• 제목/요약/키워드: CuNi

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Carbide분말상의 무전해 도금 (Electroless Deposition on Carbide Powders)

  • 이창언;최순돈
    • 한국표면공학회지
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    • 제28권1호
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    • pp.3-13
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    • 1995
  • Electroless Ni and Cu platings were conducted on $B_4C$ and SiC. In the electroless Ni plating, the deposition rate on $B_4C$ was higher than on SiC. However, the electroless Cu deposition occured with high deposition rate regardless of the carbide substrates used in this study. Uniformity of the deposits was better in the electroless Cu deposition than in the electroless Ni deposition. In the topographies of the electroless depositions, Ni deposits have grown as colony, whereas Cu deposits have grown as fine individual grains.

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