• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.46-52
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• 2004

To combine the mechanical advantages of ceramics with those of metals, one often uses both materials within one composite component. But, as known, they have different material properties and fracture behaviors. In this study, a four-point bending test is carried out on $Si_3N_4$ joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu interlayer at room temperature to evaluate their longitudinal strain behaviors. And, to detect localized strain, a couple of strain gages are pasted near the joint interfaces of the ceramic and metal sides. The normal strain rates are varied from $3.33{\times}10^5$ to $3.33{\times}10^{-1}s^{-1}$ Within this range, the experimental results showed that the four-point bending strength and the deflection of the interlayer increased with increasing the strain rate.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.1-7
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• 2011

Active brazing of ceramic to metal is reviewed in this paper. As one of the key aspect in joint techniques, active brazing has been developed to simplify the manufacturing procedure of brazed joints between ceramic and metal. The active filler metal includes Ag-Cu-Ti series, Cu-Ti series, Co-Ti series and so on. The active filler metal which supplies the chemical bonds between ceramic and metal, enhances the wetting of filler metal on ceramic surface and eliminates the need for metallization treatments. The residual stress caused by difference of coefficient of thermal expansion between ceramic and metal, holds a direct influence on the bonding strength and even results in a fracture. Good joints of ceramic to metal promote the miniaturization and simplicity of electronic components with multifunction.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.3
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• pp.208-213
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• 1998

Microwave dielectric properties of $BiNbO_4$ containing CuO and $V_2O_5$(BN ceramics). BN ceramic with 0.07wt% $V_2O_5$ and 0.03wt% CuO (BNC3V7) was sintered at $900^{\circ}C$ where it is possible for these to be co-fired with Ag electrode. The dielectric constant of 44.3, TCF (Temperature Coefficient of resonance Frequency) of 2 ppm/$^{\circ}$ and Q${\times}f_o$ value (product of Quality value and resonance Frequency) of 22,000GHz could be obtained from those ceramics. It is observed that orthorhombic structure was stable $1000^{\circ}C$. As sintering temperature increases, the dielectric properties decreased. The main reasons were abnormal grain growth and the main peak of triclinic moved from the main peak of orthorhombic.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.206-208
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• 2006

The reliability of BGA (ball grid array) package with OSP (organic surface preservative) surface finish under thermal cycle was investigated by using SEM (scanning electron microscopy), EDS(energy dispersive spectroscopy), image tool and ball shear test. The IMCs (intermetallic compounds) were increased with increasing number of thermal cycles. However, the shear strengths of solder ball were decreased with increasing number of thermal cycles. The order of solders which had the highest shear strength as follow: Sn-3.5wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, Sn-37wt%Pb.

• Journal of the Korean Ceramic Society
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• v.37 no.12
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• pp.1212-1220
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• 2000

Bi-2223 초전도체계에서 석출물을 flux-pinning center로 이용할 수 있는지 가능성을 타진하기 위하여 $Bi_{1.8}$P $b_{0.4}$S $r_{2}$C $a_{2.2}$C $u_3$ $O_{8}$ 조성을 가진 Bi-2223/Ag 선재를 반응온도, 산소분압, 시간 등을 변화시키면서 열처리를 행하였다. 열처리 후 석출물들은 XRD, SEM, TEM, EDS로 분석하였다. Bi-2223 모상내의 (Ca, Sr)$_2$(Pb,Bi) $O_4$, B $i_{0.5}$ P $b_3$S $r_2$C $a_2$Cu $O_{12+}$$\delta$/ (3221)와 같은 2차상들의 크기와 분포는 2223 입자들의 연결성을 파괴하지 않고 열처리 조건에 의해서 조절할 수 있었다. 서냉 열처리가 된 시편은 임계전류밀도( $J_{c}$)값이 증가하였는데, 이는 2223 입자내 나노미터 크기로 형성된 석출물들이 flux-pinning sites로 작용한 것으로 추정된다.다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.88-95
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• 2002

Recent development in the field of RE-Ba-Cu-O (REBCO, RE: Y or rare earth elements) bulk high-Tc superconductors (HTS) is reviewed in the present paper. After the fatal weak link problem of sintered REBCO superconductors has been overcome by melt processing, this field has been greatly advanced during last ten years. The critical current density $J_c$ at 77 K has been enhanced by introducing effective flux pinning sites into the $REBa_2Cu_3O_y$ (RE123) superconducting matrix. Large melt-textured REBCO bulk crystals have been fabricated with the TSMG(top-seeded melt growth) technique. Mechanical properties of REBCO bulks have been improved by using the Ag additive or epoxy resin. Real bulk applications such as current lead, fault current limiter, flywheel energy storage system, magnetic field source, magnetic separation system, and etc., surely come true near future.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.31-33
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• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

• Journal of Technologic Dentistry
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• v.7 no.1
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• pp.13-18
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• 1985

Casting alloys, both precious and non-precious, were by heat in order to observe the change in HB and the results were : 1. The hard treatment showed 1.4 - 1.5 times as high as the soft treatment in HB. 2. The experiment shows that Au-Pt should be contained more than 75% to prevent color change. 3. Cu by hard teatment played the greatect part in creasing the solidity of Ag-Cu alloy. 4. Casting Co-Cr alloys showed little difference of HB in heat treatment.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.385-392
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• 2005

The restriction of the use of hazardous substances in electrical and electronic equipment legislation mandates the substitution of lead and other hazardous substances in electronics products by July 2006. Due to this legislative pressure, the electronics industry is moving to adoption of lead free solders. In this paper, we investigated a flux to restrict generating electrochemical migration in lead-free solder. The lead-free solders used in this study were Sn-0.7Cu-0.01P and Sn-3.0Ag-0.5Cu. To measure the resistance of electrochemical migration, the dew-cycle test and water drop test were adopted. As the result, now flux having high durable of electrochemical migration was developed.