• Journal of Magnetics
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• v.1 no.2
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• pp.86-89
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• 1996

The dc magnetron sputter deposited (Pt/Co/Pt/Ni) multilayers which exhibited Curie temperatures in the range of 150-$300^{\circ}C$ were studied as possible alternative multilayers for magneto-optical recording to the widely studied Co/Pt, whose Curie temperatures are in the range of 200~$400^{\circ}C$. The Coercivities of these multilayers were between 450 Oe and 800 Oe. These multilayers exhibited comparable magnetic and magneto-optical properties to Co/Pt multilayers with enhancement of the Kerr rotation at lower wavelengths and negligible Kerr ellipticity over a wide range of the spectrum (4000~7000$\AA$ ).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.725-728
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• 2001

We have fabricated thin films using the DC/RF magnetron sputtering of 74wt%Ni-l8wt%Cr-4wt%Al-4wt%Cu alloy target and studied the effect of the process parameters on the electrical properties for low TCR(Temperature Coefficient of Resistance) films. In sputtering process, pressure, power and substrate temperature, are varied as controllable parameter. The films are annealed to 400$^{\circ}C$ in air and nitrogen atmosphere. The sheet resistance, TCR of the films increases with increasing annealing temperature. It abruptly increased as annealing temperature increased over 300$^{\circ}C$ in air atmosphere. From XRD, it is found that these results are due to the existence of NiO on film surface formed by annealing. As a results of them, TCR can be controlled by variation of sputter process parameter and annealing of thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.199-200
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• 2006

Transparent conductive alum mum-doped ZnO (AZO) films have been prepared on polycarbonate (PC), Coring 7059 and Quartz substrates by DC sputtering method at room temperature. Films deposited was evaluated about spectra of X-ray diffraction and transmittance and characteristics of films deposited as kind of substrate was compared. Films deposited showed (002) orientation and all AZO films are transparent over 80% within the visible wavelength region.

• Journal of the Korean institute of surface engineering
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• v.40 no.5
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• pp.209-213
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• 2007

Change of the plasma volume by pulse frequency in a bipolar pulsed DC unbalanced magnetron sputtering was investigated. As increasing the frequency at off duty 10% and at a constant power, the plasma volume was lengthened in vertical direction from the AZO target. When there is an electrically floated substrate, the vertical length of the plasma area was not affected by the pulse frequency. Instead, the diameter of the plasma volume was increased. We found that the temperature rise of a substrate was affected by the pulse frequency, too. As increasing it, the maximum temperature rise of a glass substrate was decreased from $132^{\circ}C\;to\;108^{\circ}C$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.6
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• pp.283-287
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• 2002

We have studied Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate for application of interconnection metal in ULSI circuits. Zr(Si)N film was deposited with reactive DC magnetron sputtering system using $Ar/N_2$mixed gas. The value of the resistivity was the lowest for the ZrN film using 29 : 1 of Ar : $N_2$reactant gas ratio at room temperature and decreased with increasing of Si substrate temperature. As the value of ZrN film resistivity was decreased, the direction of crystal growth was toward to (002) plane. The barrier property of ZrN film added with Si was improved. But Si was added too much in ZrN film, the barrier property was degraded. The adhesive property was improved with increasing of Si in ZrN. For the analysis of the film, XRD, Optical microscopy, Scretch tester, so on were used.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.9
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• pp.589-593
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• 2014

AlNO multi-layer thin films on aluminum substrates were prepared by DC reactive magnetron sputtering method. $Al_2O_3$/AlNO(LMVF)/AlNO(HMVF)/Al/substrate of 4 multi-layer has been prepared in an Ar and ($N_2+O_2$) gas mixture, and $Al_2O_3$ of top layer is anti-reflection layer on double AlNO(LMVF)/AlNO(HMVF) layers and Al metal of infrared reflection layer. In this study, the roughness and surface properties of AlNO thin films were estimated by field emission scanning electron microscopy(FE-SEM). The grain size of AlNO thin films increased with increasing sputtering power. The composition of thin films has been systematically investigated using electron probe microanalysis(EPMA). The optical properties with wavelength spectrum were recorded by UV-Vis-NIR spectrophotometry at a range of 200~1,500 nm. The absorptance of AlNO films shows the increasing trend with swelling ($N_2+O_2$) gas mixture in HMVF and LMVF deposition. The excellent optical performance showed above 98% of absorptance in visible wavelength region.

• Korean Journal of Materials Research
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• v.24 no.4
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• pp.194-200
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• 2014

Metallic Cr film coatings of $1.2{\mu}m$ thickness were prepared by DC magnetron sputter deposition method on c-plane sapphire substrates. The thin Cr films were ammoniated during horizontal furnace thermal annealing for 10-240 min in $NH_3$ gas flow conditions between 400 and $900^{\circ}C$. After annealing, changes in the crystal phase and chemical constituents of the films were characterized using X-ray diffraction (XRD) and energy dispersive X-ray photoelectron spectroscopy (XPS) surface analysis. Nitridation of the metallic Cr films begins at $500^{\circ}C$ and with further increases in annealing temperature not only chromium nitrides ($Cr_2N$ and CrN) but also chromium oxide ($Cr_2O_3$) was detected. The oxygen in the films originated from contamination during the film formation. With further increase of temperature above $800^{\circ}C$, the nitrogen species were sufficiently supplied to the film's surface and transformed to the single-phase of CrN. However, the CrN phase was only available in a very small process window owing to the oxygen contamination during the sputter deposition. From the XPS analysis, the atomic concentration of oxygen in the as-deposited film was about 40 at% and decreased to the value of 15 at% with increase in annealing temperature up to $900^{\circ}C$, while the nitrogen concentration was increased to 42 at%.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.213-213
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• 1999

현재 LCD용 기판재료는 ITO/glass를 전극으로 사용하고 있다. 그러나 유리기판은 무겁고 깨지기 쉽기 때문에 사용상 곤란한 점이 많다. 최근 flexible하고 가공성 및 생산성이 우수한 플라스틱한 ITO를 성막하여 EL용, Touch panel, plastic LCD용 사용하려는 시도로, roll-to-roll 연속 스퍼터링에 의한 ITO성막공정에 대한 연구가 최근 활발하게 이루어지고 있다. 폴리머는 유리에 비해 Tg 온도가 낮고, 기판으로부터의 수분 및 여러 종류의 가스방출이 심하기 때문에 유리와는 달리 ITO막의 제조에 있어 큰 차이점이 있다. 따라서, 폴리머에 반응성 스퍼터링을 하기 위해서는 표면처리가 중요한 변수가 되며, roll to roll sputter로 ITO 필름을 얻기 위해서는 폭과 길이 방향으로 균일한 막을 얻는 것이 중요하다. 두께 75$\mu\textrm{m}$, 폭 190mm, 길이 400m로 권취된 광학용 Polyethylene terephthalate(PET:Tg:8$0^{\circ}C$)위에 In-10%Sn의 합금타겟과 Unipolar pulsed DC power supply를 사용하여 반응성 마그네트론 스퍼터링 방법으로 0.2m/min의 속도로 연속 스퍼터링 하였다. PET를 Ar/O2 혼합가스로 플라즈마 전처리를 한 후, AFM, XPS를 이용하여 효과를 분석을 하였고, 성막전에 가스방출을 막기 위해 TiO를 코팅하였다. Pilot 연속 생산공정에서 재현성을 위해 PEM(Plasma Emission Monitor)의 optical emission spectroscopy를 이용, 금속과 산화물의 천이구역에서 sprtter된 I/Sn 이온과 산소 이온의 반응에 의한 최적의 플라즈마의 강도값을 입력하여 플라즈마의 radiation을 검출하고, 스퍼터링 공정중 실질적인 in-situ 정보로 이용하였다. PEM을 통하여 In/Sn의 플라즈마 강도변화를 조사하였다. 초기 In/Sn의 플라즈마 강도(intensity)는 강도를 100하여, 산소를 주입한 결과, plasma intensity가 35 줄어들었고, 이때 우수한 ITO 박막을 얻을 수 있었다. Pulsed DC power를 사용하여 아크 현상을 방지하였다. PET 상에 coating 된 ITO 박막의 표면저항과 광투과도는 4-point prove와 spectrophotometer를 이용하여 분석하였고, AES로 박막의 두께에 따른 성분비를 확인하였다. ITO 박막의 광투과도는 산소의 유량과 sputter 된 In/Sn ion의 plasma emission peak에 따라 72%-92%까지 변화하였으며, 저항은 37$\Omega$/$\square$ 이상을 나타내었다. 박막의 Sn/In atomic ratio는 0.12, O/In의 비율은 In2O3의 화학양론적 비율인 1.5보다 작은 1.3을 나타내었다.

• Journal of the Korean institute of surface engineering
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• v.46 no.4
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• pp.168-174
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• 2013

In this study, low-cost, high-speed deposition, excellent processability, high mechanical strength and electrical conductivity, chemical stability and corrosion resistance of stainless steel to meet the obsessive-compulsive (0.1 mm or less) were selected CrN thin film. new price reduction to sputter deposition causes - the possibility of sublimation source for inductively coupled plasma Cr rods were attempts by DC bias. 0.6 Pa Ar inductively coupled plasmas of 2.4 MHz, 500 W, keeping Cr Rod DC bias power 30 W (900 V, 0.02 A) is applied, $N_2$ flow rate of 0.5, 1.0, 1.5 sccm by varying the characteristics of were analyzed. $N_2$ flow rate increases, decreases and $Cr_2N$, CrN was found to increase. In addition to corrosion resistance and contact resistance, corrosion resistance, electrical conductivity was evaluated. corrosion current density than $N_2$ 0 sccm was sure to rise in all, $N_2$ 1 sccm at $4.390{\times}10^{-7}$ (at 0.6 V) $A{\cdot}cm^{-2}$, respectively. electrical conductivity process results when $N_2$ 1 sccm 28.8 $m{\Omega}/cm^2$ with the lowest value of the contact resistance was confirmed that came out. The OES (SQ-2000) and QMS (CPM-300) using a reactive deposition process to add $N_2$ to maintain a uniform deposition rate was confirmed that.

• Journal of the Korean Vacuum Society
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• v.12 no.2
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• pp.136-143
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• 2003

In this paper, high purity RF sputter-type ion source for non-mass separated ion beam deposition was evaluated. The fundamental characteristics of the ion source which is composed of an RF Cu coil and a high purity Cu target (99.9999 %) was studied, and the practical application of Cu thin films for ULSI metallization was discussed. The relationship between the DC target current and the DC target voltage at various RF power and Ar gas pressures was measured, and then preparation conditions for Cu thin films was described. As a result, it was found that the deposition conditions of the target voltage, the target current and the Ar pressure were optimized at -300 V, 240 W and 9 Pa, respectively. The resistivity of Cu films deposited at a bias voltage of -50 V showed a minimum value of 1.8 $\pm$ 0.1 $mu\Omega$cm, which is close to that of Cu bulk (1.67 $mu\Omega$cm).