• The Korean Journal of Malacology
• /
• v.22 no.2
• /
• pp.167-173
• /
• 2006

The embryos of marine bivalves have been commonly used in bioassays for quality assessments of marine environments. Although several standard protocols for the developmental bioassay of bivalves have been proposed, only a few trials for application of these protocols in environmental assessments or for the development of a new protocol with Korean species have been conducted. As such, there is a strong need to establish standard bioassay protocols with bivalves commonly found in Korean waters. To determine the sensitivity of Mytilus galloprovincialis to establish a standard bioassay, their fertilized eggs were exposed to six metals (Ag, Cd, Cr, Cu, Ni, and Zn). The order of biological impact was Ag > Cu > Ni > Zn > Cr > Cd and their lowest observed effective concentration were 5, 16.4, 25.4, 142, 187 and 1,500${\mu}g/l$, respectively. The proportion of normal larvae appeared to decrease linearly with the logarithm of each toxicant concentration within the tested range. The average values of median effective concentrations $(EC_{50})$ from the triplicate experiments for Ag, Cd, Cr, Cu, Ni, and Zn were 6.8, 1,797, 786, 16.6, 68.1, and 139.2${\mu}g/l$, respectively. There was a more than 100-fold difference in $EC_{50}$ values of Cu and Cd. The value of $EC_{50}$ or median lethal concentration of Cu was within the range observed for other bivalve developmental bioassays. The overall sensitivity of M. galloprovincialis in the present developmental bioassay was also similar to that of other marine organisms commonly used in aquatic bioassays (e.g. sea urchins, oysters). Hence, the bioassay using the embryo of M. galloprovincialis is considered to be a useful tool to monitor and evaluate the quality of marine aquatic environments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.15 no.6
• /
• pp.535-538
• /
• 2002

Suspension effect has been studied by using superconductor of BiPbSrCaCuO ceramics containing $Ag_2()$. It has been clear that $Ag_2()$ acts as pinning center which plays an important role to the suspension effect. Magnetic repulsive force which affects a superconductor located in magnetic flux from toroidal magnet, has been investigated. It has been concluded that the suspension effect arises from the interaction between the pinning effect and the diamagnetic effect.

• 보존과학연구
• /
• s.6
• /
• pp.121-196
• /
• 1985

Atomic absorption spectrophotometer was used for analyzing each 10elements(Cu, Pb, Sn, Zn, Sb, Fe, Ni, Ag, Co and Mn)on 64 Chinese coinsre covered from Shinan seabed sunken ship. The results show that Cu, Pb and Sn were found to be a major elements consisting of coins and its composition ratio was 6 to 2 to 1.The composition of trace elements on coins was classified 3 levels : Sb, Fe and Zn(0.02%-2.2%), Ag, Ni, and Co(50 ppm-5500 ppm) and Mn(Trace). Theam ount of major elements, Cu and Sn were decreased while increased in Pbby the passage of ages (10th - 13th century) in China. There seems to be no systematic compositional change in major elements but content in trace elements was confirmed to increase with age.

• 한국지구물리탐사학회:학술대회논문집
• /
• 2003.11a
• /
• pp.536-539
• /
• 2003

The Dongjung Au-Ag-Cu mine area was seriously contaminated with As and heavy metals-Cd, Cu, Hg, Mn, Pb and Zn etc. Those elements were highly accumulated in plants grown at farmland as well as farmland soil. Stream waters and groundwater which has been used as drinking water around the mine site contain high levels of heavy metals, especially As. As a result of human health risk assessment using EHS(Extraction of Heavy metals in Stomach and Small intestine) test for bioaccessible contents of heavy metals, there is a potential of cancer and adverse effects on human health for the residents of the mine area.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11b
• /
• pp.101-103
• /
• 2001

Suspension effect has been studied by using superconductor of BiPbSrCaCuO ceramics containing $Ag_{2}O$ It has been cleared that $Ag_{2}O$ acts as pinning center which plays an important role to the suspension effect. Magnetic repulsive force which affects a superconductor located in magnetic flux from toroidal magnet has been investigated. It has been concluded that the suspension effect arises from the interaction between the pinning effect and the diamagnetic effect.

• Resources Recycling
• /
• v.27 no.5
• /
• pp.14-22
• /
• 2018

In this study, scarp of PCB containing copper and precious metals was manufactured as an anode, and electrorefining experiments were conducted on change of $H_2SO_4$ concentration and current density. Through electrolytic refining experiments, the concentration of Cu and slime recovered from each electrode was analyzed, element behavior was confirmed, and current efficiency was also calculated. As the $H_2SO_4$ concentration was increased, the current efficiency and the purity of Cu decreased, but the precious metals in the anode slime were maximally concentrated with 2.0 M $H_2SO_4$. In addition, as the current density was increased, the current efficiency decreased and the purity of Cu showed a tendency to increase, and the precious metals in the anode slime were maximally concentrated with $300A/m^2$. As a result of the pilot scale experiments, the Au content was 8,705 mg/kg, the Ag content was 35,092 mg/kg in the anode slime. As compared with the initial content, Au was concentrated 16 times and Ag concentrated 14 times.

• 한국초전도학회:학술대회논문집
• /
• 2008.08a
• /
• pp.88-88
• /
• 2008

• Journal of the Microelectronics and Packaging Society
• /
• v.12 no.1 s.34
• /
• pp.35-40
• /
• 2005

The oxidation of pure Sn and Sn-0.7Cu, Sn-3.5Ag, Sn-lZn, and Sn-9Zn alloys at $150^{\circ}C$ was investigated. Both the chemical nature and the amount of oxides were characterized using electrochemical reduction analysis by measuring the electrolytic reduction potential and total transferred electrical charges. X-ray photoelectron spectroscopy (XPS) was also conducted to support the results of reduction analysis. The effect of Cu, Ag and Zn addition on surface oxidation of Sn alloys is reported. For Sn, Sn-0.7Cu and Sn-3.5Ag, SnO grew first and then the mixture of SnO and $SnO_2$ was found. $SnO_2$ grew predominantly for a long-time aging. For Zn containing Sn alloys, both ZnO and $SnO_2$ were formed. Zn promotes the formation of $SnO_2$. Sn oxide growth rate of Pb-free solder alloys was also discussed in terms of alloying elements.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.4
• /
• pp.57-64
• /
• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.3
• /
• pp.25-29
• /
• 2014

Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.