• Economic and Environmental Geology
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• v.34 no.3
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• pp.283-299
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• 2001

The middle cover soils and clay liners collected from the Kumheung landfill in Gongiu City were analysed for As, Ba, Cd, Co, Cr, Cu, Fe, Mn, Ni, Pb, Sr, Ti and Zn concentrations using 0.] N HCl digestion and total/sequential extraction experiments followed by ICP-AES determination. The uncontaminated soil and sediment samples were also analyzed for the comparison. The results of sequential extraction showed that Cu was dominant in the oxidizable fraction, and As, Ni, Sr, Ba, and Mn were in the exchangeable fraction. Zinc and Mn occurred mostly in association with reducible, residual and carbonate fractions. Most of Cd and Pb were bound to the reducible and oxidizable fractions. The main carrier of Co, Cr, Fe and 11 was the residual fraction and another important carrier was the reducible fraction. The percentage of the metals of organically-bound form in the middle cover soils and clay liner was in the order of Cu(48%) > Ti(42%) > Pb(27%) > As(25%) > Cd(20%). As deduced from sequential extraction analysis, potential order of metal mobility in the middle cover soils and clay liner from the landfill was proposed: Cd > Sr > As > Ni > Mn > Ba > Cu > Pb > Zn » Co > 11 > Fe > Cr. Based on the 'geoaccumulation index' and the 'enrichment factor' normalized to A], the level of contamination of Cu, Ni and C1' was significant in the samples from Kumheung landfill and surrounding farmland. Their enrichments were attributed partly to anthropogenic pollutions.

• Resources Recycling
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• v.14 no.1
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• pp.17-25
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• 2005

In order to recover valuable metals from the waste electronic scrap, bioleaching of Cu, Zn, Al, Co, Ni, Sn and Pb was carried out using Thiobacillus ferrooxidans as a leaching microorganism in a shaking flask. In a preliminary study, to obtain the data on the leaching of Cu, Zn, Al, Co and Ni, the metal leaching was accomplished using metal powers instead of electronic scrap. The leaching percentaga of Cu, Zn, Co, Al and Ni powers was reduced with the increase of metal power concentration in solution. Below the metal concentration of 0.5 g/L, more than 85% of Cu, Co and Zn powers was leached out. At the electronic scrap concentration of 100 g/L, Thiobacillus ferrooxidans were able to leach more than 90% of the available Cu and Co while Al, Zn and Ni were able to leach less than 40%. Pb and Sn were not detected in the leachate. Pb was precipitated as PbSO$_4$, whereas Sn precipitated probably as SnO.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.225-229
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• 2009

The front metal contact is one of the most important element influences in efficiency in the silicon solar cell. First of all selective of the material and formation method is important in metal contacts. Commercial solar cells with screen-printed contacts formed by using Ag paste process is simple relatively and mass production is easy. But it suffer from a low fill factor and a high shading loss because of high contact resistance. Besides Ag paste too expensive. because of depends income. This paper applied for Ni/Cu metallization replace for paste of screen printing front metal contact. Low cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the screen-printed Ag contacts. Ni has been proposed as a suitable silicide for the salicidation process and is expected to replace conventional silicides. Copper is a promising material for the electrical contacts in solar cells in terms of conductivity and cost. In experiments Ni/Cu metal contact applied same grid formation of screen-printed solar cell. And it has variation of different grid spacing. It was verified that the wide spacing of grid finger could increase the series resistance also the narrow spacing of grid finger also implies a grid with a higher density of grid fingers. Through different grid spacing found alteration of efficiency.

• Progress in Superconductivity
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• v.1 no.2
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• pp.120-124
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• 2000

Ni-13%Cr and Ni-70%Cu alloy tapes were prepared by using high purity metal powders as starting materials. The Ni-13%Cr and the Ni-70%Cu mixtures were isostatically pressed, sintered, rolled and texture-annealed. SEM EDS analysis showed that copper and nickel atoms were completely mixed, while the alloying between the chromium powders and the nickel powders was incomplete. In spite of incomplete alloying between nickel and chromium powders, sharp cube-texture was developed for the Ni-13%Cr tape as well as the Ni-70%Cu tape.

• Journal of Powder Materials
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• v.6 no.2
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• pp.171-177
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• 1999

Ti-45.2at.%Ni-5at.%Cu and Ti-40.2at.%Ni-10atat.%Cu alloy powders were fabricated by gas atomization process. The microstructures, Shape, hardness and phase transformation behaviors of the powders were investigated by means of optical microscopy, scanning electron microscopy, micro-hardness measurement, x-ray diffraction analyses and differential scanning calorimetry. The hardness of the Ti-Ni-XCu alloy powders decreased as Cu-content increased. The x-ray diffraction analyses were carried out for powders without heat treatment, and those that treated at 85$0^{\circ}C$ for an hour in a vaccum state($10^5$ torr) and then quenched into ice water. The intensity of B$19^t$ phase increased with heat treating. The monoclinic B$19^t$ martensite was formed in the Ti-Ni-XCu alloy powders during cooling.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.98-103
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• 2002

BGA(Ball Grid Array) 패키지의 솔더볼 패드 중의 하나인 Au/Ni-Co/Cu 금속층 위에 Bi가 첨가된 Sn-3.5Ag-$\chi$Bi 솔더볼을 리플로우시켰다. 리플로우한 후 130 $^{\circ}C$에서 열처리함에 따른 계면상 및 솔더 내부의 상변화를 관찰하였다. 계면에는 (Ni,Co)$_3$Sn$_4$외에 (Au,Ni,Co,Bi)Sn$_4$가 생성되었음을 관찰할 수 있었고, 솔더 내부에는 (Au,Ni,Co,Bi)SH$_4$, Ag$_3$Sn, Bi 상이 혼재되어 있었다. Nano-indentation에 의한 경도 측정 결과, Bi 함량 증가에 따라 경도는 증가하였으나, 볼전단(Ball Shear) 테스트 결과는 Bi가 증가됨에 따라 오히려 볼전단 강도값이 감소하였다. 이는 파면 검사 결과, 파괴 경로가 주로 계면의 금속간 화합물과 솔더 사이에서 진행함에 기인한 것이다. 솔더 내부의 파괴 경로를 가진 2.5Bi가 가장 우수한 볼전단 강도값을 나타내었는데, 이는 솔더내의 Bi의 고용강화에 기인한 것으로 보인다.

• Journal of dental hygiene science
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• v.4 no.3
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• pp.103-109
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• 2004

The present study prepared 72 test samples - 24 made of amalgam alloy, 24 of Verabond (Ni-Cr alloy) for crown and 24 of Talladium $^{TM}alloy$ for denture - according to the manufacturers' manuals and general method in consideration of the width of the mesial-distal dental crown of the lower $1^{st}$ molar and MOD cavity in clinics, put them in a 200 ml beaker containing 80 ml of artificial saliva, and measured their galvanic corrosion at distances of 0 mm, 7 mm and 40 mm after 7 days. Isolated metals in the electrolyte such as Cu, Ag, Ni, Cr, Sn, Zn and Hg were quantitatively analyzed with Inductively Coupled Plasma - Atomic Emission Spectrometer (ICP-AES, JY-50P, VG Elemental Co. France), and from the results were drawn conclusions as follows. First, Cu, Sn, Ag, Hg and Zn were highly advantageous when amalgam contacted gold alloy compared to Ni-Cr alloy for crown and Talladium alloy for denture. In addition, although gold alloy was finest in terms of oral tissue and biocompatibility, it was most disadvantageous when it was with amalgam. Second, when amalgam contacted gold alloy, heavy metals such as Ni and Cr were not isolated at all because gold alloy did not contain such elements but Sn was isolated as much as $227.1{\pm}18.0035{\mu}g/cm^2$ although it was not included in the composition either. Hg was also isolated. These elements are assumed to have been isolated from amalgam itself. Third, when amalgam alloy was apart from gold alloy 0 mm, 7 mm and 40 mm, Cu and Ag showed significance but Hg did not. This suggests that gold alloy must not be used together with amalgam, and must not be used between dissimilar prostheses regardless of distance. Fourth, when amalgam alloy contacted Ni-Cr alloy for crown, Ag was not isolated from the amalgam, but Zn, Ni, Sn, Hg and Cu were isolated in order of quantity. Significance was observed according to distance - 0 mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Ni-Cr alloy for crown, the isolation Hg was less than that when amalgam alloy contacted Ni-Cr alloy for crown. Fifth, when amalgam alloy contacted Talladium alloy for denture, significance was observed at distances of 0mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Talladium alloy for denture, the isolation Hg was less than that when amalgam alloy contacted Talladium alloy for denture. Sixth, according to the result of ICPES test on Cu, Sn, Ag, Hg, Zn, Ni and Cr of amalgam alloy, gold ally, Verabond and Talladium alloy when these alloys contacted artificial saliva, significance was observed in Cu and Hg. Seventh, when amalgam alloy contracted two non-precious metals Ni-Cr alloy for crown and Talladium alloy for denture in artificial saliva, significance was observed in the isolated by-products of Hg, Ni and Cr according to distance.

• Journal of the Korean Chemical Society
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• v.18 no.3
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• pp.194-201
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• 1974

The tetradentate schiff base ligand, N,N'-bis(salicylaldehyde)-m-phenylenediimine has been prepared from salicylaldehyde and m-phenylenediamine by Duff-reaction. The schiff base ligand has been reacted with Cu(II), Ni(II), Co(II), and Zn(II) to form new complexes; Cu(II)$[C_{20}H_{14}O_2N_2]{\cdot}2H_2O, Ni(II)[C_{20}H_{14}O_2N_2]{\cdot}2H_2O, Co(III)[C_{20}H_{14}O_2N_2]{\cdot}2H_2O and Zn(II)2[C_{20}H_{14}O_2N_2]{\cdot}4H_2O$. It seems to be that the Cu(II), Ni(II) and Co(II) complexes have hexacoordinated configuration with the schiff base and two molecules of water, while Zn(II) complex has tetracoordinated configuration with the schiff base and four molecules of water. The mole ratio of tetradentate schiff base ligand to Cu(II), Ni(II) and Co(II) are 1:1 but to Zn(II) is 1:2. These complexes have been identified by visible spectra, infrared spectra, T.G.A. and elemental analysis.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.81-89
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• 2022

The in-situ electromigration(EM) and annealing test were performed at 110, 130, and 150℃ with a current density of 1.3×10⁵ A/cm² conditions to investigate the effect of non-conductive film (NCF) on growth kinetics of intermetallic compound (IMC) in Cu/Ni/Sn-2.5Ag microbump. As a result, the activation energy of the Ni₃Sn₄ IMC growth in the annealing and EM conditions according to the NCF application was about 0.52 eV, and there was no significant difference. This is because the growth rate of Ni-Sn IMC is much slower than that of Cu-Sn IMC, and the growth behavior of Ni-Sn IMC increases linearly with the square root of time, so it has the same reaction mechanism dominated by diffusion. In addition, there is no difference in the activation energy of the Ni₃Sn₄ IMC growth because the EM resistance effect of the back stress according to the NCF application is not large.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.272-276
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• 2001

Multicomponent $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ bulk matallic glass alloy shows good bulk glass forming ability due to its high resistance to crystallization in the undercooled liquid state.1) In this study, DSC and X-ray diffractometry have been performed to confirm the amorphous structure of the master $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy. To investigate the mechanical properties and deformation behaviors of the bulk metallic $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy, a series of compression tests has been carried out at the temperatures ranging from $351^{\circ}C$ to $461^{\circ}C$ and at the various initial strain rates from $2{\times}10^{-4}s^{-1}\;to\;2{\times}10^{-2}s^{-1}$. There are two types of nominal stress-strain curves. The one shows linear stress-strain relationship meaning fracture at maximum stress, the other shows plastic deformation including steady-state flow. Also DSC analysis for the compressed specimens has been performed to investigate the change of thermal stability and crystallization behavior for the various test conditions.