• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.42-45
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• 2004

High quality CdTe single crystal for the solar cell fabrication was grown by vertical Bridgman method. The etch pits patterns of {111}surfaces of CdTe etched by Nakagawa solution was observed the {111} A composed of Cd atoms with typical triangle etch pits of pyramid mode. From the photoluminescence measurement on {111}A, we observed free exciton($E_x$) existing only higy quality crystal and neytral acceptor bound exciton($A^0$,X) having very strong peak intensity. Then, the full width at half maximum and binding energy of neutral acceptor bound exciton were 7 meV and 5.9 meV, respectively. By Haynes rule, an actibation energy of impurity was 59 meV. Therefore, the origins on impurity level acting as a neutral acceptor were associated Ag or Cu elements.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• Journal of the Korean institute of surface engineering
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• v.24 no.1
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• pp.25-30
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• 1991

The evaporation characteristics of Ag, Al, Au, Cr. Cu, In, Mg, Mn, Pb, Pd, Si, SiO, Sn, Ti and Zn with the various resistive heating sources have been studied. The employed sources are refractory metal (Mo, Ta and W) boats, W-wire, ceramic (usually Al2O3)-coated and -barriered refractory metal boats, and special boats such as baffled boats and intermetallic boats (nitride compound and graphite). We investigated the melting mode, evaporation rate at a specific power, and lifetime of the sources. A special boat holder is also discussed which is needed to cool the sources at a large heat capacity.

• Journal of the Korean Society of Food Science and Nutrition
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• v.19 no.5
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• pp.429-433
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• 1990

Production and properties of invertase from. Aspergillus niger were investigated. Inuli and sucrose were best carbon source and yeast extract was most suitable for the production of the enzyme among tested carbon and nitrogen sources. The enzyme was maximally produced by cultivating the organism at medium of pH 4.5 and temperature of 3$0^{\circ}C$ The optimum pH and temperature for the enzyme activity were pH 5.0 and temperature of 5$0^{\circ}C$ respectively Among tested metal ions Hg2+ Cu2+ and Ag+ ions inhibited the enzyme activity drastically.

• Journal of Microbiology and Biotechnology
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• v.14 no.4
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• pp.863-867
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• 2004

$\alpha$-Galactosidase from A. oryzae DR-5 was induced in the presence of melibiose, raffinose, galactose, and locust bean galactomannan. The enzyme was purified to homogeneity by precipitation with acetone followed by ion-exchange chromatography using DEAE-Sephacel. The purified enzyme showed a single band in both nondenaturing-PAGE and SDS-PAGE. The enzyme was a glycoprotein in nature by activity staining. The molecular weight of the purified enzyme was 93-95 kDa by SDS-PAGE. The enzyme exhibited the optimum pH and temperature at 4.7 and $60^\circ{C}$, respectively. $\alpha$-Galactosidase activity was strongly inhibited by $Ag^{2+}, Hg^{2+}, Cu^{2+}$, and galactose. EDTA, 1,10-phenanthraline, and PMSF did not inhibit the enzyme activity, whereas N-bromosuccinimide completely inhibited enzyme activity. Investigation by TLC showed complete hydrolysis of stachyose and raffinose in soymilk in 3 h at pH 5.0 and $50^\circ{C}$.

• Proceedings of the Korean Society for Quality Management Conference
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• 2004.04a
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• pp.298-301
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• 2004

European Union Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain mercury, cadmium, lead, hexavalent chromium, polybrominated biphenyls(PBB) or polybrominated diphenyl ethers(PBDE) (by Directive 2002/95/EC of The European Parliament and the Council of 27 january, 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment ). So, It is important to develop lead free solder and to assure the reliability of appliance. But lead free solder(i.e. Sn-3Ag-0.5Cu) have some problems such as lift off, whisker, migration and crack, etc. In this paper we discuss the reliability assurance method in lead free solder and appliance.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.225-230
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• 2002

As in most metal forming processes, die and lubrication are of vital importance in hydrostatic extrusion. An efficient die design and lubrication system selection reduce the pressure required for a given reduction ratio by lowering friction at the billet-die interface. In contrast to the conventional macroscopic extrusion, fine-wire fabrication requires higher extrusion pressure and effect of friction is much more significant. Forming fine Au, Ag, and Cu wire with hydrostatic extrusion process in cold condition, the effect of extrusion die angle, lubrication and billet's initial diameter was studied.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.22-30
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• 2013

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

• The Korean Journal of Food And Nutrition
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• v.13 no.2
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• pp.176-180
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• 2000

Microbial protease has been interesting due to the biological roles in the producing microorganism. A thermophilic Actinomyces produing protease was isolated from soil. The optimal medium composition and culture conditions for maximum protease production was as follows 0.5% soluble starch, 0.5% yeast extract. 0.1% K2HPO4, 0.05% CaCl2, initial pH 8.0 at 50$^{\circ}C$ for 48hours. The protease was purified by the procedure of ammonium sulfate precipitation, anion exchange chromatography(LC), DEAE high performance liquid chromatography and GPC HPLC. The purification fold of the purified enzyme was increased about 22.6. The optimal pH and temperature for reaction of the purified enzyme were 7.5 and 60$^{\circ}C$. The purified enzyme was stable for the pH range from 6.0 to 8.5, but was unstable when treated at 80$^{\circ}C$ for 10 minutes. The activity of the enzyme was inhibited by Ag+ and Cu2+.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.231-233
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• 2005

Laser have been utilized as a heat source for the soldering of electronic components for the their capability of localized heating and faster heating rate. Laser soldering process, especially the diode laser soldering of BGA solderball was investigated. In this study, an attempt was made to investigate the possibility of laser soldering using Sn-37Pb and Sn-3Ag-0.5Cu solderball. The laser energy absorbed on the pad raised the temperature of the solderball forming a reflowed solder bump. The result were discussed based on the measurement of pull and shear strength of the bond.