• 제목/요약/키워드: Cutting and Peeling

검색결과 28건 처리시간 0.024초

김치생산용 알타리무 전처리가공시스템 개발(II) - 평면형 삭피칼날의 최적형상 - (Development of the Altari Radish Pre-processing System for Kimchi Production(II) - Optimum Cutter Shape for Plane Peeling -)

  • 민영봉;김성태;강동현
    • Journal of Biosystems Engineering
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    • 제30권3호
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    • pp.161-165
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    • 2005
  • In this study, peeling test of the Altari radish on kimchi pre-processing system for mechanization was performed with the longitudinal plane peeling type with wider cutting blade than that of the peeled chip's. To determine the optimum cutter shape to match this plane peeling type, the peeling tests depending on variable cutting speed, rake angle and blade angle using the blade with thickness as 2 m and width as 50mm were performed, and the patterns of the peeled chips and peeling resistances were investigated. As the result of the tests, the rake angle of the blade with clean peeled surface of the Altari radish was over $45^{\circ}$, and the blade angle and rake angle with the minimum peeling resistance was $20^{\circ}\;and\;60^{\circ}$, respectively. The optimum peeling conditions were; the peeling speed 0.2m/s, blade angle $20^{\circ}$ and the rake angle $60^{\circ}$, and the peeling resistance of each blade was 15 N.

밤 박피 시스템 개발 (Development of Chestnut Peeling System)

  • 김종훈;박재복;최창현
    • Journal of Biosystems Engineering
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    • 제22권3호
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    • pp.289-294
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    • 1997
  • The chestnut is a well-known and important forest product in Korea. The annual production of chestnut is about 100, 000tons and its cultivating area is 80, 000ha. However, the peeling process of outer and inner skins of chestnut is very difficult due to hardness and adhesiveness of chestnut skin. The peeling process of chestnut was operated by manual work and the performance of chestnut peeling machine is very low. The purpose of this study is to develope the prototype of new chestnut peeling system. The hardness of chestnuts was tested with six different drying conditions and its range was from 949$g/mm^2$ to 2, 149$g/mm^2$. The hardness of chestnuts was decresed gradually during the drying process. The chestnut peeling Process includes sorting, storage, drying, outer skin cutting, flame peeling, continuous frictional skin peeling, and inner skin cutting operation. The developed chestnut peeling system consists of outer skin cutter, flame peeler, continuous frictional skin peeler and inner skin cutter. The system can peel domestic chestnuts at 150$kg/hr$ with peeling rate of 78%.

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알타리무 삭피용 최적 칼날형상의 구명 (Determination of Optimum Cutter Shape for Peeling Altari Radish)

  • 민영봉;김성태;강동현;정태상
    • Journal of Biosystems Engineering
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    • 제28권5호
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    • pp.421-428
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    • 2003
  • This study was conducted to determine the optimum blade shape for peeling Altari radish. To figure out the required peeling force according to various angles of blade and rakes of peeling cutter, two peeling tests such as circumferential peeling and longitudinal peeling of Altari radish were carried out. Based on the pretest results, which performed to investigate the applicability of the optimum shape of cutter and to find out the cutting pattern according to the lapse of days after harvesting the radish, the peeling depth and width of the blade were fixed at 2 mm and 10 mm. From two methods of circumferential and longitudinal peeling test, the angles of rake and blade as cutter shape factors were affected on peeling force. But the peeling speed was not affected on it under the safety speed as 0.2 m/s, without blade vibrating on peeling operation. The rake angle was more effective factor than the blade angle, and the optimum angles of blade and rake were 10$^{\circ}$ and 55$^{\circ}$ respectively. The cutting surface by the longitudinal peeling was more smooth than that by the circumferential peeling. There was no problem in peeling work during 4 days after harvest because the freshness of the Altari radish was maintained.

근채류(감자, 고구마, 당근)의 탈피조작 (Peeling Operations of Root Vegetables: Potato, Sweet Potato and Carrot)

  • 이철호;이순우
    • 한국식품과학회지
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    • 제16권3호
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    • pp.329-335
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    • 1984
  • 탈피 방법에 따른 감자류와 당근의 탈피효율과 제품의 품질을 연구하였다. 재료의 구형도와 중량이 탈피효율에 미치는 영향을 조사하였으며, 탈피 후에 표피 조직감의 변화를 Rheometer로 측정하고 세포조직의 변화를 비교하였다. 연마형 회전식 기계적 탈피의 조건은 감자는 300rpm에서 90초, 고구마는 300rpm에서 70초, 당근은 300rpm에서 60초 이었다. 탈피 손실율은 재료의 구형도와 중량에 의해 영향을 받았다. 알카리 탈피의 최적조건은 10% NaOH 끓는 용액에서 감자는 90초, 고구마는 300초 이였으며 당근은 6% NaOH 끓는 용액에서 60초 이었다. 탈피에 의한 표피 조직감의 변화는 Rheometer의 절단력 실험에 의해 명확히 나타났고. 이것은 광학현미경을 이용하여 관찰된 표피 조직 변화현상으로 설명될 수 있었다. 알카리 탈피에서 일어나는 표피 조직의 변화현상은 표면 세포내의 전분입자의 호화와 밀접한 관계가 있음을 알 수 있었다.

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A New Perspective on the Advanced Microblade Cutting Method for Reliable Adhesion Measurement of Composite Electrodes

  • Song, Jihun;Shin, Dong Ok;Byun, Seoungwoo;Roh, Youngjoon;Bak, Cheol;Song, Juhye;Choi, Jaecheol;Lee, Hongkyung;Kwon, Tae-Soon;Lee, Young-Gi;Ryou, Myung-Hyun;Lee, Yong Min
    • Journal of Electrochemical Science and Technology
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    • 제13권2호
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    • pp.227-236
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    • 2022
  • The microblade cutting method, so-called SAICAS, is widely used to quantify the adhesion of battery composite electrodes at different depths. However, as the electrode thickness or loading increases, the reliability of adhesion values measured by the conventional method is being called into question more frequently. Thus, herein, a few underestimated parameters, such as friction, deformation energy, side-area effect, and actual peeing area, are carefully revisited with ultrathick composite electrodes of 135 ㎛ (6 mAh cm-2). Among them, the existence of side areas and the change in actual peeling area are found to have a significant influence on measured horizontal forces. Thus, especially for ultrahigh electrodes, we can devise a new SAICAS measurement standard: 1) the side-area should be precut and 2) the same actual peeling area must be secured for obtaining reliable adhesion at different depths. This guideline will practically help design more robust composite electrodes for high-energy-density batteries.

작약근의 박피와 시료형태가 건조시간 및 Paeoniflorin 함량에 미치는 영향 (Effects of Peeling and Sample types on Drying Time and Paeoniflorin Contents of Peony Root)

  • 김기재;박준홍;박소득;김재철;박경석
    • 한국약용작물학회지
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    • 제10권1호
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    • pp.24-28
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    • 2002
  • 작약의 양질약재 생산을 위한 기초 자료를 얻고자 건조과정중 박피시간별 절단과 무절단 그리고 열풍건조 온도를 달리하여 시험한 결과를 요약하면 다음과 같다. 박피시간이 길어질수록 건조시간은 통뿌리보다 절단한 것이 건조온도가 단축되었으며, $30^{\circ}C$에서 $60^{\circ}C$까지의 건조온도에서 건조온도가 상승할수록 온도상승의 효과는 감소하였다. 작약의 주 약용성분인 paeoniflorin 함량은 무박피 절단형태로 열풍온도 $30^{\circ}C$에서 건조한 작약이 3.48%로 가장 높은 함량을 유지하였고, 120분 박피후 통뿌리로 $60^{\circ}C$에 열풍건조한 작약은 2.29%로 건조과정중 많은 양이 손실되어 가장 낮게 나타났다. 건조작약의 외부색택은 통뿌리로 $60^{\circ}C$에서 열풍건조했을 때 흑갈색으로 변하는 정도가 가장 심했다. 따라서 작약 수확후 건조과정 중 건조시간 단축과 약효성분 그리고 색택면에서 건조전의 처리 방법은 무박피 절단형태가 장시간 박피 원형형태보다 우수한 것으로 판단된다.

박피방법에 따른 감자 및 고구마의 초기 품질 비교 (Quality Characteristics of Potato and Sweet Potato Peeled by Different Methods)

  • 정진웅;박기재;정승원;성정민
    • 한국식품저장유통학회지
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    • 제13권4호
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    • pp.438-444
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    • 2006
  • 감자와 고구마의 박피 방법별 초기 품질을 비교 검토하였다. 박피 방법별 감모율은 회전식 마찰형 박피기로 박피한 감자가 평균 7.9%, 고구마가 7.3%로 가장 우수하였다. 박피후 수분함량은 박피방법별로는 큰 차이가 없었으며 박피후 3시간까지 대체적으로 감소하였다. pH는 박피후 감자는 5.8-6.8, 고구마는 6.23-6.63이었으며 박피후 시간의 경과에 따라 다소 감소하였다. 경도는 일반과도를 이용한 수작업 박피가 우수하였다. 감자의 갈변도는 $100^{\circ}C$, 10% NaOH 90초 침지한 화학적 박피가 가장 컸으며, 고구마의 경우에서도 화학적 박피가 가장 큰 것으로 나타났다. 감자의 박피후 색차는 박피 전용도구를 이용한 수작업 박피, 회전식 칼날 삭피형 박피기와 회전식 브러시형 박피기를 이용한 박피가 변화량이 작았다. 고구마의 색차 변화는 회전식 칼날 삭피형 박피기를 이용한 박피가 가장 작았으며, 마찰형 박피기와 $100^{\circ}C$ 10% NaOH 처리 박피 고구마의 색차 변화가 상대적으로 모두 큰 것으로 나타났다.

하수관로 검사 및 연결 절단부 로봇의 개발 (The Development of Robot that is Detecting of Sewage Pipe and Cutting of Connection Projecting Part)

  • 정재강;김우진;김재열
    • Tribology and Lubricants
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    • 제22권4호
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    • pp.225-229
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    • 2006
  • The issue with the drainpipe now a day is that they are laid underground. Causing us to perform additional work to repair, such as digging up the ground and peeling off the insulator that surrounds the pipe. And such series works are difficult that concession appears from government and municipal office. However, if we can save time and money. Performance of piping robot that we are studied in existing session through fixing unit and improvement of cutting bit shorten and wished to heighten work efficiency. And we are trying to develop a unit that can cut up the projecting parts which connects with the interior part of the drainpipes.

양파 박피기 개발(I) (Development of An Onion Peeler (I) - Root cutting equiment -)

  • 민영봉;김성태;정태상;최선웅;김정호
    • Journal of Biosystems Engineering
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    • 제27권4호
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    • pp.301-310
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    • 2002
  • With a purpose to manufacture an onion peeler, the root cutting equipment of the onion could be attached to a prototype onion peeler was developed. Before the experiment, the distribution of the dimensions of the Korean native onion were measured. And some types of the blades to cut and remove the root of the onion were designed and such characteristics as feasible revolution, conveying speed, and power requirement were investigated. From the result of the test, the selected one among the various cutters was the wing type blade with the round blade to cut out the root and with the vertical blade to cut a circular line. The optimum operating conditions of the wing type blade were revealed the revolution with no load was at 630 rpm, and the conveying speed was 0.08 m/s. Under these conditions, the maximum torque was 5.25 kg·m and the power requirement was 33 W, respectively.

Thin Film Adhesion and Cutting Performance in Diamond-Coated Carbide Tools

  • Jong Hee Kim;Dae Young Jung;Hee Kap Oh
    • The Korean Journal of Ceramics
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    • 제3권2호
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    • pp.105-109
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    • 1997
  • The effects of surface conditions of the C-2 cemented carbide substrate on the adhesion of diamond film were investigated. The substrates were pretreated for different times with Murakami's reagent and then the acid solution of an H2SO4-H2O2. The adhesion strength was estimated by a peeling area around the Rockwell-A indentation. The cutting performance of the diamond-coated tools was evaluated by measuring flank wears in dry turning of Al-17% Si alloy. The morphology of deposited diamond crystallites was dominated by (111) and (220) surfaces with a cubooctahedral shape. The diamond film quality was hardly affected by the surface conditions of the substrate. The variation of tool life with longer substrate etching times resulted from a compromies between the increase of film adhesion at the interface and the decrease of toughness at the substrate surface. The coated tools were mainly deteriorated by chipping and flaking of the diamond film form a lock of adhesion strength, differently from the wear phenomena of PCD tools.

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