• 제목/요약/키워드: DC transmission

검색결과 477건 처리시간 0.031초

Effects of Atmospheric Pressure Microwave Plasma on Surface of SUS304 Stainless Steel

  • Shin, H.K.;Kwon, H.C.;Kang, S.K.;Kim, H.Y.;Lee, J.K.
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.268-268
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    • 2012
  • Atmospheric pressure microwave induced plasmas are used to excite and ionize chemical species for elemental analysis, for plasma reforming, and for plasma surface treatment. Microwave plasma differs significantly from other plasmas and has several interesting properties. For example, the electron density is higher in microwave plasma than in radio-frequency (RF) or direct current (DC) plasma. Several types of radical species with high density are generated under high electron density, so the reactivity of microwave plasma is expected to be very high [1]. Therefore, useful applications of atmospheric pressure microwave plasmas are expected. The surface characteristics of SUS304 stainless steel are investigated before and after surface modification by microwave plasma under atmospheric pressure conditions. The plasma device was operated by power sources with microwave frequency. We used a device based on a coaxial transmission line resonator (CTLR). The atmospheric pressure plasma jet (APPJ) in the case of microwave frequency (880 MHz) used Ar as plasma gas [2]. Typical microwave Pw was 3-10 W. To determine the optimal processing conditions, the surface treatment experiments were performed using various values of Pw (3-10 W), treatment time (5-120 s), and ratios of mixture gas (hydrogen peroxide). Torch-to-sample distance was fixed at the plasma edge point. Plasma treatment of a stainless steel plate significantly affected the wettability, contact angle (CA), and free energy (mJ/$m^2$) of the SUS304 surface. CA and ${\gamma}$ were analyzed. The optimal surface modification parameters to modify were a power of 10 W, a treatment time of 45 s, and a hydrogen peroxide content of 0.6 wt% [3]. Under these processing conditions, a CA of just $9.8^{\circ}$ was obtained. As CA decreased, wettability increased; i.e. the surface changed from hydrophobic to hydrophilic. From these results, 10 W power and 45 s treatment time are the best values to minimize CA and maximize ${\gamma}$.

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Full Parametric Impedance Analysis of Photoelectrochemical Cells: Case of a TiO2 Photoanode

  • Nguyen, Hung Tai;Tran, Thi Lan;Nguyen, Dang Thanh;Shin, Eui-Chol;Kang, Soon-Hyung;Lee, Jong-Sook
    • 한국세라믹학회지
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    • 제55권3호
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    • pp.244-260
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    • 2018
  • Issues in the electrical characterization of semiconducting photoanodes in a photoelectrochemical (PEC) cell, such as the cell geometry dependence, scan rate dependence in DC measurements, and the frequency dependence in AC measurements, are addressed, using the example of a $TiO_2$ photoanode. Contrary to conventional constant phase element (CPE) modeling, the capacitive behavior associated with Mott-Schottky (MS) response was successfully modeled by a Havriliak-Negami (HN) capacitance function-which allowed the determination of frequency-independent Schottky capacitance parameters to be explained by a trapping mechanism. Additional polarization can be successfully described by the parallel connection of a Bisquert transmission line (TL) model for the diffusion-recombination process in the nanostructured $TiO_2$ electrode. Instead of shunt CPEs generally employed for the non-ideal TL feature, TL models with ideal shunt capacitors can describe the experimental data in the presence of an infinite-length Warburg element as internal interfacial impedance - a characteristic suggested to be a generic feature of many electrochemical cells. Fully parametrized impedance spectra finally allow in-depth physicochemical interpretations.

마그네트론 스파터시 금속 극박막의 실시간 전기저항과 미세구조 변화 (In-Situ Electrical Resistance and Microstructure for Ultra-Thin Metal Film Coated by Magnetron Sputtering)

  • 권나현;김회봉;황빈;배동수;조영래
    • 한국재료학회지
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    • 제21권3호
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    • pp.174-179
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    • 2011
  • Ultra-thin aluminum (Al) and tin (Sn) films were grown by dc magnetron sputtering on a glass substrate. The electrical resistance R of films was measured in-situ method during the film growth. Also transmission electron microscopy (TEM) study was carried out to observe the microstructure of the films. In the ultra-thin film study, an exact determination of a coalescence thickness and a continuous film thickness is very important. Therefore, we tried to measure the minimum thickness for continuous film (dmin) by means of a graphical method using a number of different y-values as a function of film thickness. The raw date obtained in this study provides a graph of in-situ resistance of metal film as a function of film thickness. For the Al film, there occurs a maximum value in a graph of in-situ electrical resistance versus film thickness. Using the results in this study, we could define clearly the minimum thickness for continuous film where the position of minimum values in the graph when we put the value of Rd3 to y-axis and the film thickness to x-axis. The measured values for the minimum thickness for continuous film are 21 nm and 16 nm for sputtered Al and Sn films, respectively. The new method for defining the minimum thickness for continuous film in this study can be utilized in a basic data when we design an ultra-thin film for the metallization application in nano-scale devices.

Fe 입자를 미세 분산 시킨 AlN 박막의 물리적 성질 (Physical Properties of Fe Particles Fine-dispersed in AlN Thin Films)

  • 한창석;김장우
    • 한국재료학회지
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    • 제21권1호
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    • pp.28-33
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    • 2011
  • This paper describes the fabrication of AlN thin films containing iron and iron nitride particles, and the magnetic and electrical properties of such films. Fe-N-Al alloy films were deposited in Ar and $N_2$ mixtures at ambient temperature using Fe/Al composite targets in a two-facing-target DC sputtering system. X-ray diffraction results showed that the Fe-N-Al films were amorphous, and after annealing for 5 h both AlN and bcc-Fe/bct-$FeN_x$ phases appeared. Structure changes in the $FeN_x$ phases were explained in terms of occupied nitrogen atoms. Electron diffraction and transmission electron microscopy observations revealed that iron and iron nitride particles were randomly dispersed in annealed AlN films. The grain size of magnetic particles ranged from 5 to 20 nm in diameter depending on annealing conditions. The saturation magnetization as a function of the annealing time for the $Fe_{55}N_{20}Al_{25}$ films when annealed at 573, 773 and 873 K. At these temperatures, the amount of iron/iron nitride particles increased with increasing annealing time. An increase in the saturation magnetization is explained qualitatively in terms of the amount of such magnetic particles in the film. The resistivity increased monotonously with decreasing Fe content, being consistent with randomly dispersed iron/iron nitride particles in the AlN film. The coercive force was evaluated to be larger than $6.4{\times}10^3Am^{-1}$ (80 Oe). This large value is ascribed to a residual stress restrained in the ferromagnetic particles, which is considered to be related to the present preparation process.

새로운 감폭회로를 사용한 CMOS RFID 트랜스폰더 IC 설계 (Design of a CMOS RFID Transponder IC Using a New Damping Circuit)

  • 오원석;이상훈;이강명;박종태;유종근
    • 대한전자공학회논문지SD
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    • 제38권3호
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    • pp.211-219
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    • 2001
  • 본 논문에서는 RFID를 위한 읽기 전용 CMOS 트랜스폰더를 one-chip으로 설계하였다. 리더에서 공급되는 자기장으로부터 트랜스폰더 칩의 전원을 공급하기 위한 전파정류기를 NMOS 트랜지스터를 사용하여 설계하였으며, 데이터 저장 소자로는 64비트의 ROM을 사용하였다. 메모리에 저장되어 있는 ID 코드는 Manchester 코딩되어 front-end 임피던스 변조 방식으로 리더에 전송된다. 임피던스 변조를 위한 감폭회로로는 리더와 트랜스폰더 사이의 거리가 변해도 일정한 감폭율을 갖는 새로운 감폭회로를 사용하였다. 설계된 회로는 0.65㎛ 2-poly, 2-metal CMOS 공정을 사용하여 IC로 제작되었다. 칩 면적은 0.9㎜×0.4㎜이다. 측정 결과 설계된 트랜스폰더 IC는 인식거리 내에서 약 20∼25%의 일정한 감폭율을 보이며, 125㎑의 RF에 대해 3.9kbps의 데이터 전송속도를 보인다. 트랜스폰더 칩의 전력소모는 읽기 모드시 약 100㎼이다. 인식거리는 약 7㎝이다.

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2.45 GHz대 저전력용 렉테나에 관한 연구 (A Study on a Rectenna for Low Power Density at 2.45 GHz)

  • 박동국;서홍은;조익현;김예지
    • 한국전자파학회논문지
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    • 제20권9호
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    • pp.862-867
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    • 2009
  • 본 논문에서는 2 mW/$cm^2$ 이하의 낮은 입력 전력 밀도에서 동작하는 2.45 GHz 렉테나를 제안하였다. 제안된 렉테나는 다이오드 2개를 사용하는 배전압 구조의 정류부와 다이오드에서 발생하는 2차 하모닉의 재 방사를 억압하기 위한 인쇄형 야기 안테나 구조를 사용하여 설계하였다. 인쇄형 야기 안테나는 2.45 GHz에서 약 5 dB의 이득을 가지며, 안테나를 통해 입력된 전력이 $0{\sim}14\;dBm$일 때 렉테나의 변환 효율은 $32{\sim}42%$으로 측정되었다. 개발된 렉테나는 저전력 소자의 전원 공급에 활용될 것으로 기대된다.

Low-Temperature Si and SiGe Epitaxial Growth by Ultrahigh Vacuum Electron Cyclotron Resonance Chemical Vapor Deposition (UHV-ECRCVD)

  • Hwang, Ki-Hyun;Joo, Sung-Jae;Park, Jin-Won;Euijoon Yoon;Hwang, Seok-Hee;Whang, Ki-Woong;Park, Young-June
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 1996년도 The 9th KACG Technical Annual Meeting and the 3rd Korea-Japan EMGS (Electronic Materials Growth Symposium)
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    • pp.422-448
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    • 1996
  • Low-temperature epitaxial growth of Si and SiGe layers of Si is one of the important processes for the fabrication of the high-speed Si-based heterostructure devices such as heterojunction bipolar transistors. Low-temperature growth ensures the abrupt compositional and doping concentration profiles for future novel devices. Especially in SiGe epitaxy, low-temperature growth is a prerequisite for two-dimensional growth mode for the growth of thin, uniform layers. UHV-ECRCVD is a new growth technique for Si and SiGe epilayers and it is possible to grow epilayers at even lower temperatures than conventional CVD's. SiH and GeH and dopant gases are dissociated by an ECR plasma in an ultrahigh vacuum growth chamber. In situ hydrogen plasma cleaning of the Si native oxide before the epitaxial growth is successfully developed in UHV-ECRCVD. Structural quality of the epilayers are examined by reflection high energy electron diffraction, transmission electron microscopy, Nomarski microscope and atomic force microscope. Device-quality Si and SiGe epilayers are successfully grown at temperatures lower than 600℃ after proper optimization of process parameters such as temperature, total pressure, partial pressures of input gases, plasma power, and substrate dc bias. Dopant incorporation and activation for B in Si and SiGe are studied by secondary ion mass spectrometry and spreading resistance profilometry. Silicon p-n homojunction diodes are fabricated from in situ doped Si layers. I-V characteristics of the diodes shows that the ideality factor is 1.2, implying that the low-temperature silicon epilayers grown by UHV-ECRCVD is truly of device-quality.

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Transparent Conductive Indium Zinc Tin Oxide Thin Films for Solar Cell Applications

  • ;이희영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.208-208
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    • 2010
  • Indium zinc tin oxide (IZTO) thin films were studied as a possible alternative to indium tin oxide (ITO) films for providing low-cost transparent conducting oxide (TCO) for thin film photovoltaic devices. IZTO films were deposited onto glass substrates at room temperature. A dc/rf magnetron co-sputtering system equipped with a ceramic target of the same composition was used to deposit TCO films. Earlier studies showed that the resistivity value of $In_{0.6}Zn_{0.2}Sn_{0.2}O_{1.5}$ (IZTO20) films could be lowered to approximately $6{\times}10^{-4}ohm{\cdot}cm$ without sacrificing optical transparency and still maintaining amorphous structure through the optimization of process variables. The growth rate was kept at about 8 nm/min while the oxygen-to-argon pressure ratio varied from 0% to 7.5%. As-deposited films were always amorphous and showed strong oxygen pressure dependence of electrical resistivity and electron concentration values. Influence of forming gas anneal (FGA) at medium temperatures was also studied and proven effective in improving electrical properties. In this study, the chemical composition of the targets and the films varied around the $In_{0.6}Zn_{0.2}Sn_{0.2}O_{1.5}$ (IZTO20). It was the main objective of this paper to investigate how off-stoichiometry affected TCO characteristics including electrical resistivity and optical transmission. In addition to the composition effect, we have also studied how film properties changed with processing variables. IZTO thin films have shown their potential as a possible alternative to ITO thin films, in such way that they could be adopted in some applications where currently ITO and IZO thin films are being used. Our experimental results are compared to those obtained for commercial ITO thin films from solar cell application view point.

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시간지연을 갖는 LonWorks/IP 가상 디바이스 네트워크에서 직류모터의 위치추종제어 (Tracking Position Control of DC Motor on LonWorks/IP Virtual Device Network with Time Delay)

  • 송기원
    • 전자공학회논문지SC
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    • 제43권4호
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    • pp.35-44
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    • 2006
  • LonWorks/IP 가상 디바이스 네트워크(VDN) 상의 전달지연은 실시간 분산제어 시스템의 성능과 안정성을 악화시킨다. LonWorks/IP VDN은 LonWorks 디바이스 네트워크와 IP( 데이터) 네트워크와의 통합네트워크이다. LonWorks/IP VDN 상에서의 서보제어를 수행할 경우 시간지연은 확률적인 특성을 강하게 나타낸다. 산업현장에 대한 예지보전을 위한 실시간 분산제어 환경에서 즉각적인 응답은 필수불가결한 요소이다. 그러므로 네트워킹 된 분산제어시스템의 안정성을 보장하고 성능을 개선하기 위해서는 시간에 따라 가변적인 불확실한 시간지연을 보상할 필요가 있다. 본 논문에서는 출력 되먹임 루프에 적절한 필터와 외란관측기를 이용한 제어기를 제안한다. 컴퓨터 모의실험을 통하여 제안된 제어기의 성능과 안정성이 Smith 예측기 기반의 내부모델제어기 (IMC)의 제어결과와 비교 제시된다. 제안된 제어기는 IMC 보다 안정성과 추종성능을 상당히 개선시킬 수 있으며 외란과 잡음에 강인한 특성을 갖는 것을 보인다. 그러므로 제안된 제어기는 가변적인 시간지연을 갖는 LonWorks/IP VDN 상에서 예지보전을 위한 실시간 분산제어에 매우 적합하다.

Mg-Ni 금속 간 화합물 나노입자의 형성과 수소저장 특성 (Formation and Hydrogen Absorption Properties of Intermetallic Mg-Ni Compound Nanoparticles)

  • 배유근;황철민;김종수;동성룡;김세웅;정영관
    • 한국수소및신에너지학회논문집
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    • 제28권3호
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    • pp.238-245
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    • 2017
  • Mg-Ni nanoparticles were synthesized by a physical vapor condensation method (DC arc-discharge) in a mixture of argon and hydrogen atmosphere, using compressed mixture of micro powders as the raw materials. The crystal phases, morphology, and microstructures of nanoparticles were analyzed by means of X-ray diffraction (XRD) and high-resolution transmission electron microscopy (HRTEM). It was found that the intermetallic compounds of $Mg_2Ni$ and $Mg_2Ni$ formed with existence of phases of Mg, Ni, and MgO in Mg-Ni nanoparticles. After one cycle of hydrogen absorption/desorption process (activation treatment), Mg-Ni nanoparticles exhibited excellent hydrogen absorption properties. $Mg_2Ni$ phase became the main phase by aphase transformation during the hydrogen treatments. The phenomenon of refinement of grain size in the nanoparticle was also observed after the hydrogen absorption/desorption processes, which was attributed to the effect of volume expansion/shrinkage and subsequent break of nanoparticles. Maximum hydrogen absorption contents are 1.75, 2.21 and 2.77 wt.% at 523, 573 and 623 K, respectively.