• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.4
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• pp.923-928
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• 2010

Anodic aluminum oxide (AAO) nanotemplates for nano electronic device applications have been attracting increasing interest because of ease of fabrication, low cost process, and possible fabrication in large area. The size and density of the nanostructured materials can be controlled by changing the pore diameter and the pole density of AAO nanotemplate. In this paper, nano porous alumina films AAO nanotemplate was fabricated by second anodization method using sputterd Al films. In addition, effects of electrolyte temperature and anodization voltate on the microstructure of porous alumina films were investigated. As the electrolyte temperature was increased from $8^{\circ}C$ to $20^{\circ}C$, the growth rate of nanoporous alumina films was increased from 86.2 nm/min to 179.5 nm/min. The AAO nanotemplate fabricated with optimal condition had the mean pore diameter of 70 nm and the pore depth of $1\;{\mu}m$.

• Journal of the Korean Magnetics Society
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• v.9 no.6
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• pp.285-290
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• 1999

The magnetic properties of sputtered amorphous $Fe_{86.7}Zr_{3.3}B_4Ag_6$ thin films, which contains an additional insoluble element Ag, have been investigated as a function of uniaxal field annealing temperature. The amorphous $Fe_{86.7}Zr_{3.3}B_4Ag_6$ thin films produced by relatively low temperature annealing at 40$0^{\circ}C$ for 1 hour was found to have very high permeability of 7800 at 50 MHz, 0.2 mOe, high magnetization of 1.7 T, low coercivity of 1.0 Oe and very low core loss of 1.4 W/cc at 1 MHz, 0.1 T, respectively. It is notable that the permeability and core loss values for various kinds of the soft magnetic thin films reported up to now. The reason for the appearance for the good soft magnetic properties is presumably due to the homogeneous formation of very fine bcc $\alpha$-Fe clusters with the size in the amorphous $Fe_{86.7}Zr_{3.3}B_4Ag_6$ thin films matrix, which can be deduced from the XRD results.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.180-180
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• 2000

Plasma source ion implantation is a new doping technique for the formation of shallow junction with the merits of high dose rate, low-cost and minimal wafer charging damage. In plasma source ion implantation process, the wafer is placed directly in the plasma of the appropriate dopant ions. Negative pulse bias is applied to the wafer, causing the dopant ions to be accelerated toward the wafer and implanted below the surface. In this work, inductively couples plasma was generated by anodized Al antenna that was located inside the vacuum chamber. The outside wall of Al chamber was surrounded by Nd-Fe-B permanent magnets to confine the plasma and to enhance the uniformity. Before implantation, the wafer was pre-sputtered using DC bias of 300B in Ar plasma in order to eliminate the native oxide. After cleaning, B2H6 (5%)/H2 plasma and negative pulse bias of -1kV to 5 kV were used to form shallow p+/n junction at the boron dose of 1$\times$1015 to 5$\times$1016 #/cm2. The as-implanted samples were annealed at 90$0^{\circ}C$, 95$0^{\circ}C$ and 100$0^{\circ}C$during various annealing time with rapid thermal process. After annealing, the sheet resistance and the junction depth were measured with four point probe and secondary ion mass spectroscopy, respectively. The doping uniformity was also investigated. In addition, the electrical characteristics were measured for Schottky diode with a current-voltage meter.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.310-315
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• 1993

The effects of RT A treatment on the breakdown strengths were studied for tantalum pentoxide(${Ta_2}{O_5}$) films prepared by thermal oxidation of dc-sputtered Ta(400$\AA$) on p-type (100) Si wafer. While the relative dielectric constants of the RT A -treated specimens were not remarkably affected, the breakdown strengths of the RTA-treated specimens were greatly changed by RTA temperature and time. After the RTA treatment, the breakdown strengths of the specimens RTA-treated at the temperature below the crystallization temperature were increased to 5.4MV /cm, while those of the specimens RTA -treated at the temperature above it were decreased to 0.5MV /cm. RTA time-independence of the flat-bant voltage shift refleted that the RT A post-annealing effects on the breakdown strengths were not due to the interface reaction between the ${Ta_2}{O_5}$ layer and the Si substrate but, through the RBS analysis, to densification of the ${Ta_2}{O_5}$ films.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.81-81
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• 2010

유리기판위에 큰 결정입자를 갖는 실리콘 (폴리 실리콘) 박막을 제조하는 것은 가격저가화 및 대면적화 측면 같은 산업화의 높은 잠재성을 가지고 있기 때문에 그동안 많은 관심을 가지고 연구되어 오고 있다. 다양한 방법을 이용하여 다결정 실리콘 박막을 만들기 위해 노력해 오고 있으며, 태양전지에 응용하기 위하여 연속적이면서 10um이상의 큰 입자를 갖는 다결정 실리콘 씨앗층이 필요하며, 고속증착을 위해서는 (100)의 결정성장방향 등 다양한 조건이 제시될 수 있다. 다결정 실리콘 흡수층의 품질은 고품질의 다결정 실리콘 씨앗층에서 얻어질 수 있다. 이러한 다결정 실리콘의 에피막 성장을 위해서는 유리기판의 연화점이 저압 화학기상증착법 및 아크 플라즈마 등과 같은 고온기반의 공정 적용의 어려움이 있기 때문에 제약 사항으로 항상 문제가 제기되고 있다. 이러한 관점에서 볼때 유리기판위에 에피막을 성장시키는 방법으로 많지 않은 방법들이 사용될 수 있는데 전자 공명 화학기상증착법(ECR-CVD), 이온빔 증착법(IBAD), 레이저 결정화법(LC) 및 펄스 자석 스퍼터링법 등이 에피 실리콘 성장을 위해 제안되는 대표적인 방법으로 볼 수 있다. 이중에서 효율적인 관점에서 볼때 IBAD는 산업화측면에서 좀더 많은 이점을 가지고 있으나, 박막을 형성하는 과정에서 큰 에너지 및 이온크기의 빔 사이즈 등으로 인한 표면으로의 damages가 일어날 수 있어 쉽지 않는 방법이 될 수 있다. 여기에서는 이러한 damage를 획기적으로 줄이면서 저온에서 결정화 시킬 수 있는 cold annealing법을 소개하고자 한다. 이온빔에 비해서 전자빔의 에너지와 크기는 그리드 형태의 렌즈를 통해 전체면적에 조사하는 것을 쉽게 제어할 수 있으며 이러한 전자빔의 생성은 금속 필라멘트의 열전자가 아닌 Ar플라즈마에서 전자의 분리를 통해 발생된다. 유리기판위에 흡수층 제조연구를 위해 DC 및 RF 스퍼터링법을 이용한 비정질실리콘의 박막에 대하여 두께별에 따른 밴드갭, 캐리어농도 등의 변화에 대하여 조사한다. 최적의 조건에서 비정질 실리콘을 2um이하로 증착을 한 후, 전자빔 조사를 위해 1.4~3.2keV의 다양한 에너지세기 및 조사시간을 변수로 하여 실험진행을 한 후 단면의 이미지 및 결정화 정도에 대한 관찰을 위해 SEM과 TEM을 이용하고, 라만, XRD를 이용하여 결정화 정도를 조사한다. 또한 Hall효과 측정시스템을 이용하여 캐리어농도, 이동도 등을 각 변수별로 전기적 특성변화에 대하여 분석한다. 또한, 태양전지용 흡수층으로 응용을 위하여 dark전도도 및 photo전도도를 측정하여 광감도에 대한 결과가 포함된다.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.79-79
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• 2010

다른 물질에 비해 많은 우수한 특성을 가지고 있는 CuInSe2(CIS)박막 태양전지는 많은 연구자들에 의해 개발되어 오고 있다. CIS의 대표적인 장점으로는 직접천이형 밴드갭, 높은 흡수계수, 열 안정화상태 및 p형으로의 전도성물질의 가능성 등 다양하다. 또한 간단한 구조를 이용하여 유리같은 싼 기판을 이용하기 때문에 저가형 태양전지로서 많은 각광을 받고 있다. CIGS태양전지는 CIS의 In 사이트에 Ga을 도핑함으로서 만들어지는데 밴드갭은 약 1.4eV이다. CIS박막을 만드는 많은 방법이 존재하나 구성원소로부터 최적화된 조성을 찾을수 있는 방법이 가장 중요한 요소 중의 하나로 인식되고 있으며, 이런점에서 증발법 및 스퍼터링법 등 같은 진공방식이 비진공방식에 비해 훨씬 간편하게 조성비를 맞출수 있다. 그 중에 스퍼터링법은 대면적 박막태양전지로의 가능성으로 비출어 볼때 산업화를 위한 좋은 후보군이 될 수 있다. Selenization을 하기전에 Cu-In-Se의 전구체 조합은 여러개의 타겟으로부터 동시 스퍼터링법이나 다층 전구체법을 사용하여 준비되는데 어떤 방법이 되던지 Se의 부가적인 공급은 불가피하다. 지금까지 많은 관련 연구의 대부분인 구조적, 조성비적 그리고 광학적인 특성평가에 집중되어 오고 있는데, 전기적특성평가의 경우는 면저항, 비저항 같은 간단한 결과 위주로 보고되어 오고 있다. 또한 캐리어농도와 이동도에 대한 보고가 있음에도 불구하고 이해되기에는 충분치 못한 면이 많다.본 발표에서는 태양전지 제조 전단계로서 소다라임유리기판(SLG)위에 Mo의 유무에 따라 CIS박막의 전기적인 특성 변화에 대한 내용을 담고 있다. 소다라임유리($2cm{\times}2cm$)를 기판으로 사용하여 아세톤-에탄올 용액에 초음파세척을 수행하고, Mo 후면전극을 DC 스퍼터링방식을 이용하여 증착을 한다. SLG와 Mo이 코팅된 SLG를 각각 RF 스퍼터 챔버에 이송한 후 수증기 제거를 위해 약 10분간 예열을 한다. 샘플에 대한 전기적특성은 Hall효과 측정장치에 의해 측정이 되며 전기전도도, 캐리어농도, 이동도 및 전도형에 대한 정보가 각각의 변수에 따라 조사된돠. 부가적으로 구조적, 조성비적인 특성을 SEM,XRD 및 EDX를 통해 조사를 하여 전기적 특성에 따른 관계성을 검토한다. SLG와 Mo가 코팅된 SLG위의 CIS박막은 전기적으로 약간 다른 특성을 보일 것으로 예측되며, 이러한 기대를 바탕으로 조성비가 이상적인 화학양론에 근접할 때 p형으로서 제시될 수 있다는 것을 보여줄 것이다.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.935-942
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• 2002

Gallium-doped ZnO (GZO) films were deposited on soda-lime glass substrate without heating using Ne, Ar, or Kr gas. Electrical properties of GZO films deposited at various total gas pressures were investigated for the film positions corresponding to the erosion region (region B) and outside the erosion region (region A) of the target. Region B showed high resistivity, which was attributed to the decrease in carrier density and Hall mobility, compared to region A. GZO films deposited using Ne gas showed the degradation in resistivity and crystallinity, whereas, GZO films deposited using Kr gas showed the improvement in resistivity and crystallinity. This degradation in film properties could be attributed to the film damage caused by the bombardment of high-energy particles. Especially, the energies of recoiled neutral atoms ($Ne^0,\;Ar^0,\;Kr^0$) calculated by Monte Carlo simulation corresponded to experimental results.

• Korean Journal of Materials Research
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• v.20 no.10
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• pp.501-507
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• 2010

Changes in surface morphology and roughness of dc sputtered ZnO:Al/Ag back reflectors by varying the deposition temperature and their influence on the performance of flexible silicon thin film solar cells were systematically investigated. By increasing the deposition temperature from $25^{\circ}C$ to $500^{\circ}C$, the grain size of Ag thin films increased from 100 nm to 1000 nm and the grain size distribution became irregular, which resulted in an increment of surface roughness from 6.6 nm to 46.6 nm. Even after the 100 nm thick ZnO:Al film deposition, the surface morphology and roughness of the ZnO:Al/Ag double structured back reflectors were the same as those of the Ag layers, meaning that the ZnO:Al films were deposited conformally on the Ag films without unnecessary changes in the surfacefeatures. The diffused reflectance of the back reflectors improved significantly with the increasing grain size and surface roughness of the Ag films, and in particular, an enhanced diffused reflectance in the long wavelength over 800 nm was observed in the Ag back reflectors deposited at $500^{\circ}C$, which had an irregular grain size distribution of 200-1000 nm and large surface roughness. The improved light scattering properties on the rough ZnO:Al/Ag back reflector surfaces led to an increase of light trapping in the solar cells, and this resulted in a noticeable improvement in the $J_{sc}$ values from 9.94 mA/$cm^2$ for the flat Ag back reflector at $25^{\circ}C$ to 13.36 mA/$cm^2$ for the rough one at $500^{\circ}C$. A conversion efficiency of 7.60% ($V_{oc}$ = 0.93, $J_{sc}$ = 13.36 mA/$cm^2$, FF = 61%) was achieved in the flexible silicon thin film solar cells at this moment.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.215-220
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• 2001

Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.155.2-155.2
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• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.