DMA and UTM and the data was estimated by Weibull plot.

  • PDF

A Study on Thermal Properties for Epoxy Micro-and-Nano Mixture Composites(EMNC) (에폭시 마이크로-나노 입자가 혼합된 콤포지트의 열적특성에 관한연구)

  • Lee, Chang-Hoon;Kim, Kuk-Jin;Kim, Suk-Man;Kang, Do-Hoon;Yeon, Da-Som;Park, Jae-Jun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2010.06a
    • /
    • pp.83-83
    • /
    • 2010
  • This study investigates the thermal and mechanical properties of insulation elements through mixing epoxy based micro- and nano particles. Regarding thermal properties, DSC and DMA were used to calculate crosslinking densities for various types of insulation elements. In a mechanical property of bending strength, shape and scale parameters were obtained using the Weibull plot. This study obtained the most excellent results of scale parameters, such as Vol 3.2%, in the bending strength of EMNCs.

  • PDF

VLSI Design of Processor IP for TCP/IP Protocol Stack (TCP/IP프로토콜 스택 프로세서 IP의 VLSI설계)

  • 최병윤;박성일;하창수
    • Proceedings of the IEEK Conference
    • /
    • 2003.07b
    • /
    • pp.927-930
    • /
    • 2003
  • In this paper, a design of processor IP for TCP/IP protocol stack is described. The processor consists of input and output buffer memory with dual bank structure, 32-bit RISC microprocessor core, DMA unit with on-the-fly checksum capability. To handle the various modes of TCP/IP protocol, hardware and software co-design approach is used rather than the conventional state machine based design. To eliminate delay time due to the data transfer and checksum operation, DAM module which can execute the checksum operation on-the-fly along with data transfer operation is adopted. By programming the on-chip code ROM of RISC processor differently. the designed stack processor can support the packet format conversion operations required in the various TCP/IP protocols.

  • PDF

Interfacial and Thermal Characteristics of Natural Fiber Composites Reinforced with Henequen Surface-Treated with EBI

  • Pang Yansong;Han Seong Ok;Cho Donghwan;Drzal Lawrence T.
    • Proceedings of the Korean Society For Composite Materials Conference
    • /
    • 2004.10a
    • /
    • pp.88-91
    • /
    • 2004
  • In this study, a number of natural fiber henequen reinforced polymer matrix composites were successfully fabricated by means of a compression molding technique using chopped henequen fibers surface-treated with different electron beam irradiation (EBI) dosages, thermoplastic poly(butylene succinate), thermosetting unsaturated polyester and phenolic resins. Their interfacial and thermal characteristics were studied in terms of interfacial shear strength, fracture surface, dynamic mechanical properties, dimensional stability, and thermal stability using single fiber microbonding test, SEM, DMA, TMA, and TGA. The results show that their interfacial and thermal properties significantly depend on the intensity of EBl treatment on the natural fiber surface.

  • PDF

A Study on the Evaluation of the properties change of Aircraft Composites Parts During Repair by Thermal Analysis Test (열분석시험을 통한 항공기 복합재료 부품의 수리 시 반복경화에 따른 물성변화 측정에 관한 연구)

  • 엄수현;이상언;한중원;김국진;김영식;김윤해
    • Proceedings of the Korean Society For Composite Materials Conference
    • /
    • 2002.10a
    • /
    • pp.33-37
    • /
    • 2002
  • Recently, composites have been widely applied in the sporting goods, automobile, aerospace industry. As the use of advanced composites increase, specific techniques have been developed to repair damaged composite structures. In order to repair the damaged part, it is required that the material in the damaged area be removed first by utilizing the proper method, and prepreg be laid up in the area and cured under vacuum using the vacuum bagging materials. In curing process, either in an oven or autoclave is to be delamination can be occurred in the sound areas during and/or after the exposure to the elevated curing temperature in case that the repair process is repeated. Therefore, this study was conducted to evaluate the degree of degradation of properties of the cured parts and how it affects to the delamination phenomenon between laminated skin and honeycomb core.

  • PDF