• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
• /
• pp.178-181
• /
• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• 한국기계가공학회지
• /
• 제8권2호
• /
• pp.18-24
• /
• 2009

The most dominate aspect in machine works using CNC devices in industrial production processes is the precision of the product and the Cycle Time. To this day, many studies on the external factors of the technology to reduce the Cycle Time have advanced amid to the advancements in cam soft development for manual programs and the numerous studies on high speed and precision machining. This study experimented various functions of the sequence pattern flow and arranged system development technologies of past few years to develop and applicate various usage of adjustment factors within the CNC, so it would be more understandable to the user and would enable them to make high speed and precision products more faster develop and. In order to reduce the Cycle Time, the mechanism of machine tools has to be analysed and applied, in addition to program reduction and improvement of the manufacture process.

• Biotechnology and Bioprocess Engineering:BBE
• /
• 제8권6호
• /
• pp.349-353
• /
• 2003

The physiological characteristics of cultures of very high cell mass (e.g. 10g cell mass/L), termed“ultrahigh cell density cultures”is reviewed. A close relationship was found between the length of the optical path (OP) in flat-plate reactors and the optimal cell density of the culture as well as its areal (g m$\^$-2/ day$\^$-1/) productivity. Cell-growth inhibition (GI) unfolds as culture density surpasses a certain threshold. If it is constantly relieved, a 1.0cm OP reactor could produce ca. 50% more than reactors with longer OP, e.g. 5 or 10cm. This unique effect, discovered by Hu et al. [3], is explained in terms of the relationships between the frequency of the light-dark cycle (L-D cycle), cells undergo in their travel between the light and dark volumes in the reactor, and the turnover time of the photosynthetic center (PC). In long OP reactors (5cm and above) the L-D cycle time may be orders of magnitude longer than the PC turnover time, resulting in a light regime in which the cells are exposed along the L-D cycle, to long, wasteful dark periods. In contrast, in reactors with an OP of ca. 1.0 cm, the L-D cycle frequency approaches the PC turnover time resulting in a significant reduction of the wasteful dark exposure time, thereby inducing a surge in photosynthetic efficiency. Presently, the major difficulty in mass cultivation of ultrahigh-density culture (UHDC) concerns cell growth inhibition in the culture, the exact nature of which is awaiting detailed investigation.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2001년도 하계종합학술대회 논문집(5)
• /
• pp.103-106
• /
• 2001

In this paper, a soft switching half-bridge converter using secondary switches for output control and conduction loss reduction is proposed. The conventional half-bridge converter must be fixed on duty cycle for soft switching. The proposed converter was consisted of two added switches in series of the secondary rectifier diodes. The main switches with constant duty cycle are operated ZVS. The secondary switches are operated ZV-ZCS. Especially, the primary switches were fixed duty cycle for maximum voltage conversion ratio. Output of converter is controlled by duty cycle or phase-shifted time of secondary switches. The conduction loss of the proposed converter can be reduced by the secondary switches. The operation characteristic, analysis, simulation and experimental results of the proposed converter are presented.

• 전기전자학회논문지
• /
• 제22권4호
• /
• pp.1210-1213
• /
• 2018

In this paper, we propose a method to reduce the amount of current through the Timing Control of the duty cycle and the Report Attribute Control at the MAC Layer in consideration of the Sleep Mode under the IoT wireless environment. The use of a duty cycle is an effective way to reduce energy consumption on wireless sensor networks where the node is placed in sleep mode periodically. In particular, we studied how to control power efficiency through duty rate in Short Transition Time and ACK Time processing while satisfying radio channel limitation criterion. When comparing before and after the improvement considering the delay time constraint, we validated the correlation of the electrical current reduction.

• Journal of Advanced Marine Engineering and Technology
• /
• 제30권1호
• /
• pp.42-49
• /
• 2006

In this research. the diesel cycle was thermodynamically interpreted to evaluate the possibility of high efficiency by converting diesel engines to the high expansion diesel cycle, and general cycle features were analyzed after comparing these two cycles. Based on these analyses. an experimental single cylinder a long stroke with high expansion-diesel engine. of which S/B ratio was more than 3, was manufactured. After evaluating the base engine through basic experiments, a diesel engine was converted into the high expansion diesel engine by establish VCR device and VVT system Accordingly, the high expansion diesel cycle can be implemented when the quantity of intake air is compensated by supercharge and the effective compression ratio is maintained at its initial level through the reduction of the clearance volume. In this case, heat efficiency increased by $5.0\%$ at the same expansion-compression ratio when the apparent compression ratio was 20 and the fuel cut off ratio was 2. As explained above, when the atkinson cycle was used for diesel cycle, heat efficiency was improved. In order to realize high expansion through retarding the intake value closing time, the engine needs to be equipped with variable valve timing equipment, variable compression ratio equipment and supercharged pressure equipment. Then a high expansion diesel cycle engine is realized.

• 한국기계가공학회지
• /
• 제17권5호
• /
• pp.84-90
• /
• 2018

When producing a plastic horn cover for an automobile, since the interval between the ribs on the inner surface is narrow, conventional cooling channels cannot be applied and cooling of the mold is difficult. For this reason, the molding operation cannot be completed within a set cycle time. In this study, a conformal cooling channel was applied on the mold to solve the cooling problem. Injection molding simulation was carried out to confirm the effectiveness of the conformal cooling channel. In the analysis results, the mold temperature at the rib section decreased by 33%, and the mold temperature also decreased by 31%. This reduction in temperature allowed for molding within a set cycle time and demonstrated the effectiveness of the conformal cooling channel.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
• /
• pp.176-180
• /
• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 추계학술대회 논문집
• /
• pp.176-180
• /
• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 소성∙가공
• /
• 제14권4호
• /
• pp.368-374
• /
• 2005

In the present study we used a diagrammatic analysis of 6 sigma quality control and Taguchi method for injection molding of monitor back-cover, evaluated the influence on the cycle time with part design, mold design, molding process and standardization activity involving design and molding, adopted analysis of sensitivity and effective factors of the part design and molding process conditions for productivity, identified main design molding factors. The contributing factors for the final cycle time could be enumerated as follows; the thickness of hot spot, main nominal part thickness, coolant inlet temperature, melt temperature and cooling line layout, etc.. As a first step, all the critical factors of design process applied to the current monitor housing were investigated through 6 sigma process. Thereafter, the optimal and better critical factors found in the first step were applied to new product design to prove that our process was correct. The Moldflow was used for injection molding simulation, and Minitab software for the statistical analysis, respectively. Finally, the productivity of new design was increased about 33 percents for our specific case.