• The Journal of the Korea institute of electronic communication sciences
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• v.3 no.2
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• pp.79-85
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• 2008

It is important to consider the life of battery and low power operation for various wireless communications. Thus, Analog current-mode signal processing with SI circuit has been taken notice of in designing the LSI for wireless communications. However, in current mode signal processsing, current memory circuit has a problem called clock-feedthrough. In this paper, we examine the connection of CMOS switch that is the common solution of clock-feedthrough and calculate the relation of width between CMOS switch for design methodology for improvement of current memory. As a result of simulation, when the width of memory MOS is 20um, ratio of input current and bias current is 0.3, the width relation in CMOS switch is obtained with $W_{Mp}=5.62W_{Mn}+1.6$, for the nMOS width of 2~6um in CMOS switch. And from the same simulation condition, it is obtained with $W_{Mp}=2.05W_{Mn}+23$ for the nMOS width of 6~10um in CMOS switch. Then the defined width relation of MOS transistor will be useful guidance in design for improvement of current memory.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2007.04a
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• pp.485-488
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• 2007

최근 Analog Sampled-Data 신호처리를 위하여 주목되고 있는 SI(Switched-Current) circuit은 저전력 동작을 하는 장점이 있지만, 반면에 SI circuit에서의 기본 회로인 Current Memory는 Charge Injection에 의한 Clock Feedthrough이라는 치명적인 단점을 갖고 있다. 따라서 본 논문에서는 Current Memory의 문제점인 Clock Feedthrough의 일반적인 해결방안으로 Dummy Switch의 연결을 검토하였고, Austria Mikro Systeme(AMS)에서 $0.35{\mu}m$ CMOS process BSIM3 Model로 제작하기 위하여 Current Memory의 Switch MOS와 Dummy Switch MOS의 적절한 Width을 정의하여야 하므로, 그 값을 도출하였다. Simulation 결과, Switch의 Width는 $2{\mu}m$, Dummy Switch의 Width는 $2.35{\mu}m$로 정의될 수 있음을 확인하였다.

• The Journal of the Korea institute of electronic communication sciences
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• v.15 no.3
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• pp.487-494
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• 2020

In this paper, we propose a current memory circuit design that reduces static power consumption and maximizes the advantages of current mode signal processing. The proposed current memory circuit minimizes the problem in which the current transfer error increases as the data transfer time increases due to clock-feedthrough and charge-injection of the existing current memory circuit. The proposed circuit is designed to insert a support MOS capacitor that maximizes the Miller effect in the current transfer structure capable of low-power operation. As a result, it shows the improved current transfer error according to the memory time. From the experimental results of the chip, manufactured with MagnaChip / SK Hynix 0.35 process, it was verified that the current transfer error, according to the memory time, reduced to 5% or less.

• Proceedings of the Korean Institute of Intelligent Systems Conference
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• 2008.04a
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• pp.247-250
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• 2008

최근 무선통신용 LSI는 배터리 수명과 관련하여, 저전력 동작이 중요시되고 있다. 따라서 Digital CMOS 신호처리와 더불어 동작 가능한 SI (Switched-Current) circuit를 이용하는 Current-mode 신호처리가 주목받고 있다. 그러나 SI circuit의 기본인 Current Memory는 Charge Injection에 의한 Clock Feedthrough라는 문제점을 갖고 있기 때문에, 전류 전달에 있어서 오차를 발생시킨다. 본 논문에서는 Current Memory의 문제점인 Clock Feedthrough의 해결방안으로 CMOS Switch의 연결을 검토하였고, 0.25${\mu}m$ CMOS process에서 Memory MOS와 CMOS Switch의 Width의 관계는 simulation 결과를 통하여 확인하였으며, MOS transistor의 관계를 분명히 하여, 설게의 지침을 제공한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.13-16
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• 1998

An anomalous current characteristics which show the superposition of a low current level and high current level at the subthreshold region when SONOSFETs are in memory states were investigated. We have assumed this phenomena were resulted from the effect of parasitic transistors by LOCOS isolation and were modeled to a parallel equivalent circuit of one memory transistor and two parasitic transistors. Theoretical curves are well fitted in measured log I$_{D}$-V$_{G}$ curves independent of channel width of memory devices. The difference between low current level and high current level is apparently decreased with decrease of channel width of devices because parasitic devices dominantly contribute to the current conduction with decrease of channel width of memory devices. As a result, we concluded that the LOCOS isolation has to selectively adopt in the design of process for charge-trap type NVSM.VSM.

• Journal of IKEEE
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• v.27 no.4
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• pp.399-404
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• 2023

In this paper, we analyzed the current path in the O/N/O (Oxide/Nitride/Oxide) structure of 3D NAND Flash memory and in the O/N/F (Oxide/Nitride/Ferroelectric) structure where the blocking oxide is replaced by a ferroelectric. In the O/N/O structure, when V_read is applied, a current path is formed on the backside of the channel due to the E-fields of neighboring cells. In contrast, the O/N/F structure exhibits a current path formed on the front side due to the polarization of the ferroelectric material, causing electrons to move toward the channel front. Additionally, we performed an examination of device characteristics considering channel thickness and channel length. The analysis results showed that the front electron current density in the O/N/F structure increased by 2.8 times compared to the O/N/O structure, and the front electron current density ratio of the O/N/F structure was 17.7% higher. Therefore, the front current path is formed more effectively in the O/N/F structure than in the O/N/O structure.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1097-1100
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• 2001

In this paper, the electro-chemical-machining characteristics of Ni-Ti Shape Memory Alloy(SMA) was investigated. From the experimental results, the optimal electro chemical machining conditions for satisfying the machining quality(fine surface & high recovery stress) might be confirmed. And it was concluded that optical electro chemical condition for Ni-Ti SMA could be obtained at approximately 100% current efficiency and high frequency pulse current.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.955-958
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• 2000

In this paper, the electro-chemical-machining characteristics of Ni-Ti Shape Memory Alloy(SMA) was investigated. From the experimental results, the optimal electro chemical machining conditions for satisfying the machining quality(fine surface & high recovery stress)might be confirmed. And it was concluded that optical electro chemical condition for Ni-Ti SMA could be obtained at approximately 100% current efficiency and high frequency pulse current.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.8 no.5
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• pp.35-41
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• 2008

This paper presents the design method of current-mode signal processing for high speed and low power digital audio signal processing. The digital audio processor requires a digital signal processing such as fast Fourier transform (FFT), which has a problem of large power consumption according to the settled point number and high speed operation. Therefore, a current-mode signal processing with a switched Current (SI) circuit was employed to the digital audio signal processing because a limited battery life should be considered for a low power operation. However, current memory that construct a SI circuit has a problem called clock-feedthrough. In this paper, we examine the connection of dummy MOS that is the common solution of clock-feedthrough and are willing to calculate the relation of width between dummy MOS for a proposal of the design methodology for improvement of current memory. As a result of simulation, in case of that the width of memory MOS is 20um, ratio of input current and bias current is 0.3, the relation of width between switch MOS and dummy MOS is $W_{M4}=1.95W_{M3}+1.2$ for the width of switch MOS is 2~5um, it is $W_{M4}=0.92W_{M3}+6.3$ for the width of switch MOS is 5~10um. Then the defined relation of MOS transistors can be a useful design guidance for a high speed low power digital audio processor.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.413-416
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• 1998

This paper presents a dAC calibration technique for high resolution and monolithic operation. The calibration technique consists of basic source, current memory cell (C.M) and current substrator. Current memory supplies the error current to basic source. Current substrator extracts the error current from the main source. It is simple and needs no special calibration period. The proposed current cell has high calibration performance and guarantees 100MHz operation.