• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.3
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• pp.122-131
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• 2003

In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.574-580
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• 1994

This study is about cure kinetics of DGEBA/MDA/MN(malononitrile) system by Barrett method and Integral method using DSC dynamic run. Curing behavior was shown through DSC and the heat change involved in a reaction could be measured directly with DSC. The kinetic parameters such as activation energy, pre-exponential factor and reaction order were given by Barrett method and Integral method obtained in an assumption that the area of DSC enthalpic analysis curve was propotional to the enthalpic change.

• Fibers and Polymers
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• v.3 no.2
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• pp.60-67
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• 2002

In the present study, the fluorescence behavior ova phenylethynyl-terminated imide (LaRC PETI-5) resin, a bismaleimide (BMI) resin, and various LaRC PETI-5/BMI blends with different blend compositions has been characterized as a function of heat-treatment temperature, using a steady-state fluorescence technique with a front-face illumination method far solid-state films. It is observed that there are distinguishable changes in the spectral shape, size, and position of fluorescence with varying heat-treatment temperature in the pure and blend samples. The result is qualitatively explained in terms of charge transfer complex formation as well as microenvironmental change with local mobility and viscosity occurring in the LaRC PETI-5, BMI, and their blends during the cure process. The result also implies that a steady-state fluorescence technique may be a useful tool to understand the processing conditions of polyimides and their blends in the film form on the basis of their thermo-photophysical responses.

• Macromolecular Research
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• v.13 no.1
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• pp.30-38
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• 2005

Sulfur-cured gum natural rubber vulcanizates were devulcanized using two different concentrations of diallyl disulfide. The devulcanization process was performed at $110^{\circ}C$ min in an open two-roll cracker-cum-mixing mill. Natural rubber vulcanizates having various sulfur/accelerator ratios were used to study the cleavage of monosulfide, disulfide, and polysulfide bonds. The properties of devulcanized natural rubber increased upon increasing the disulfide concentration and the mechanical properties of the revulcanized natural rubber increased upon decreasing the sulfur content in the original rubber vulcanizates. The scorch time and the maximum state of cure both increased when the ground vulcanizates were treated with higher amounts of disulfide. TGA and DMA were conducted to study the effects of the devulcanization on the thermal stability and the $T_g$ behavior of the vulcanizates. SEM analysis was conducted to study how the failure mechanism was affected by the devulcanization process. It was possible to recover $70-80\%$ of the original gum rubber properties by using this process. From IR spectroscopic analysis, we observed that the oxidation of the main chains did not occur during high-temperature milling.

• Macromolecular Research
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• v.16 no.2
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• pp.128-133
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• 2008

Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.

• Bulletin of the Korean Chemical Society
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• v.21 no.1
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• pp.61-64
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• 2000

FT-IR/ATR analysis shows that the oriental lacquer coating network degrades mostly in the unsaturated side chain. The rate of increase in carbonyl intensity (a measure of photodegradation) during the accelerated weathering test was substantially different for the unstabilized and stabilized samples; adding 2 wt% HALS into the oriental lacquer formulation enhanced photostabilization up to three times. Weight loss measurements, another indication of photodegradation, and SEM analysis support this conclusion. Despite the presence of the photo-stabilizer, the other properties of the lacquer were not significantly affected. In particular, the curing behavior of purified lacquer (PL) and HALS-stabilized samples is similar, although the in-situ DETA analysis showed that addition of HALS can slightly retard the cure reaction rate in oriental lacquer coating. It is hypothesized that this cure retardation may be related to the salt formation between HALS and acid of oriental lacquer.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Polymer(Korea)
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• v.25 no.2
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• pp.177-185
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• 2001

In this work, the cure kinetics and rheological properties of difunctional epoxy(diglycidylether of bisphenol A, DGEBA)/polysulfone (PSF) blends were investigated using differential scanning calorimeter and rheometer. From the DSC results of the blends, the temperature of the exothermic peak and cure activation energy (E) using a half-width method were increased with increasing the PSF content to neat epoxy resin up to 30 wt%. However, a marginal decrease in the blend system was shown in E. The conversion ($\alpha$) and conversion rate (d$\alpha$/dt) were decreased as the content of PSF increases. Rheological properties of the blend system were investigated under isothermal condition using a rheometer. Cross-linking activation energy (E$_{c}$) was determined from the Arrhenius equation based on gel time and curing temperature. As a result, the E$_{c}$ showed a similar behavior with E which could be resulted from high viscosity of PSF and the phase separation between DGEBA and PSF.PSF.f PSF and the phase separation between DGEBA and PSF.PSF.

• Elastomers and Composites
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• v.39 no.1
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• pp.42-50
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• 2004

In this work, the diglycidylether of bisphenol A (DGEBA) and modified polyurethane (PU) blends were initiated by N-benzylpyrazinium hexafluoroantimonate (BPH). The cure and fracture toughness of neat DGEBA with the addition of PU were investigated. The cure properties of DGEBA/PU blend system were examined by DSC and near-IR measurements. The fracture touhtness were investigated by measuring the critical stress intensity factor ($K_{IC}$) and the critical strain energy release rate ($G_{IC}$). According to the results, the maximum values of owe activation energy ($E_a$) and conversion (${\alpha}$) were found at 10 phr of PU. Also the $K_{IC}$ showed a similar behavior with the results of conversion. These results were probably due to increase of crosslinking density in the blends resulted from increase of the hydrogen bonding between the hydroxyl groups of DGEBA and isocyanate groups of PU.

• Journal of Korea Entertainment Industry Association
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• v.15 no.8
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• pp.351-361
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• 2021

This study was conducted to identify the factors of hypertension treatment in Gwangju and to establish a hypertension cure rate management plan by using local community health surveys to provide the hypertension cure rate management plan centering around the wellness local community. The research collected 13,714 Gwangju research data among a total of 685,820 local community health surveys of KDCA (Korea Disease Control and Prevention Agency) from 2017 to 2019. Among the data, 2,941 subjects, those with diagnosed hypertension aged over 30, were selected and analyzed through SAS 9.4, SAS Enterprise Miner 15.1. The results are as follows. The differences in hypertension diagnosis cure rate in Gwangju based on the subjects' socioeconomic characteristics were shown in gender, age, marital status, level of educational attainment, economic activity status, and monthly income. The significant differences in hypertension cure rate based on health behavior characteristics were shown in current smoking, monthly alcohol consumption, high-risk drinking, breakfast, recognition of good health level, diabetes and treatment, annual unmet medical needs, and annual health center use. As a result of the logistic regression analysis and interactive decision tree analysis to identify the factors affecting hypertension treatment, the research found that the factors that appear are age, marital status, diabetes and treatment, and annual unmet medical needs. Accordingly, to increase the recognition of the importance of hypertension treatment to people of young ages and not to develop complications, public health-educational effort in Gwangju is needed with an effective preparation plan.