• Tribology and Lubricants
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• 제35권1호
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• pp.1-8
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• 2019

Demand for plastic gears are increasing in many industries due to their low production cost, light weight, applicability without lubricant, corrosion resistance and high resilience. Despite these benefits, utilizing plastic gears is limited due to their poor material properties. In this work, DLC coating was applied to improve the tribological properties of polyamide66 gear. 0 V, 40 V, and 70 V of negative bias voltages were selected as a deposition parameter in DC magnetron sputtering system. Pin-on-disk experiment was performed in order to investigate the wear characteristics of the gears. The results of the pin-on-disk experiment showed that DLC coated polyamide66 with 40 V of negative bias voltage had the lowest friction coefficient value (0.134) and DLC coated PA66 with 0 V of negative bias voltage showed the best wear resistance ($9.83{\times}10^{-10}mm^3/N{\cdot}mm$) among all the specimens. Based on these results, durability tests were conducted for DLC coated polyamide66 gears with 0 V of negative bias voltage. The tests showed that the temperature of the uncoated polyamide66 gear increased to about $37^{\circ}C$ while the DLC coated gear saturated at about $25^{\circ}C$. Also, the power transmission efficiency of the DLC coated gear increased by about 6% compared to those without coating. Weight loss of the polyamide66 gears were reduced by about 73%.

• 대한전자공학회논문지SD
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• 제43권4호
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• pp.8-15
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• 2006

본 논문에서는 70 nm InGaAs/InAlAs MHEMT와 DAML 기반의 하이브리드 링 결합기를 이용하여 낮은 변환 손실과 높은 격리도 특성을 갖는 94 GHz 단일 평형 혼합기를 개발하였다. 혼합기에 사용된 MHEMT는 607 mA/mm의 드레인 전류 밀도, 1015 mS/mm의 전달컨덕턴스, 330 GHz의 전류이득차단주파수, 425 GHz의 최대공진주파수 특성을 나타내었다. 제작된 하이브리드 링 결합기는 $85GHz{\sim}105GHz$의 범위에서 $3.57{\pm}0.22dB$의 커플링 손실과 $3.80{\pm}0.08dB$의 삽입 손실 특성을 나타내었다. 혼합기의 측정 결과, $93.65GHz{\sim}94.25GHz$의 범위에서 $2.5dB{\sim}2.8dB$의 변환 손실 특성과 -30 dB 이하의 격리도 특성을 얻었으며, 94 GHz의 중심주파수에서 6 dBm의 LO 전력을 인가하였을 때 2.5 dB의 최소 변환 손실 특성을 얻었다. 변환 손실 및 격리도 특성을 고려할 때, 본 논문에서 개발된 혼합기의 특성은 지금까지 보고된 GaAs 기반 HEMT소자들을 사용하는 94 GHz 대역용 혼합기 중에 가장 우수한 결과물이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.155.2-155.2
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• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.