• 제목/요약/키워드: CuCr

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Cu-Cr 합금의 인장강도와 전기전도도에 미치는 Cr 첨가량 및 가공열처리의 영향 (Effects of Cr content and Thermomechanical Treatment on Tensile Strength and Electrical Conductivity of Cu-Cr Alloys)

  • 김기태;정운재;신한철;최종술
    • 열처리공학회지
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    • 제14권1호
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    • pp.17-21
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    • 2001
  • The effects of Cr content above its solubility limit and thermomechanical treatment on tensile strength and electrical conductivity of Cu-Cr alloys were studied to obtain optimum Cr content exhibiting a high tensile strength without degradation of electrical conductivity. The increase in Cr content above the solubility limit increased tensile strength of Cu-Cr alloys without deterioration of the electrical conductivity. The electrical conductivity was not affected by cold rolling. The electrical conductivity of a Cu-3.5%Cr alloy subjected to cold rolling ${\rightarrow}$ aging treatment ($450^{\circ}C{\times}1hr$) ${\rightarrow}$ cold rolling was equal to that of the alloy subjected to cold rolling ${\rightarrow}$ aging treatment. However, the tensile strength of the alloy subjected to the former thermomechanical treatment was superior to that of the alloy subjected to the latter thermomechanical treatment at all the deformation degrees.

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수도생육(水稻生育)에 대한 유해(有害) 중금속(重金屬)의 영향(影響) - 발아 및 묘대기(苗垈期) 생육(生育)에 대하여 - (Influence of Toxic Heavy Metals on Germination of Rice Seeds and Growth of Rice Seedling)

  • 김복진;하영래;김정옥;한기학
    • 한국토양비료학회지
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    • 제11권2호
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    • pp.119-126
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    • 1979
  • 유해(有害) 중금속(重金屬)이 수도의 발아 및 묘대기(苗垈期)의 생육(生育)에 미치는 영향(影響)을 구명(究明)하기 위하여 중금속(重金屬) 원소별(元素別)로 농도(濃度)를 달리한 일정(一定)한 용액(溶液)을 계속(繼續) 공급(供給)하여 발아 및 묘(苗)의 생육(生育)에 미치는 영향(影響)을 조사(調査)한 결과(結果)는 다음과 같다. 1) 발아에 과잉(過剩)의 해(害)를 유발하는 중금속(重金屬)의 처리농도는 Cd; 0.05ppm 이하(以下), Cu; 0.05ppm 이하(以下), Ni; 0.5ppm 이하(以下), Co; 0.5~1.0 ppm, Cr; 0.5ppm~1.0ppm, Mn: 1.0ppm 이하(以下), Zn; 0.5~5.0ppm Pb; 0.5~5.0ppm으로 발아에 미치는 영향(影響)은 Cd>Cu>Ni>Co>Cr>Mn>Zn$$\geq_-$$Pb의 순(順)이었다. 2) 건물중(乾物重)의 감소(減少)를 유발하는 중금속(重金屬)의 처리 농도(濃度)는 Cd;0.05ppm 이하(以下), Ni, Cr, Co; 0.5ppm 이하(以下), Cu; 0.5~5ppm, Zn; 0.5~5ppm, Pb; 5~20ppm, Mn; 10~25ppm, 으로 건물중(乾物重)에 미치는 영향(影響)의 정도는 Ni>Cd>Cr>Co>Cu$$\geq_-$$Zn>Pb>Mn의 순(順)이었다. 3) 건물중(乾物重)의 감소(減少)를 유발하는 건물중(乾物中)의 중금속(重金屬)의 농도(濃度)는 Cd; 0.05~15.5ppm, Ni; 1.50~25.0ppm, Pb: 24.0~28.0ppm, Cu; 26.5~62.5ppm Zn; 470~645ppm, Mn; 231~500ppm, Co; 15.0ppm 이하(以下)였다. 4) 0.5ppm의 처리농도에서 각종(各種) 유해(有害) 중금속(重金屬)의 흡수(吸收) 축적(蓄積)은 Cr이 trace Co; 15ppm, Cd; 17.5ppm, Pb; 24.0ppm, Ni; 25. ppm, Cu; 84.5ppm, Zn; 470.0ppm으로 수도에 의(依)한 흡수정도(吸收程度)는 Zn>Cu>Ni>Pb>Cd>Co>Cr> 의 순(順)이었다. 5) 근활력(根活力)에 대해 과잉(過剩)의 해(害)를 유발하는 중금속(重金屬)의 농도(濃度)는 Ca;0.05ppm 이하(以下), Cu; 0.05~0.5ppm, Cr; 0.5ppm 이하(以下), Ni; 0.5~1.0ppm, Co; 0.5~1.0ppm, Zn; 0.5ppm 이상(以上), Pb; 0.5~5.0ppm, Mn; 1~10ppm으로 근활력(根活力)에 영향(影響)을 미치는 정도(程度)는 Cd>Cu>Cr>Zn>Ni>Co>Pb>Mn의 순(順)이었다.

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유도결합 플라즈마 발광분광기의 매트릭스 보정법에 의한 구리 중납, 카드뮴 및 크롬 분석에 관한 연구 (The Study on Analytical Method of Lead, Cadmium and Chromium in Copper Metal by Matrix Matching Method of Inductively Coupled Plasma Atomic Emission Spectrometer)

  • 주성균;김준;정남용;임규철;최영환;김상경
    • 대한화학회지
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    • 제53권3호
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    • pp.293-301
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    • 2009
  • 일정 농도의 Pb, Cd 및 Cr이 첨가된 합성 Cu표준시료용액 (RMs)을 ICP로 여러 파장에서 Cu매트릭스 미 보정 검정곡선에 준하여 분석한 결과 모든 원소가 전 파장에서 Cu매트릭스의 영향을 받아 정확도 (Pb 140$\sim$1 090%)가 떨어졌다. Pb, Cd 및 Cr의 각각 일정 농도에 Cu의 농도를 변화시켜 분석한 결과 Cu 0.05 wt/v % (0.05 g/100 mL) 이상을 함유하면 실제 Pb, Cd 및 Cr이 첨가된 농도보다 Cu의 농도가 증가함에 따라 일정함수의 비로 감소하거나 증가하여 Cu매트릭스의 영향이 심함을 볼 수 있었다. Cu매트릭스 보정법에 의한 합성 Cu표준시료용액 (RMs)을 분석한 결과 99.9% 이상의 정확도를 보여주었다.

Cu-Cr 합금박막의 필 접착력과 소성변형 (Peel Adhesion Strength and Plastic Deformation of Cu-Cr Alloy Thin Films)

  • 이태곤;임준홍;김영호
    • 한국표면공학회지
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    • 제28권4호
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    • pp.219-224
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    • 1995
  • The peel adhesion and plastic deformation in Cu-Cr alloy films, sputter-deposited onto polyimide films, have been studied as a function of Cr content in the film. The adhesion strength has been measured by T-peel test and the amount of plastic deformation in the peeled metal strip was determined qualitatively by XRD technique. Peel adhesion strength has a maximum in the film containing 22-33wt.% Cr and the peel strength of pure Cr film is lower than the maximum. The film having the highest peel strength is deformed most heavily. The effect of Cr content on the peel strength is discussed in terms of the interfacial bond strength and mechanical properties of Cu-Cr alloy film.

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Effect of gadolinium and boron addition on the texture development and magnetic properties of 23Cr-10NiCu duplex stainless steels

  • Baik, Youl;Kang, Bo Kyeong;Choi, Yong;Woo, Wan Chuck
    • Nuclear Engineering and Technology
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    • 제53권6호
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    • pp.1887-1892
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    • 2021
  • The effect of gadolinium and boron on the texture development and magnetic properties of the texture controlled 23Cr-10NiCu duplex stainless steels were studied to develop a high performance neutron and electromagnetic shielding material. The 23Cr-10NiCu base alloy is composed of 60% of austenite and 40% of ferrite, whereas, the 23Cr-10NiCu-0.5Gd-0.8B modified alloy is composed of 66% of austenite, 27% of ferrite and 7% of CrFeB intermetallic compounds. The gadolinium and boron addition to the 23Cr-10NiCu base alloy increased mechanical properties. Microstructure observation showed that the small addition of 0.5 wt% gadolinium and 0.8 wt% boron to the alloy retarded to form texture at the same hot rolling conditions, and improved the maximum magnetism, residual magnetism and coercive force about 3%, 122% and 120%, respectively.

등줄쥐 (Apodemus agrarius coreae)의 부고환관의 무섬모상피세포와 섬모상피세포의 미세구조에 대한 비교 연구 (Comparative Studies on the Ultrastructures of Non-Ciliated and Ciliated Epithelial Cells in the Ductus Epididymidis of Apodemus agrarius coreae)

  • 이정훈
    • Applied Microscopy
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    • 제28권3호
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    • pp.345-362
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    • 1998
  • In order to the comparative morphological study of the non-ciliated and ciliated epithelial cells, and to elucidate the process of degeneration of non-ciliated epithelial cell of the ductus epididymidis, Korean striped field mouse, Apodemus agrarius coreae was examined with light and transmission electron microscopes. The morphological characteristics of non-ciliated epithelial cell, the cell types of the caput epididymidis (Cp), corpus epididymidis (Cr) and cauda epididymidis (Cu) were long-columnar, short-columnar and short-cuboudal, respectively. The mitochondria and rough endoplasmic reticulum tended to be broken as they immigrated from Cp to the Cu. The Golgi acted vigorously at the Cp, but the Golgi was inactive in Cr and Cu. The secretory vesicles and lysosomes were increased gradually from Cp to the Cu. The process of degeneration of the non-ciliated epithelial cells observed in the Cp, Cr and Cu epididymidis. The increase of the non-ciliated epithelial cells, and its degeneration were observed more often from Cp to the Cu. The morphological characteristics of the ciliated epithelial cells, the cell types of the Cp, Cr and Cu were long-columnar, short-columnar and short-cuboudal, respecptively like the non-ciliated epithelial cells. The stereocilia was long and slender at the Cp and Cr, while Cu was very short. The pinocytotic vesicles and absorptive vesicles were increased from the Cp to the Cu. Numerous disintergrated products was existed at the Cr including the Cp, but Cu were not observed. A significant amount of lysosomes existed at the Cp and Cr epithelial cells, but they were not observed in Cu epithelial cells.

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액체 크로마토그래피에서 Hexadecyl $NtnOenH_4$-Octadecylsilanized silicas(ODS)를 이용한 혼합금속용액으로부터 Cu(II)의 분리 (Separation of Cu(II) from Metal Mixture Solution Using a Hexadecyl $NtnOenH_4$-Octadecylsilanized Silicas(ODS) in Liquid Chromatography)

  • 신영국;김시중;김해중
    • 분석과학
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    • 제8권3호
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    • pp.299-304
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    • 1995
  • 정지상으로서 N, N'-bispalmtoyl 1, 12-diaza-3, 4:9,10-dibenzo-5, 8-cyclopentadecane (hexadecyl $NtnOenH_4$)-octadecylsilanized silicas(ODS)와 이동상으로 물을 사용하여 Ba(II), Cr(II), Fe(II) 및 Cu(II)의 흡착특성을 조사하였다. 수용액상 Ba(II), Cr(II), Fe(II) 및 Cu(II)의 결합상수와 흡착도를 조사한 결과 그 순위는 Ba(II)$NtnOenH_4$-octadecylsilanized silicas(ODS)에 흡측되는 금속이온의 농도 증가는 cation chelation mechanism에 의해 설명할 수 있었다. 또한 수용액상에서 Ba(II), Cr(II), Fe(II) 및 Cu(II)이 혼합된 용액에서 Cu(II)의 분리효율이 다른 이온들에 비해서 좋게 나타남을 알 수 있었다.

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Cu-18wt% Cr 합금박막과 폴리이미드사이의 접착력 : 열처리 영향 (Adhesion between Cu-18wt% Cr Alloy Film and Polyimide : Effect of Heat Treatment)

  • 임준홍;김영호;한승희
    • 한국표면공학회지
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    • 제26권6호
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    • pp.327-333
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    • 1993
  • The effect of heat treatment on the adhesion between Cu-18wt% Cr film and polyimide has been studied by using T-peel test, AES, and XRD. Cu-18wt% Cr alloy and pure Cu films were sputter deposited onto pol-yimide. Cu was electroplated before and after heat treatment at $400^{\circ}C$ for 0.5 hr and 2 hrs respectively. The adhesion of metal film onto polyimide was considerably good before heat treatment, but heat treatment re-duced the peel adhesion strength in all specimens. The reduction in adhesion in adhesion strength values in the specimens which were plated after heat treatment was mainly due to Cr-O rich pahse formed in the metal/polyimide in-terface. In the specimens which were heat treated after plating, the enhanced ductility in the metal films con-tributes the peel adhesion strength by increasing the amount of deformation in metal strips.

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