• Title/Summary/Keyword: DEFORM

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Process Networks of Ecohydrological Systems in a Temperate Deciduous Forest: A Complex Systems Perspective (온대활엽수림 생태수문계의 과정망: 복잡계 관점)

  • Yun, Juyeol;Kim, Sehee;Kang, Minseok;Cho, Chun-Ho;Chun, Jung-Hwa;Kim, Joon
    • Korean Journal of Agricultural and Forest Meteorology
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    • v.16 no.3
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    • pp.157-168
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    • 2014
  • From a complex systems perspective, ecohydrological systems in forests may be characterized with (1) large networks of components which give rise to complex collective behaviors, (2) sophisticated information processing, and (3) adaptation through self-organization and learning processes. In order to demonstrate such characteristics, we applied the recently proposed 'process networks' approach to a temperate deciduous forest in Gwangneung National Arboretum in Korea. The process network analysis clearly delineated the forest ecohydrological systems as the hierarchical networks of information flows and feedback loops with various time scales among different variables. Several subsystems were identified such as synoptic subsystem (SS), atmospheric boundary layer subsystem (ABLS), biophysical subsystem (BPS), and biophysicochemical subsystem (BPCS). These subsystems were assembled/disassembled through the couplings/decouplings of feedback loops to form/deform newly aggregated subsystems (e.g., regional subsystem) - an evidence for self-organizing processes of a complex system. Our results imply that, despite natural and human disturbances, ecosystems grow and develop through self-organization while maintaining dynamic equilibrium, thereby continuously adapting to environmental changes. Ecosystem integrity is preserved when the system's self-organizing processes are preserved, something that happens naturally if we maintain the context for self-organization. From this perspective, the process networks approach makes sense.

Thermal Behavior and Crystallographic Characteristics of an Epitaxial C49-$TiSi_2$ Phase Formed in the Si (001) Substrate by $N_2$Treatment (Si (001) 기판에서 $N_2$처리에 의해 형성된 에피택셜 C49-$TiSi_2$상의 열적 거동과 결정학적 특성에 관한 연구)

  • Yang, Jun-Mo;Lee, Wan-Gyu;Park, Tae-Soo;Lee, Tae-Kwon;Kim, Joong-Jung;Kim, Weon;Kim, Ho-Joung;Park, Ju-Chul;Lee, Soun-Young
    • Korean Journal of Materials Research
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    • v.11 no.2
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    • pp.88-93
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    • 2001
  • The thermal behavior and the crystallographic characteristics of an epitaxial $C49-TiSi_2$ island formed in a Si (001) substrate by $N_2$, treatment were investigated by X-ray diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM). It was found from the analyzed results that the epitaxial $C49-TiSi_2$ was thermally stable even at high temperature of $1000^{\circ}C$ therefore did not transform into the C54-stable phase and did not deform morphologically. HRTEM results clearly showed that the epitaxial $TiSi_2$ phase and Si have the orientation relationship of (060)[001]$TiSi_2$//(002)[110]Si, and the lattice strain energy at the interface was mostly relaxed by the formation of misfit dislocations. Furthermore, the mechanism on the formation of the epitaxial $_C49-TiSi2$ in Si and stacking faults lying on the (020) plane of the C49 Phase were discussed through the analysis of the HRTEM image and the atomic modeling.

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Comparison of Approximate Nonlinear Methods for Incremental Dynamic Analysis of Seismic Performance (내진성능의 증분동적해석을 위한 비선형 약산법의 비교 검토)

  • Bae, Kyeong-Geun;Yu, Myeong-Hwa;Kang, Pyeong-Doo;Kim, Jae-Ung
    • Journal of the Earthquake Engineering Society of Korea
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    • v.12 no.1
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    • pp.79-87
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    • 2008
  • Seismic performance evaluation of structure requires an estimation of the structural performance in terms of displacement demand imposed by earthquakes on the structure. Incremental Dynamic Analysis(IDA) is a analysis method that has recently emerged to estimate structural performance under earthquakes. This method can obtained the entire range of structural performance from the linear elastic stage to yielding and finally collapse by subjecting the structure to increasing levels of ground acceleration. Most structures are expected to deform beyond the limit of linearly elastic behavior when subjected to strong ground motion. The nonlinear response history analysis(NRHA) among various nonlinear analysis methods is the most accurate to compute seismic performance of structures, but it is time-consuming and necessitate more efforts. The nonlinear approximate methods, which is more practical and reliable tools for predicting seismic behavior of structures, are extensively studied. The uncoupled modal response history analysis(UMRHA) is a method which can find the nonlinear reponse of the structures for ESDF from the pushover curve using NRHA or response spectrum. The direct spectrum analysis(DSA) is approximate nonlinear method to evaluate nonlinear response of structures, without iterative computations, given by the structural linear vibration period and yield strength from the pushover analysis. In this study, the practicality and the reliability of seismic performance of approximate nonlinear methods for incremental dynamic analysis of mixed building structures are to be compared.

Development of Polymer Elastic Bump Formation Process and Bump Deformation Behavior Analysis for Flexible Semiconductor Package Assembly (유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석)

  • Lee, Jae Hak;Song, Jun-Yeob;Kim, Seung Man;Kim, Yong Jin;Park, Ah-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.2
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    • pp.31-43
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    • 2019
  • In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

A Renal Size Discrepancy among the Findings of Renal Sonogram in Children with Their First Episode of Pyelonephritis is One of the Useful Parameters to Predict the Presence of Cortical Defects on the Acute DMSA Renal Scan

  • Kwon, Yoowon;Jin, Bo kyeong;Rhie, Seonkyeong;Lee, Jun Ho
    • Childhood Kidney Diseases
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    • v.23 no.1
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    • pp.36-42
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    • 2019
  • Purpose: We investigated whether a renal size discrepancy on a renal sonogram (US) in children with febrile urinary tract infection (UTI) was correlated with the presence of cortical defects on their dimercaptosuccinic acid (DMSA) renal scan. Methods: We examined 911 children who were admitted consecutively to our hospital with their first episode of febrile UTI from March 2001 to September 2014. All enrolled children underwent a US and DMSA scan during admission. According to the US findings, including the renal size discrepancy, data were compared between children with positive and negative DMSA scan results. A positive DMSA scan result was defined as reduced or absent tracer localization and indistinct margins that did not deform the renal contour. Results: Mean renal lengths of the right and left kidneys were larger in children with positive DMSA scan results than in children with negative DMSA scan results ($63.2{\pm}11.3mm$ vs. $58.4{\pm}7.8mm$, P<0.001; $64.9{\pm}11.2mm$ vs. $59.9{\pm}7.9mm$, P<0.001; respectively). A significant difference was observed in both renal lengths between children with positive and negative DMSA scan results ($4.6{\pm}3.8mm$ vs. $3.3{\pm}2.6mm$, P<0.001). A multiple logistic regression analysis, revealed that a small kidney, cortical thinning, and a renal length discrepancy on US findings were significant factors for predicting the presence of cortical defects on an acute DMSA scan [P=0.028, 95% confidence interval (CI) 1.054-2.547; P= 0.004, 95% CI 1.354- 4.810; P<0.001, 95% CI 1.077-1.190, respectively]. Conclusion: In conclusion, a renal size discrepancy on US findings in children with their first episode of febrile UTI was a helpful tool for predicting the presence of cortical defects on an acute DMSA scan.

A Comparison of Rheological Measurement Methods of Instant Cooked Rice by a Texture Analyzer (텍스처 분석기를 활용한 즉석밥 물성 측정 방법의 상호 비교)

  • Kim, Heesu;Oh, Im Kyung;Yang, Seonkyeong;Lee, Suyong
    • Food Engineering Progress
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    • v.22 no.4
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    • pp.381-385
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    • 2018
  • Various rheological methods to measure the hardness of instant cooked rice by a texture analyzer were investigated and compared. Specifically, instant white rice samples with a wide range of hardness were subjected to four different rheological tests with disk, cylinder, rod, and cone probe whose results were inter-correlated. All the measurements demonstrated that the hardness of instant rice was reduced with increasing moisture content and showed negatively linear relationships. Out of the four tests applied in this study, the highest coefficient of correlation ($R^2=0.9268$) was observed distinctly in the cone probe test, where both compressive and shear forces can be applied to deform individual rice grains. However, the cylinder probe test had the lowest coefficient of correlation ($R^2=0.7247$) because it may be ineffective in causing direct deformation of individual rice grains. Furthermore, when the hardness values (N) were converted to stress (Pa), highly linear correlations ($R^2{\approx}0.99$) were observed between the tests with similar probe geometry and force application.

A Study on the Release Characteristics During Wafer-Level Lens Molding Using Thermosetting Materials (열경화성 소재를 사용한 웨이퍼 레벨 렌즈 성형 중 이형 특성에 관한 연구)

  • Park, Si-Hwan;Hwang, Yeon;Kim, Dai-Geun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.1
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    • pp.461-467
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    • 2021
  • Among the defect factors that can occur when a wafer-level lens is molded using a thermosetting material, the mold sticking problem of a molded lens during the release process can damage the molded substrate and deform the substrate at the wafer level. An experiment was conducted to examine the factors affecting the demolding force in the lens forming process. The demolding force was examined according to the coating material of the molds. The mold was surface-treated with ITO and Ti, followed by plasma treatment in an O2 atmosphere. A DLC coating was then performed, and the curing and releasability were examined. A coating method for the pull-off experiment was selected based on the results. To measure the demolding force according to the curing process conditions, a method of curing at a constant pressure and a method of curing at a constant position were applied. As a result, the TiO2 surface treatment reduced the release force. When cured by controlling the location, curing shrinkage can reduce the adhesion energy of the interface during curing, resulting in better demolding.

An Accelerated IK Solver for Deformation of 3D Models with Triangular Meshes (삼각형 메쉬로 이루어진 3D 모델의 변형을 위한 IK 계산 가속화)

  • Park, Hyunah;Kang, Daeun;Kwon, Taesoo
    • Journal of the Korea Computer Graphics Society
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    • v.27 no.5
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    • pp.1-11
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    • 2021
  • The purpose of our research is to efficiently deform a 3D models which is composed of a triangular mesh and a skeleton. We designed a novel inverse kinematics (IK) solver that calculates the updated positions of mesh vertices with fewer computing operations. Through our user interface, one or more markers are selected on the surface of the model and their target positions are set, then the system updates the positions of surface vertices to construct a deformed model. The IK solving process for updating vertex positions includes many computations for obtaining transformations of the markers, their affecting joints, and their parent joints. Many of these computations are often redundant. We precompute those redundant terms in advance so that the 3-nested loop computation structure was improved to a 2-nested loop structure, and thus the computation time for a deformation is greatly reduced. This novel IK solver can be adopted for efficient performance in various research fields, such as handling 3D models implemented by LBS method, or object tracking without any markers.

Improved Cycle Performance of High-Capacity SiOx Negative Electrodes with Carbon Nanotube Conducting Agents for Lithium-Ion Batteries (탄소나노튜브 도전재 적용을 통한 리튬이온 이차전지용 고용량 SiOx 음극의 사이클 성능개선)

  • Hyang Sun Jeon;Ji Heon Ryu
    • Journal of the Korean Electrochemical Society
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    • v.26 no.3
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    • pp.35-41
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    • 2023
  • The carbon-coated silicon monoxide (c-SiOx), which is a negative electrode active material for lithium-ion batteries (LIBs), has a limited cycle performance due to severe volume changes during cycles, despite its high specific capacity. In particular, the significant volume change of the active material can deform the electrode structure and easily damage the electron transfer pathway. To improve performance and mitigate electrode damage caused by volume changes, we replaced parts of the carbon black conducting agent with carbon nanotubes (CNTs) having a linear shape. The content of the entire conductive material in the electrode was fixed at 10% by mass, and the relative content of CNTs ranged from 0% to 25% by mass to prepare electrodes and evaluate electrochemical performance. As the CNT content in the electrode increased, both cycle life and rate capability improved. Even a small amount of CNT can significantly improve the electrochemical performance of a c-SiOx negative electrode with large volume changes. Furthermore, dispersing CNTs effectively can lead to achieving the equivalent performance with a reduced quantity of CNTs.

Silica Aerogel Blanket Processing Technologies for Use as a Widespread Thermal Insulation Material (범용 단열재로 활용하기 위한 실리카 에어로젤 블랭킷의 처리 기술)

  • Jae-Wook Choi;Young Su Cho;Dong Jin Suh
    • Clean Technology
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    • v.29 no.4
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    • pp.237-243
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    • 2023
  • Aerogel is the most excellent insulation material known to date, but it is inflexible and has very low strength. A blanket containing aerogel in a nonwoven fabric or fiber is currently the most practical form. However, aerogel blankets are not yet widely used because they cannot avoid dust generation when handled, lack flexibility, and can possibly deform. In this study, vacuum treatment, surface treatment, and composite materialization technology were applied to solve this problem, and some prototypes were also made. If an aerogel blanket is wrapped in an aluminum sheet, sealed at the four ends, and vacuumed, it can become a material with better insulation than the blanket itself. An aerogel molded body can be made by coating the aerogel blanket with resin and treating the surface. If the aerogel blanket is multi-packed and laminated with resin or fiber in multiple layers to make it a composite material, it can be used as a flexible insulation material. In particular, this composite material, which utilizes a Teflon membrane with controlled pores, is breathable and waterproof, so it can be used for clothing. Prototypes of insoles for winter boots and outdoor roll mats were also produced using aerogel blanket resin and fiber composites. These prototypes showed low thermal conductivity of less than 20 mW m-1K-1, with good flexibility and durability.