• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.106-106
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• 2003

반도체 소자의 고집적화에 따라 채널길이와 배선선 폭은 점차 줄어들고, 이에 따라 단채널효과, 소스/드레인에서의 기생저항 증가 및 게이트에서의 RC 시간지연 증가 등의 문제가 야기되었다. 이를 해결하기 위하여 자기정렬 실리사이드화(SADS) 공정을 통해 TiSi2, CoSi2 같은 금속 실리사이드를 접촉 및 게이트 전극으로 사용하려는 노력이 진행되고 있다. 그런데 TiSi2는 면저항의 선폭의존성 때문에, 그리고 CoSi2는 실리사이드 형성시 과도한 Si소모로 인해 차세대 MOSFET소자에 적용하기에는 한계가 있다. 반면, NiSi는 이러한 문제점을 나타내지 않고 저온 공정이 가능한 재료이다. 그러나, NiSi는 실리사이드 형성시 NiSi/Si 계면의 산화와 거침성(roughness) 때문에 높은 누설 전류와 면저항값, 그리고 열적 불안정성을 나타낸다. 한편, 초고집적 소자의 배선재료로는 비저항이 낮고 electro- 및 stress-migration에 대한 저항성이 높은 Cu가 사용될 전망이다. 그러나, Cu는 Si, SiO2, 실리사이드로 확산·반응하여 소자의 열적, 전기적, 기계적 특성을 저하시킨다. 따라서 Cu를 배선재료로 사용하기 위해서는 확산방지막이 필요하며, 확산방지재료로는 Ti, TiN, Ta, TaN 등이 많이 연구되고 있다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.328-335
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• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Bulletin of the Korean Chemical Society
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• v.11 no.5
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• pp.379-383
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• 1990

$YBa_2Cu_{3-x}Ni_xO_{7-{\delta}}$, with x = 0.05, 0.2, 0.4, 0.7 and 1.0 had been prepared by the thermal decomposition of corresponding nitrates. Among them, the sample with x = 0.05 shows above-liquid-$N_2$ temperature superconductivity with $T_c$ of 88.7K. According to the X-ray diffraction analysis, its crystal symmetry was estimated as orthorhombic with the lattice parameters of a = 3.866${\AA}$, b = 3.893${\AA}$, c = 11.715${\AA}$. The chemical composition of the sample was determined by electron probe microanalysis and the chemical composition around its grain boundaries was carefully studied by the X-ray line scanning technique. From the observed binding energy of Ni-$2p_{3/2}$ orbital electron (B.E. = 853 eV) measured by X-ray photoelectron spectroscopy, the valency state of nickel stabilized in $YBa_2Cu_{2.95}Ni_{0.05}O_{7-{\delta}}$ oxide lattice could be determined to be Ni(II).

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.61-64
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• 2007

Ni/YSZ ($Y_{2}O_{3}-stabilized$ $ZrO_{2}$), Cu/YSZ and CuO/YSZ composite powder for a cathode material in high temperature electrolysis (HTE) was synthesized by a mechanical alloying method with Ni (or Cu, CuO, Co) and YSZ powder. Microstructure of the composite for HTE reaction has been analyzed with various techniques of XRD, SEM to investigate effects of fabrication conditions. And conductivity of electrode was measured, Cu/YSZ cermet showed the higher electrical conductivity value than Ni/YSZ.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.21-23
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• 2006

The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.

• Journal of Powder Materials
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• v.1 no.2
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• pp.145-152
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• 1994

Atomizing mode and powder characteristics of CuA1Ni base shape memory alloy in rotating disk atomization were investigated in accordance with disk materials and additional elements. Produced powders were classified into two types of spherical and flake shape. In the case of CuAlNiBTi and CuAlNiZr alloy, high yield rate and fine powder were obtained. This tendency was same when we used oxide coated disks. We concluded that this results were steno from the wetting characteristics change between molten metal and disk surface. Especially, due to the reactive properties of Ti and Zr with ceramic disk, the change of atomizing appearance and powder characteristics were noticeable.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.189-192
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• 2002

Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi, 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~222$^{\circ}C$, 응고온도범위는 20~37$^{\circ}C$로 중.고온계 솔더로서 적용이 가능하다. 실험 조성별 솔더 합금중 실용적, 경제적인 면을 고려하여 Sn-0.7%(Cu+Ni)-3.5%Bi-2%In이 최적의 합금조성으로 판단된다. 이 합금은 융점이 22$0^{\circ}C$정도이며 응고범위는 $25^{\circ}C$, 강도 면에서는 타 합금에 비해 상당히 우수한 값을 나타내었으며 연신율은 비교적 낮은 값을 나타내었다. 다른 기계적, 전기적 특성은 타 솔더 합금과 유사하거나 우수한 편이었으며 젖음특성도 양호하였다.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.261-264
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• 2017

$Ni_{0.79}Co_{0.15-x}Cu_xMn_{2.06}O_4$ ($0{\leq}x{\leq}0.09$) thick films were fabricated using the conventional solid-state reaction method and screen-printing method. Structural and electrical properties of specimens based on the amount of Cu were observed in order to investigate their applicability in the infrared detector. All specimens showed a single spinel phase with a homogeneous cubic structure. As the amount of Cu increased, the average grain size increased and was found to be approximately $5.01{\mu}m$ for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen. The thickness of all specimens was approximately $55{\sim}56{\mu}m$. As Cu content increased, the resistivity and TCR properties at room temperature decreased, and these values for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen were $502{\Omega}-cm$ and $-3.32%/^{\circ}C$, respectively. The responsivity and noise properties decreased with an increase in Cu content, with the specimen with a Cu content of x=0.09 showing 0.0183 V/W and $5.21{\times}10^{-5}V$, respectively.

• Journal of the Korean Society of Food Science and Nutrition
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• v.29 no.1
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• pp.99-105
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• 2000

The purpose of this study was to evaluat the Zn, Cu, Mn and Ni status and correlation of their concentrations in serum, urine, hair and fingernail in female college students. As the results are follows; The mean age of subjects was 22.5 years and height, weight and BMI were 160.1 cm, 51.0 kg and 20.0 respectively. The daily intake of energy 1769.5 kcal and the ratio of carbohydrate, fat and protein for energy is 60 : 20 : 15. The daily intake of energy (88.5%), vitamin B2 (86.1%), Ca (75.4%), Fe (58.3%) and Zn (63.0%) of subjects did not reach to Korean Recommended Dietary Allowance (RDA). The daily mean intake of Zn, Cu, Mn and Ni were 7.56 mg, 2.30 mg, 3.81 mg and 0.18 mg respectively. The concentrations of Zn in serum, urine, hair and nail were 85.6$\mu\textrm{g}$/dL, 391.2$\mu\textrm{g}$/day, 174.6$\mu\textrm{g}$/g and 102.4$\mu\textrm{g}$/g respectively and those Cu were 84.2$\mu\textrm{g}$/dL, 56.6 $\mu\textrm{g}$/day, 20.3$\mu\textrm{g}$/g and 4.3$\mu\textrm{g}$/g respectively. The concentrations of Mn in serum, urine, hari and nail were 0.2$\mu\textrm{g}$/dL, 1.1$\mu\textrm{g}$/day, 1.8$\mu\textrm{g}$/g and 1.6$\mu\textrm{g}$/g respectively and those of Ni were 0.6$\mu\textrm{g}$/dL, 24.5$\mu\textrm{g}$/day, 3.5$\mu\textrm{g}$/g and 3.1$\mu\textrm{g}$/g respectively. The daily intake of Mn showed the positive correlations with concentration of Mn in hair (p<0.05) and the daily intake of Ni was positively correlated with urinary exretion (p<0.05) and hair contents (p<0.001) of Ni. The more detailed studies about these trace mineral status should be required.