• 보존과학연구
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• s.20
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• pp.81-90
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• 1999

We performed the non-destructive analysis of objects excavated at the Tomb of Mich’un-ri in Ch’ung-won. We analysed components using of Energy Dispersive X-Ray Micro-Fluorescence Analyzer. Glass bead inlaid with silver was classified as K2O-CaO-SiO2 type of glass. Purity of silver inlaid in the surface was verified above 97%.All small ear-ring were made by rolling up gold broad to a bronze wick. The composition ratio of Au : Ag has significantly higher 87 : 11 than bigear-ring. As a result of composition analysis of a welded part with big ear-ring, it contained the more Cu, Hg contents and the less Au, Ag contents than the surface of big ear-ring.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.203-204
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• 2004

Suspension effect has been studied by using superconductor of BiPbSrCaCuO ceramics containing $Ag_2O$. It has been cleared that $Ag_2O$ acts as pinning center which plays an important role to the suspension effect. Magnetic repulsive force which affects a superconductor located in magnetic flux from toroidal magnet has been investigated. It has been concluded that the suspension effect arises from the interaction between the pinning effect and the diamagnetic effect.

• Analytical Science and Technology
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• v.14 no.6
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• pp.540-544
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• 2001

Determination of cyanide ion has been studied by adsorptive stripping voltammetry using hanging mercury electrode. Cyanide ion complexed with copper ion is adsorpbed on the electrode and oxidised at the positive potential scan. Optimal conditions of CN determination were found to be ; supporting electrolyte solution ; 0.1 M NaCl of ammonium buffer at pH 10, accumulation potential; -800 mV vs Ag/AgCl, accumulation time ; 300 s, scan rate ; 50mV/s. The linear concentration of cyanide ion was observed in the range $1{\times}10^{-8}$, $1{\times}10^{-7}M$. The detection limit(n/s=3) was $0.13{\mu}g/L$($5{\times}10^{-9}M$) with 3.5% RSD.

• Korean Journal of Materials Research
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• v.3 no.6
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• pp.668-677
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• 1993

The microstructural and shear tests of STS304/, STS430/ and low-C steel/Cu joints brazed using Cu-P, Cu-P-Sn(four type) and Cu-P-Sn-Ag(three type) filler metals at 1003 and 1033K for 1.2ks in Ar atomsphere were performed. Interfacial microstructures were divided into three type ; first, reaction layer contained cracks second, dispersed layer without cracks third, dispersed layer and reaction layer contained cracks. The joints composed only of dispersed layer without cracks have the high shear strength of above 40-60 MPa and result in failure in copper base metal. Low shear strength and joint failure result from the formation of reaction layer which induced cracks. The reaction layer is a Fe-P compound. This tendency of microstructure and shear strength depends on the existence and/or nonexistence of Sn in filler metals as well as Ni (and Cr) in base metals.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.66-66
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• 2009

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites(diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature 940 $^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.

• Solar Energy
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• v.20 no.2
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• pp.43-54
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• 2000

We prepared and characterized $Cu(In_{1-x}Ga_x)Se_2$(CIGS) films using a elemental co-evaporation method for absorbing layer of high efficiency thin film solar cells. The CIGS films deposited on a soda-lime glass exhibited low resistivity because of higher carrier concentration. Na was accumulated at the CIGS surface and the 0 and Se were also accumulated at the surface, suggesting that oxidation is a driving force of Na accumulation. The structure of CIGS film was modified or a secondary phase was formed in the Cu-poor CIGS bulk films probably due to the incorporation of Na into Cu vacancy sites. As the Ga/(In+Ga) ratio increased, the diffraction peaks of $Cu(In_{1-x}Ga_x)Se_2$ films were shifted to larger angle and splitted, and the grain size of $Cu_{0.91}(In_{1-x}Ga_x)Se_2$ films became smaller. All $Cu_{0.91}(In_{1-x}Ga_x)Se_2$ films showed the p-type conductivity regardless of the Ga/(In+Ga) ratio. Ag/n-ZnO/i-ZnO/CdS/$Cu_{0.91}(In_{0.7}Ga_{0.3})Se_2$/Mo solar cells were fabricated. The currently best efficiency in this study was 14.48% for $0.18cm^2$ area ($V_{oc}=581.5mV,\;J_{sc}=34.88mA$, F.F=0.714).

• Journal of Mushroom
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• v.2 no.3
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• pp.127-139
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• 2004

Laccases are multicopper-containing enzymes which catalyze the oxidation of phenolic and nonphenolic compounds with the concomitant reduction of molecular oxygen. They often occur as isoenzymes, either constitutive or inducible, that oligomerize to multilateral complexes, what allow for penetration to the woody cell wall structure. White rot basidiomycete fungi may produce a number of laccase isoenzymes, some constitutively and others after induction. Fungal laccase is commonly induced by many ions, such as $Cu^{2+}$, $Cd^{2+}$ $Ca^{2+}$, $Li^+$, $Mn^{2+}$, $Ag^+$, $Hg^{2+}$, Mn and $Fe^{3+}$, phenolic compounds, some organic compounds, such as ethanol, isopropanol, cAMP, caffeine, p-anisidine, viscosinamide and paraquat, and nitrogens and even heat shock. A combination of Cu and pHB (p-hydroxybenzoic acid) made it possible to extend the inducible laccase activities over 30-fold. But the most effective inducer of laccase in the basidiomycete and other higher fungi is 2,5-xylidine, over 160-fold stimulation of laccase activity. The laccases are frequently encoded by gene families, as e.g. in Pycnoporus cinnabarinus, from which the lcc3-1 or the allelic form lac1 and lac3-2 have been cloned and sequenced. In the case of inducible forms the post-inductional laccase formation depends upon the synthesis of mRNA and the induction is due to the synthesis of a new protein.

• Journal of Conservation Science
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• v.31 no.3
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• pp.243-254
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• 2015

In this study, the stability of the adhesive was determined through the Oddy Test that is Verification Test for potential damage by various materials. And to find the factor causing the corrosion of the metal samples, the adhesives and coatings those are usually used in the metal preservation process were selected and treated on the samples. Six kinds of adhesives and four kinds of metal specimens Fe, Pb, Cu, Ag were used. As results, the weight change showed high increasement in the rate of weight change 29.87% of Fe sample. The chromaticity measurement showed the high change value of the Cellulose-based adhesive. In case of the VOCs test from adhesive by using GC-MS, Acetic acid was detected from all six kinds of the adhesives. Compared to cellulose-based adhesives and the other adhesives, the amount of VOCs per 1mg concentration is higher than 900 times and was detected small amount of Formic acid. This is assumed to be facilitated by acid impurities and the light. This reaction was considered as the result of reducing a large amount of molecular and of generating a large amount of Nox. And thus the reacted sulfur changes was considered as the factor for causing corrosion.