• Title/Summary/Keyword: Curing Pressure

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VPI Varnishing Technology Effects on Frequency Characteristics of an Air Core Inductor Used in LISN Circuit Application

  • Kanzi, Khalil;Kanzi, Majid;Nafissi, Hamidreza
    • Journal of international Conference on Electrical Machines and Systems
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    • v.2 no.1
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    • pp.57-64
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    • 2013
  • The functional characteristic of LISN circuit, which is used for measurements of conductive noise in mains power line, is basically related to frequency characteristics of passive elements like inductors used in the circuit as well as the frequency response of inductors is highly related to the resins used in the varnishing process. The significant problem in determination of an inductor's frequency characteristic is the intrinsic resistance, inductance and parasitic capacitance. In this triplet, the parasitic capacitance is the major limiting factor of inductor's frequency range. This capacitance depends on inductor design parameters and materials filling the spaces of coil like resin and its coherency after curing process. In this paper, two similar inductors were designed and built. The first inductor was not varnished while the second one was varnished with VPI technology. VPI, or Vacuum, Pressure, Impregnation technology is one of the most reliable methods performing good insulating conditions for electrical circuits and windings based on resins. The measured results show that implying varnishing technology does not significantly affect the frequency response. However, due to mechanical solidity aspects and improved environmental protection, it is better to varnish the inductors.

A Study on the Development of BIPV Module Equipped with Vacuum Glass for Improved Thermal Performance (단열성능 개선을 위한 진공유리가 부착된 BIPV Module 개발에 관한 연구)

  • Eom, Jae-Yong;Lee, Hyun-Soo;Suh, Seung-Jik
    • Journal of the Korean Solar Energy Society
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    • v.34 no.2
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    • pp.44-52
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    • 2014
  • The main purpose of this paper is to develop the new BIPV module equipped with vacuum glass. Beacuse BIPV module has a function of architectural materials, thermal and PV performance should be simultaneously evaluated. To improve the thermal performance of BIPV module, this study developed BIPV module equipped with a vacuum glass. Those BIPV module was tested with a variety of encapsulants. The results are as follows. When a vacuum glass is laminated with EVA or PVB, it was broken. The reason seems to be bending by unbalance of heat expansion with center and edge of vacuum glass. In case of lamination with resin, there is no breakage and no bending of vacuum glass. Because production was conducted in low pressure & low temperature conditions. And it was also found that vacuum glass does not interfere with the UV curing process.

Thermocompression Anisothropic Conductive Films(ACFs) bonding for Flat Panel Displays(FPDs) Application (평판디스플레이를 위한 열압착법을 이용한 이방성 도전성 필름 접합)

  • Pak, Jin-Suk;Jo, Il-Jea;Shin, Young-Eui
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.3
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    • pp.199-204
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    • 2009
  • The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

A Study on the Processing Technique to form Various Dimples on the Surface of Composite Parts (복합재료 부품 표면에 다양한 딤플을 형성하는 성형 방법)

  • Joe, C.R.;Byun, Gill-Jae
    • Composites Research
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    • v.26 no.1
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    • pp.42-47
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    • 2013
  • In this study, an economical and effective processing technique to form multiple dimples on the surface of a composite part, which are known to be useful to improve aerodynamic performance and heat dissipation. Forming dimples on the surface using molds is an expensive processing because forming multiple tiny positive spheres on the surface of the mold requires much time and effort. In this study, plates with multiple round holes are utilized as a core to form dimples on the carbon/epoxy composite skin covering the core. A vacuum bagging process is used to apply pressure on the surface while curing. Composite parts which have multiple dimples on the surface can be utilized in the field which needs high aerodynamic performance and heat dissipation ability such as high speed sports car bodies.

Manually applied to the social infrastructure polyurea waterproofing materials, methods based on the deterioration of conditions attached Performance Evaluation and Analysis (사회기반시설에 적용되는 수작업형 폴리우레아 방수·방식재료의 열화조건에 따른 부착성능평가 및 분석에 관한 연구)

  • Choi, Eun-Kyu;Kim, Yun-Ho;Lee, Hye-Ryung;Kim, Su-Ryon;Oh, Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2012.05a
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    • pp.41-42
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    • 2012
  • High temperature / high pressure spray equipment using a conventional method, unlike spray polyurea adjustable pot life and yellowing caused by UV light and chemicals do not occur, or discoloration of Self-Leveling Type of rugged hand-polyurea resin for technology development is underway. This new concept of polyurea resin roller, brush, airless spray, and they installed easily using the unfamiliar labor, and curing time of approximately four hours to gain control of the glass because it is Pot. Construction, but does not like the spray polyurea resin, compared to the existing degradation of the adhesion strength is concerned. In this study, Self-Leveling Type Manual of polyurea resin adhesion strength of target deterioration Let's minimize problems by reviewing existing domestic and infrastructure long-term durability for long life of the facility is to obtain.

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Synthesis of Ag-Hydroxyapatite Antibiotic Material by Coprecipitation Method (공침법을 이용한 은-수산화아파타이트 항균소재의 제조)

  • Jang, Kwang-Kyu;Shin, Hun Yong
    • Korean Chemical Engineering Research
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    • v.45 no.5
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    • pp.473-478
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    • 2007
  • Antibiotic composite was synthesized by coprecipitation of silver nitrate into hydroxyapatite. Adsorbed amount of silver ion was examined by the variation of concentration of silver nitrate, temperature, pressure and curing time. Optimum condition for silver-hydroxyapatite adsorption could be achieved. Physical and chemical characteristic properties of synthesized silver-hydroxyapatite were tested by ICP-MS, SEM-EDAX, DSC and XRD. Antibiotic properties for gram positive staphylococcus aureus (ATCC 6538) and gram negative escherichia coli (ATCC 25922) were tested by shake flake method.

Fabrication of Core-Shell Structure of Ni/Au Layer on PMMA Micro-Ball for Flexible Electronics

  • Hong, Sung-Jei;Jeong, Gyu-Wan;Han, Jeong-In
    • Current Photovoltaic Research
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    • v.4 no.4
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    • pp.140-144
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    • 2016
  • In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

Preparation and Properties of UV-Curable Polyurethane Acrylates(I) -Effect of Molecular Weights of Polyol and Diol with Low Molecular Weight into Polymer Chain- (UV-경화 폴리우레탄 아크릴레이트의 제조와 특성(I) -폴리올의 분자량과 저분자량 디올의 도입의 영향-)

  • 최준영;이동진;김한도
    • Textile Coloration and Finishing
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    • v.11 no.4
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    • pp.1-7
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    • 1999
  • Urethane-acrylate propelymers for secondary coating of optical fiber and high - performance material were prepared from the 4,4'-diphenylmethane diisocyanate(MDI), poly(tetramethylene oxide)glycol(PTMG, Mw 650 or 1000), 1,6-hexanediol(HD), 2-hydroxyethyl acrylate(HEA), and dibutyltin dilaurate as a catalyst. UV-Curable polyurethane acrylates were formulated from the urethane-acrylate prepolymers, three types of reactive diluents(DTs) having mono-, di-, and trifunctional-phenoxyethyl acrylate(PEA), hexanediol diacrylate(HDDA), and trimethylolpropane triacrylate(TMPTA), and 1-hydtoxycyclohexyl phenyl ketone(Irgacure 184) as a photoinitiator. The UV-cured films of polyurethane acrylates were obtained by curing using a medium-pressure mercury lamp(U W/cm, $\lambda_{max}=365\;nm)$. In this work, the effects of molecular weights of polyol and diol with low molecular weight into polymer chain on mechanical and dynamic mechanical properties of UV-cured polyurethane acrylates were studied. The structure and properties of the films obtained from the UV photopolymerization of urethane-acrylate prepolymer were investigated by FT-IR spectroscopy, dynamic mechanical measurement, tensile testing, and X-ray diffractometry.

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Relative Dynamic Modulus of Elasticity Comparison of the Eco-friendly Lightweight Concreate According to the Experimental Method (시험방법에 따른 친환경 경량콘크리트의 상대동탄성 계수 비교)

  • Lee, Soo-Hyung;Lee, Han-Baek
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2016.05a
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    • pp.181-182
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    • 2016
  • We developed eco-friendly lightweight concrete in order to apply eco-friendly lightweight concrete into structural wall or slab of shallow depth urban railway system. However, since lightweight aggregate has different structural feature of porous and it has been overvalued at current KS standard when applied, we did compare the characteristics of freezing and thawing of normal weight aggregate concrete by comparative test method(KS, ASTM). According to test method, there was a big difference of dynamic elastic modulus in lightweight concrete rather than in normal weight aggregate concrete. The big absorption factor in lightweight aggregate is main reason for that. For more detail, in KS law in which only 14 days water curing is carried out, the big amount of moisture in lightweight aggregate is frozen and high heaving pressure occurs and finally that lead to destruction of lightweight concrete. Therefore, it is considered that in case of lightweight concrete, resistibility against freezing and thawing has been undervalued in domestic KS law compared to ASTM law, which is overseas standard. So, a variety of examination about testing criteria and rule would be necessary for exact assessment of lightweight concrete.

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UV/Thermal Hybrid Nanoimprint System for Flexible Substrates (유연기판을 위한 UV/Thermal 하이브리드방식 나노임프린트 시스템)

  • Lim, Hyung-Jun;Lee, Jae-Jong;Choi, Kee-Bong;Kim, Gee-Hong;Ahn, Hyun-Jin;Ryu, Ji-Hyeong
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.245-250
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    • 2011
  • An UV/thermal hybrid nanoimprint lithography system was designed and implemented for the pattern transfer to flexible substrates. This system can utilize a plate stamp, roll stamp, and film stamp. For all cases of using those stamps, this system is also switchable an UV or thermal nanoimprint lithography mode. This paper shows how to design the heating and UV curing plates and proposes how to change them easily. Because the pressure condition and the speed of the press roller varies by the characteristics of the stamp and substrate, all the parameters related to the nanoimprint lithography have to adjustable. Some transferred patterns are shown in this paper to verify the performance of the hybrid nanoimprint lithography system. The flexible substrates with nano-scale patterns on them will be key components for next generation technologies such as flexible displays, bendable semi-conductors, and solar cells.