• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.142-142
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• 2009

전자 소자 배선 재료로 이용되는 Cu의 확산 방지막으로서 170nm 두께의 전해 Ni-Re-P 합금 피막이 Cu substrate 위에 제조되었으며 피막특성 및 확산 거동을 연구하였다. 도금 피막내의 P와 Re의 조성분석은 WDXRF로 분석하였으며, 각 함량은 6wt.%와 10wt.%였다. DSC와 XRD는 Ni-Re-P 피막의 결정화 온도가 Ni-P 피막보다 높다는 것을 보여줬다. 이 결과는 Ni-Re-P 피막의 열적 안정성이 Ni-P피막보다 더 우수하다는 것을 나타낸다.

• Journal of the Korean Society for Heat Treatment
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• v.5 no.3
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• pp.149-156
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• 1992

Transformation behavior and reversible shape memory effct of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, differential scanning calorimetry. X-ray diffraction and strain gage sensor. The transformation sequence in Ti-Ni-Cu alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\leftrightarrow}B19^{\prime}$ and it proceeds in two stages by addition of 10 at.%Cu. i.e. $B2{\leftrightarrow}B19{\leftrightarrow}B19^{\prime}$. But the content of Cu increases up to 20at.%, it has been transformed in one stage ; $B2{\leftrightarrow}B19$. The shape change of Ti-40Ni-10Cu alloy which was constrain aged in circular form bended in $B2{\leftrightarrow}B19$ transformation but it spreaded out in $B19{\leftrightarrow}B19^{\prime}$ transformation. The amount of reversible shape change (${\Delta}{\varepsilon}$) of Ti-47Ni-3Cu alloy constrain aged at $400^{\circ}C$ after solution treatment has a maximum value of about $5.6{\times}10^{-3}$, but that of cold rolled and constrain aged specimens exhibits a little value independent of Cu concentrations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.33-37
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• 2002

본 연구에서는 전해도금법을 이용하여 플립칩용 Ni, Ni-Cu 합금 UBM (Under Bump Metallurgy) 및 Sn-Ag 무연 솔더 범프를 형성하였다. 솔더 범프의 전해도금시 고속도금 방법으로 균일한 범프 높이를 갖도록 하는 도금 조건 및 도금 기판의 역할로서의 UBM의 영향을 조사하였다. Cu/Ni-Cu 합금/Cu UBM을 적용한 경우 음극시편의 전극 접점수를 증가시켰을 때 비교적 균일한 솔더 범프를 형성시킬 수 있었던 반면, Ni UBM의 경우는 접점수를 증가시켜도 다소 불균일한 솔더 범프를 형성하였다. 리플로 시간을 변화하여 범프 전단 강도 및 파단 특성을 조사하였는데 Ni UBM의 경우 Cu/Ni-Cu 합금/Cu UBM에 비해 전단강도가 다소 낮은 값을 가졌고 금속막이 웨이퍼에서 분리되는 파괴 거동이 관찰되었다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Korean Journal of Materials Research
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• v.17 no.12
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• pp.664-668
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• 2007

The magnetron sputtering was used to deposit Ni buffer layers on the polyimide surfaces to increase the adhesion strength between Cu thin films and polyimide as well as to prevent Cu diffusion into the polyimide. The Ni layer thickness was varied from 100 to $400{\AA}$. The adhesion strength increased rather significantly up to $200{\AA}$ of Ni thickness, however, there was no significant increase in strength over $200{\AA}$. The XPS analysis revealed that Ni thin films could increase the adhesion strength by reacting with the polar C=O bonds on the polyimide surface and also it could prevent Cu diffusion into the polyimide. The Cu/Ni/ polyimide multilayer thin films showed a high stability even at the high heating temperature of $200^{\circ}C$, however, at the temperature of $300^{\circ}C$, Cu diffused through the Ni buffer layer into polyimide, resulting in the drastic decrease in adhesion strength.

• Electrical & Electronic Materials
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• v.10 no.10
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• pp.1016-1021
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• 1997

Magneto resistance properties in spin-valve sandwiches with various thickness of nanmagnetic layer in contact with the ferromagnetic NiFe film were investigated. The NiFe layer in contact with the NiO film was pinned by strongly exchange-biased coupling and the free NiFe layer at the film surface induced a sharp change in the magnetoresistance at -5~15Oe due to small coercivity. The NiO/NiFe/Cu/NiFe film showed a magnetoresistance ratio in the range of 2.3~2.9% and a field sensitivity above 2.2%/Oe with various of nonmagnetic layer. The NiO/NiFe/Cu/NiFe film of the field sensitivity above 2.2%/Oe suggests stang possibility of magnetic sensor matter.

• Journal of the Korean Society for Marine Environment & Energy
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• v.17 no.4
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• pp.257-267
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• 2014

The distributions of trace metals in the East Sea were investigated during the R/V Lavrentyev cruise (July 2009) in which four transects from Russia shore to South were conducted to collect 25 surface water samples. The total dissolved concentrations of Cu and Ni were measured using ICP-MS, DRC-e. In the coastal area, their concentrations of Russia shore (Cu, 1.51; Ni, 1.82 nM) were 1.9 times for Cu and 2.0 times for Ni lower than Korea shore (Cu, 2.87; Ni, 3.71 nM). In the subregion, their concentrations of Warm region (Cu, 3.03; Ni, 2.28 nM) were higher for Cu than Cold region (Cu, 2.04; Ni, 2.28 nM). The distributions of Cu and Ni concentrations were divided by lowest level at $10^{\circ}C$ of water temperature. In this study period, the surface water temperatures of Russia shore and Japan basin were lower than $10^{\circ}C$ and them of Ulleung basin and Sakhalin shore were higher. Below $10^{\circ}C$, Cu and Ni concentrations increased when surface water temperatures decreased. Above $10^{\circ}C$, their concentrations increased with temperature, which showed highest concentrations in the Ulleung basin, directly influenced by flux from East Korean Warm Current. By comparing with other sea areas (Western Mediterranean, Atlantic), Cu concentrations in the East Sea were a little higher and Ni concentrations were lower. Particularly as the level of Cu in the offshore in the Ulleung basin were higher than in the coastal area, We can suggest that the atmospheric flux of Cu is relatively important in this area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.434-435
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• 2009

The crystalline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more. high-efficiency and low cost endeavors many crystalline silicon solar cells. the fabrication processes of high-efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/Ag contact, however, this contact formation processed by expensive materials. Ni/Cu contact formation is good alternative. in this paper, according to temperature Ni silicide makes, produced Ni/Cu contact solar cell and measured conversion efficiency.

• Journal of the Korean Magnetics Society
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• v.6 no.6
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• pp.382-387
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• 1996

The characteristics of the complex permeability of ${(Ni_{x}Cu_{0.2}Zn_{0.8-x}O)}_{1-w}{(Fe_{2}O_{3})}_{1+w}$ with various Ni and $Co_{3}O_{4}$ contents were investigated in this work. It is found that the NiCuZn ferrites with $x{\geq}0.6$ have a relatively small peak width of the imaginary part of permeability $\mu$". The resonance frequency is increased as Ni content becomes higher, where the loss is low. The $\mu$" value decreases with increasing FezO, deficiency, but the resonance frequency($f_{\mu"max}$) is only slightly affected by $Fe_{2}O_{3}$ deficiency. In case of $Co_{3}O_{4}$ addition to the NiCuZn ferrites, the $f_{\mu"max}$ increases since the initial permeability decreases with the amount of $Co_{3}O_{4}$. It is concluded that the Ni content in the NiCuZn ferrite is a dominant factor for the total loss of these spinel ferrites.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.119-124
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• 2009

In the microelectronics packaging industry, the adhesion strength between Cu and polyimide and the thermal stability are very important factors, as they influence the performance and reliability of the device. The three different buffer layers of Cr, 50%Cr-50%Ni, and Ni were adopted in a Cu/buffer layer/polyimide system and compared in terms of their adhesion strength and thermal stability at a temperature of $300^{\circ}C$ for 24hrs. A 90-degree peel test and XPS analysis revealed that both the peel strength and thermal stability decreased in the order of the Cr, 50%Cr-50%Ni and Ni buffer layer. The XPS analysis revealed that Cu can diffuse through the thin Ni buffer layer ($200{\AA}$), resulting in a decrease in the adhesion strength when the Cu/buffer layer/polyimide multilayer is heat-treated at a temperature of $300^{\circ}C$ for 24hrs. In contrast, Cu did not diffuse through the Cr buffer layer under the same heat-treatment conditions.