• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.134-139
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• 2007

This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.735-738
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• 2000

The characteristics of wire electrical discharge machining (WEDM) are governed by many factors such as the power supply type, operating condition and electrode material. This work deals with the effect of wire electrode materials on the machining characteristics such as, metal removal rate, surface characteristics and surface roughness during WEDM A wire's thermal physical properties are melting point, electrical conductivity and vapor pressure. One of the desired qualities of wire is a low melting point and high vapor pressure to help expel the contaminants from the gap. They are determined by the mix of alloying elements (in the case of plain brass and coated wire) or the base core material(i.e. molybdenum). Experiments have been conducted regarding the choice of suitable wire electrode materials and influence of the properties of these materials on the machinability and surface characteristics in WEDM, the experimental results are presented and discussed from their metallurgical aspect. And the coating effect of various alloying elements(Au, Ag, Cu, Zn, Cr, Mn, etc.) to the Cu or 65-35 brass core on them was reviewed also. The removal rate of some coated wires are higher than that of 65-35 brass electrode wire because the wire is difficult to break due to the wire cooling effect of Zn evaporation latent heat and the Zn oxide on the surface is effective in preventing short circuit. The removal rate increases with increasing Zn content from 35, 40 and Zn coated wire

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.9
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• pp.1335-1341
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• 2003

This paper describes the process of nanoparticle synthesis by laser ablation of microparticles and consolidated sample. We have generated nanoparticles by high-power pulsed laser ablation of AI, Cu and Ag microparticles using a Q-switched Nd:YAG laser (wavelength 355nm, FWHM 6ns, fluence $0.8{\sim}2.0J/cm^2$). Microparticles of mean diameter $18{\sim}80{\mu}m$ are ablated in the ambient air. The generated nanoparticles are collected on a glass substrate and the size distribution and morphology are examined using a scanning electron microscope and a transmission electron microscope. The effect of laser fluence, collector position and compacting pressure on the distribution of particle size is investigated. To better understand the process of laser ablation of microparticle(LAM), we investigated the Nd: YAG laser-induced breakdown of Cu microparticle using time-resolved optical shadow images. Nanosecond time-resolved images of the ablation process are also obtained by laser flash shadowgraphy. Based on the experimental results, discussions are made on the dynamics of ablation plume.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.472.2-472.2
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• 2014

현재 결정질 실리콘 태양전지의 전 후면 전극의 형성은 스크린 프린팅 방법이 주를 이루고 있다. 스크린 프린팅 방법은 쉽고 빠르게 인쇄가 가능한 반면 단가가 높고 금속 페이스트에 첨가된 여러 혼합물에 의해서 전극과 기판 사이의 저항이 크다는 단점이 있다. 본 논문에서는 도금을 이용하여 태양전지의 전극을 형성한 후 태양전지의 전기적 특성을 비교하였다. 또한 단일반사방지막($SiN_x$) 증착 후 도금을 이용한 전극 형성 시 반사방지막의 pin-hole에 의해 전극 이외의 표면에 도금이 되는 ghost plating 현상이 발생하게 되는데, 이를 방지하기 위해 thermal oxidation을 이용하여 SiO2/SiNx 이중반사 방지막을 증착함으로써 ghost plating을 최소화 시켰다. Ni을 이용하여 전극과 기판 사이의 저항을 낮추었으며, 주요 전극은 Cu 도금을 사용함으로써 단가를 낮추었으며 마지막으로 Cu전극의 산화를 방지하기 위해 Ag을 이용하여 얇게 도금하였다. 실험에 사용된 Si 웨이퍼 특성은 p-형, $156{\times}156mm2$, $200{\mu}m$, $0.5{\sim}3.0{\Omega}{\cdot}cm$ 이다. 웨이퍼는 표면조직화, p-n접합 형성, 반사방지막 코팅을 하였으며 스크린 프린팅 방법을 이용해 후면 전극을 인쇄하고 열처리 과정을 통해 전극을 형성하였다. 이 후 전면에 레이저를 이용해 전극 패턴을 형성한 후 도금을 실행하여 태양전지를 완성하였다. 완성된 태양전지는 솔라 시뮬레이터, QE 및 TLM패턴을 이용하여 전기적 특성을 분석하였으며, SEM과 linescan, 광학현미경 등을 이용하여 전극을 분석하였다.

• Proceeding of EDISON Challenge
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• 2014.03a
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• pp.197-209
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• 2014

환경 오염에 대한 우려의 목소리가 높아지면서 Green chemistry 분야가 각광을 받고 있다. 이 분야에서는 환경에 영향을 적게 미치기 위한 방법의 일환으로 촉매를 연구하며, 그 촉매는 착화합물인 경우가 많다. 그러나 착화합물 내에서 리간드와 금속 이온간의 결합은 예측하기 어렵다. 이는 전형금속보다는 전이금속에서 더욱 심하며, 그 중 한 예로 전이금속에서는 여러 개의 금속 이온이 서로 직접적으로 결합한 채 리간드와 결합하는 착화합물이 발견되기도 한다. 다중 금속 착화합물(Multimetal Complex)로 부르는 이러한 구조는 특유의 복잡함 때문에 잘 알려져 있지 않음에도 불구하고 착화합물의 물리적, 화학적 성질에 직접적으로 영향을 주기에 촉매나 센서, 특히 이를 이용하여 구조체를 만드는 MOF(Metal-Organic Framework) 분야에서는 꼭 알고 있어야 하는 사항이다. 이 연구에서는 GAMESS로 density functional theory (B3LYP functional)를 이용한 양자계산을 수행하여 그 중 가장 간단한 구조인 Dimetal Complex, 그 중에서도 MOF 내에서 많이 발견되는 수차 형태(Paddle wheel) 착화합물에 대해서 다루었다. Cu를 기준으로 그와 비슷한 주기나 족에 있는 Ru, Ag, Zn 등의 금속으로 만든 Paddle wheel 구조의 에너지를 비교하여 Cu가 다른 금속에 비해 이 구조를 안정하게 형성할 수 있는 이유를 알아보았다. 더 나아가 이 구조가 MOF의 형성과 성질에 어떠한 연관성이 있는지 분석함으로써 어떠한 조건이 MOF의 성질을 극대화시킬 수 있는지도 알아보았다.

• Journal of the East Asian Society of Dietary Life
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• v.10 no.6
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• pp.507-513
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• 2000

This study was conducted to investigate the shelf life of beef stored in antimicrobial pottery during 12days storage at 4'C and Five kinds of antimicrobial potteries were prepared with antimicrobial materials such as TiO$_2$, Ag (NO$_3$)$_2$, Cu(NO$_3$)$_2$ and Zn(NO$_3$)$_2$. In changes of color during storage, Hunter's L- and b-value of beef were not changed, but Hunter's a-value was low significantly. The pH of beef meats were low at 6 days, but were added from 6 days. TBA value of beef in "A" pottery containing TiO$_2$ 1% and "C" Pottery containing TiO$_2$ 0.5%, Cu(NO$_3$)$_2$ were lower than "B", "D" and "I" pottery. VBN contents of beef in "A", "B", "C", "D" and "I" Pottery stored during 12 days were 9.8, 12.5, 9.3, 11.9 and 13.7mg%, respectively. In changes of total plate count of beef during storage at 4$^{\circ}C$, the antimicrobial activity of "A" and "C" pottery were superior.g storage at 4$^{\circ}C$, the antimicrobial activity of "A" and "C" pottery were superior.ttery were superior.

• Bulletin of the Korean Chemical Society
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• v.32 no.1
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• pp.122-126
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• 2011

A new phosphorescent cyclometalated heteroleptic iridium (III) complex with an ancillary ligand of 4-azacrownpicolinate was prepared and its metal ion selective phosphorescent chemosensing behavior was investigated. The new iridium (III) complex exhibits notable phosphorescence quenching for Hg2+ in aqueous 50% acetonitrile solution with respect to the selective phosphorescent detection of various metal ions including $Li^+,Na^+,K^+,Cs^+,Mg^{2+},Ca^{2+},Ba^{2+},Fe^{2+},Ni^{2+},Cu^{2+},Zn^{2+},Ag^+,Pb^{2+},Cd^{2+},Cr^{2+},Cr^{3+}$ and $Hg^{2+}$. The phosphorescence quenching for $Hg^{2+}$ increased linearly with increasing concentration of $Hg^{2+}$ in the range of $10{\mu}M-700{\mu}M$ even in the presence of other metal ions, except for $Cu^{2+}$. Consequently, the new iridium (III) complex has the potential to be utilized for the determination of parts per million levels of $Hg^{2+}$ in aqueous acetonitrile media.

• ETRI Journal
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• v.35 no.4
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• pp.625-631
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• 2013

For the formation of solder bumps with a fine pitch of 130 ${\mu}m$ on a printed circuit board substrate, low-volume solder on pad (LVSoP) technology using a maskless method is developed for SAC305 solder with a high melting temperature of $220^{\circ}C$. The solder bump maker (SBM) paste and its process are quantitatively optimized to obtain a uniform solder bump height, which is almost equal to the height of the solder resist. For an understanding of chemorheological phenomena of SBM paste, differential scanning calorimetry, viscosity measurement, and physical flowing of SBM paste are precisely characterized and observed during LVSoP processing. The average height of the solder bumps and their maximum and minimum values are 14.7 ${\mu}m$, 18.3 ${\mu}m$, and 12.0 ${\mu}m$, respectively. It is expected that maskless LVSoP technology can be effectively used for a fine-pitch interconnection of a Cu pillar in the semiconductor packaging field.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.561-566
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• 1995

Additional magnetooptical Kerr effect (AMOKE) was observed in several multilayer structures. For Fe/Pd and Co/Cu Multilayers, AMOKE enhanced the Kerr rotation in short wavelength side, while for Fe/Ag and FeSi/Cu multilayer systems the Kerr rotation enhancement appeared in long wavelength side. A number of ferromagnetic/nonmagnetic/ferromagnetic(FM/NM/FM) sandwiches showed that the AMOKE led to oscillations of Kerr rotation and Kerr ellipticity in certain wavelength range with changing NM layer thickness similar to the oscillatory interlayer coupling. The oscillation of effective optical constants related to the MOKE oscillation was observed for the first time. The mechanisms of the AMOKE were discussed.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.