• Title/Summary/Keyword: CuNi

Search Result 2,498, Processing Time 0.028 seconds

Toxic Effects of Binary Mixtures of Heavy Metals on the Growth and P Removal Efficiencies of Alcaligenes sp. (Alcaligenes sp.의 생장과 인 제거에 미치는 이종 중금속 혼합의 독성 효과)

  • Kim, Deok Hyun;Yoo, Jin;Chung, Keun Yook
    • Korean Journal of Environmental Agriculture
    • /
    • v.35 no.1
    • /
    • pp.79-86
    • /
    • 2016
  • BACKGROUND: This study was initiated to quantitatively evaluate the effects of five heavy metals on the growth and P removal efficiencies of Alcaligenes sp., known as the Phosphorus Accumulating Organisms (PAOs). It was cultivated in the batch system with five heavy metals, such as Cd, Cu, Zn, Pb and Ni, added in single and binary mixtures, respectively.METHODS AND RESULTS: IC50 (half of inhibition concentration of bacterial growth) and EC50 (half of effective concentration of phosphorus removal Efficiencies) were used to quantitatively evaluate the effects of heavy metals on the growth and phosphorus removal Efficiencies of Alcaligenes sp. In addition, Additive Index Value (A.I.V.) method was used to evaluate the interactive effects between Alcaligenes sp. and heavy metals. As a result, as the five heavy metals were singly added to Alcaligenes sp., the greatest inhibitory effects on the growth and P removal efficiencies of each bacteria was observed in the cadmium (Cd). In the binary mixture treatments of heavy metals, the treatments of lowest IC50 and EC50 were the Cd + Cu treatment. Based on the IC50 and EC50 of the binary mixtures of heavy metals treatments, most interactive effects between the heavy metals were found to be antagonistic.CONCLUSION: Based on the results obtained from this study, it appears that they could provide the basic information about the toxic effects of the respective treatments of single and binary mixtures of heavy metals on the growth and P removal efficiencies of Alcaligenes sp. through further study about the characterization of functional proteins involved in toxic effects of heavy metals.

Characteristics and Assessment of Metal Pollution and their Potential Source in Stormwater Runoff from Shihwa Industrial Complex, Korea (시화산업단지 강우유출수 내 중금속 오염도 평가 및 오염원 추적 연구)

  • Lee, Jihyun;Jeong, Hyeryeong;Choi, Jin-Young;Ra, Kongtae
    • Korean Journal of Ecology and Environment
    • /
    • v.53 no.1
    • /
    • pp.91-101
    • /
    • 2020
  • Stormwater runoff is known as a major non-point water pollution source that transports heavy metals, which have accumulated in road surface, to stream and coastal area. Dissolved and particulate metals in stormwater runoffs have been investigated to understand the outflow characteristics of heavy metals during rainfall events and to identify their pollution sources. The concentration of dissolved Co and Ni decreased after the outflow with high concentrations at the beginning of the rainfall, and other metals showed different characteristics depending on the rainfall and rate of discharge. Particulate metals showed a similar trend with the temporal variation of suspended solids concentration in stormwater runoffs. The results of geo-accumulation index (Igeo) indicated that the stormwater runoffs from industrial region were very highly polluted with Cu, Zn and Cd. As a result of comparing the metal concentrations of <125 ㎛ for road dust near the study area, Cu, Zn and Cd were originated from inside of metal manufacturing facilities rather than traffic activities at road surface and these metals accumulated on the surface area of facilities were transported to the water environments during stormwater event. The average discharged amounts of heavy metals for one rainfall event were Cr 128 g, Co 12.35 g, Ni 98.5 g, Cu 607.5 g, Zn 8,429.5 g, As 6.95 g, Cd 3.7 g, Pb 251.75 g, indicating that metal runoff loads in the stormwater runoffs are closely related to surrounding industry types.

Heavy Metal Concentrations in Tree Ring Layer and Soil and Tree Ring Growth of Roadside Trees in Seoul (서울시 가로수의 연륜층 및 식재주변 토양의 증금속 농도와 연륜 생장)

  • Yoo, Jae-Yun;Son, Yo-Whan
    • Korean Journal of Environmental Agriculture
    • /
    • v.22 no.2
    • /
    • pp.118-123
    • /
    • 2003
  • This study was carried out to examine the heavy metal concentrations in soils under roadside trees and tree ring layers, and to investigate the relationship between heavy metal concentrations and tree ring growth of roadside trees in Seoul. Soil samples at $0{\sim}20\;cm$ depth and tree line were collected from Platanus occidentalis and Ginkgo biloba at nine streets, and pH and heavy Metal concentrations were analyzed. Soil pH ranged from 6.62 to 8.01 and soil heavy metal concentrations under roadside trees were higher (Zn 109.03, Pb 26.49 and Cu 44.98 mg/kg) compared with those of the referred forest soils. Soils at Cheonggye2ga street showed the highest heavy metal concentrations, and seemed to be related to heavy traffic and dense hardware stores. Tree ring width significantly decreased from 1979 through 2000 for both species. There were positive correlations between Cr, Pb and Cu concentrations in soils and tree ring layers for P. occidentalis and Ni for G. biloba. However, there were negative correlations between Cr concentration in tree ring layers and tree ring width for P. occidentalis, and Ni and Cu for G. biloba. Also there were no significant correlations between climatic factors in Seoul and tree ring width.

Effects of Graphene Oxide Addition on the Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints (Graphene Oxide 첨가에 따른 Sn-3.0Ag-0.5Cu 무연솔더 접합부의 Electromigration 특성 분석)

  • Son, Kirak;Kim, Gahui;Ko, Yong-Ho;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.26 no.3
    • /
    • pp.81-88
    • /
    • 2019
  • In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

Redox Characteristics of $MO/Al_2O_3-ZrO_2$ [M=Ni and Cu] Mixed Metal Oxides ($MO/Al_2O_3-ZrO_2$ [M=Ni 및 Cu] 혼합 금속 산화물의 환원-산화 특성)

  • Ryu, Jae-Chun;Kim, Young-Ho;Park, Chu-Sik;Hwang, Gab-Jin;Kim, Jong-Won
    • Journal of Hydrogen and New Energy
    • /
    • v.16 no.1
    • /
    • pp.49-57
    • /
    • 2005
  • [ $MO/Al_2O_3-ZrO_2$ ](M=Ni and Cu) mixed metal oxides were prepared using sol-gel method in order to investigate the applicability to the 2-step thermo-chemical water splitting process and their redox behaviors were studied by temperature programmed reaction(TPR) from room temperature to 900$^{\circ}C$ under 5% $H_2$/Ar for the reduction and $H_2O$/Ar for the oxidation, respectively. From the results, peaks of the reduction and the oxidation on temperature were shifted with the change of crystalline phases due to the addition of $Al_2O_3$ and $ZrO_2$. The intensities of the peaks were also increased with the increase of contents of NiO or CuO that could be considered as active species. In addition, based on the observation of SEM images before and after the redox test, it seemed that $Al_2O_3-ZrO_2$ added prevented high temperature sintering of active metal components such as Ni (or Cu) on the surface and played a role of dispersing the active species homogeneously in solid solution of mixed oxides.

Crystallographic and Moss bauer Studies of Cu-Ni Ferrite (Cu - Ni Ferrite의 결정학적 및 Mossbauer 연구)

  • 김우철;홍성렬;지상희;이승화;엄영랑;김철성
    • Journal of the Korean Magnetics Society
    • /
    • v.7 no.2
    • /
    • pp.76-81
    • /
    • 1997
  • $Cu_{0.9}Ni_{0.1}Fe_2O_4$ has been studied with Mossbauer spectroscopy and X-ray diffraction. The crystal structure is found to be a cubic spinel with the lattice constant $a_0=8.386{\AA}$. The Curie temperature is determined to be $T_c=755K$ for a heating rate of 5 K/ min. The Mossbauer spectra consist of two six-line patterns corresponding to $Fe^{3+}$ at the tetrahedral(A) and octahedral(B) sites. Debye temperatures for A and B sites are found to be 568 k and 194 K, respectively. Atomic migration of $Cu_{0.9}Ni_{0.1}Fe_2O_4$ begins near 350 K and increases rapidly with increasing temperature such a degree that 71% of the ferric ions as A sites have moved over to the B sites at 550 K.

  • PDF

Properties of NiCuZn Ferrite by Variation of Element Materials (원료의 계열성분 변화에 따른 NiCuZn Ferrite 물성연구)

  • Kim, Tae-Hyoung;Koh, Jae-Gui
    • Journal of the Korean Magnetics Society
    • /
    • v.14 no.5
    • /
    • pp.180-185
    • /
    • 2004
  • The electromagnetic properties and microstructures of the basic composition of (Ni$\sub$0.2/Cu$\sub$0.1/Zn$\sub$0.2/)$\sub$0.5/ (Fe$_2$O$_3$)$\sub$0.5/ were invested by changing of SO$_4$, Cl and NO$_3$ series. We were prepared by coprecipitation method and sintered at temperatures 950$^{\circ}C$, 1150$^{\circ}C$, l350$^{\circ}C$, respectively. When sintering at temperature 950$^{\circ}C$, Cl and NO$_3$ series became perfection sintering. On the other hand, SO$_4$ series showed perfection sintering at temperature 1150$^{\circ}C$. According to particle size analysis result, higher magnetic permeability and magnetization value were observed by Cl series than SO$_4$ or NO$_3$ series.

Interfacial Reactions of Sn Solder with Variations of Under-Bump-Metallurgy and Reflow Time (Under Bump Metallurgy의 종류와 리플로우 시간에 따른 Sn 솔더 계면반응)

  • Park, Sun-Hee;Oh, Tae-Sung;Englemann, G.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.14 no.3
    • /
    • pp.43-49
    • /
    • 2007
  • Thickness of intermetallic compounds and consumption rates of under bump metallurgies (UBMs) were investigated in wafer-level solder bumping with variations of UBM materials and reflow times. In the case of Cu UBM, $0.6\;{\mu}m-thick$ intermetallic compound layer was formed before reflow of Sn solder, and the average thickness of the intermetallic compound layer increased to $4\;{\mu}m$ by reflowing at $250^{\circ}C$ for 450 sec. On the contrary, the intermetallic layer had a thickness of $0.2\;{\mu}m$ on Ni UBM before reflow and it grew to $1.7\;{\mu}m$ thickness with reflowing for 450 sec. While the consumption rates of Cu UBM were 100nm/sec fur 15-sec reflow and 4.50-sec for 450-sec reflow, those of Ni UBM decreased to 28.7 nm/sec for 15-sec reflow and 1.82 nm/sec for 450-sec reflow.

  • PDF

Stabilization of mixed heavy metals in contaminated marine sediment using steel slag (제강슬래그를 이용한 해양오염퇴적물 내 혼합 중금속 안정화)

  • Shin, Woo-Seok;Kim, Young-Kee
    • Journal of Navigation and Port Research
    • /
    • v.38 no.3
    • /
    • pp.269-275
    • /
    • 2014
  • In this study, the adsorption efficiency of mixed heavy metals in aqueous solution was investigated using steel slag. Moreover, heavy-metal stabilization treatment of contaminated marine sediment was achieved using steel slag as stabilizing agents. Heavy metal adsorption was characterized using Freundlich and Langmuir equations. The equilibrium adsorption data were fitted well to the Langmuir model in steel slag. The adsorption uptake of heavy metals were higher in the order of $Pb^{2+}$ > $Cd^{2+}$ > $Cu^{2+}$ > $Zn^{2+}$ > $Ni^{2+}$. The steel slage was applied for a wet-curing duration of 150 days. From the sequential extraction results, the exchangeable, carbonate, and oxides fractions of Ni, Zn, Cu, Pb, and Cd in sediment decreased by 13.0%, 6.0%, 1.3%, 17.0%, and 50.0%, respectively.

The Effect of Thermomechanical Treatment on the Transformation Characteristics and Mechanical Properties in a Cu-Al-Ni-Ti-Mn Alloy (Cu-Al-Ni-Ti-Mn 합금의 변태특성 및 기계적 성질에 미치는 가공열처리의 영향)

  • Kim, C.D.;Lee, Y.S.;Yang, G.S.;Jang, W.Y.;Kang, J.W.;Baek, S.N.;Gwak, S.H.
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.12 no.2
    • /
    • pp.145-156
    • /
    • 1999
  • The distribution of the second phase, the change of transformation temperature and mechanical properties with thermomechanical treatment conditions were investigated by metallography, calorimetry, EDS, tensile test and fractography in a Cu-Al-Ni-Ti-Mn alloy. The cast structure revealed Ti-rich precipitates($X_L$ phase) between dendrite arms, which have been identified as $(Cu,Ni)_2TiAl$ intermetallic compounds. By homogenizing above $900^{\circ}C$, the $X_L$ phase was melted in the matrix, while the Xs phase was precipitated in matrix and the volume fraction of it was increased. When hot-rolled specimen was betatized below $750^{\circ}C$, recrystallization could not be observed. However, the specimen betatized above $800^{\circ}C$ was recrystallized and the grain size was about $50{\mu}m$, while Xs phase was precipitated in matrix. With raising betatizing temperature, $M_s$ and $A_s$ temperatures were fallen and transformation hysteresis became larger. The strain of the specimen betatized at $800^{\circ}C$ was 8.2% as maximum value. The maximum shape recovery rate could be obtained in the specimen betatized at $800^{\circ}C$ but it was decreased due to the presence of Xs phase with increasing betatizing temperature.

  • PDF