• Journal of Magnetics
• /
• v.11 no.4
• /
• pp.160-163
• /
• 2006

We have prepared crystalline Ag nanoparticles with an average size of 4 nm in diameter by using an inductively coupled plasma reactor equipped with the liquid nitrogen cooling system. Our magnetic data show that the nano-sized effect of Ag nanoparticles on the magnetic properties is ferromagnetic, instead of a diamagnetic component of the Ag bulk and a superparamagnetic component of magnetic nanoparticles. We have also studied the magnetic properties of Ag-Cu nanocomposites with an opposite concentration profile between surface and core. These comparisons indicate that the ferromagnetic component strongly depends on the surface of Ag nanoparticles, while the paramagnetic component is strongly affected by the outer oxide layer, with the background of a diamagnetic component from the core of Ag.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.4
• /
• pp.49-53
• /
• 2011

High-speed Cu filling into a through-silicon-via (TSV) and simplification of bumping process by electroplating for three dimensional stacking of Si dice were investigated. The TSV was prepared on a Si wafer by deep reactive ion etching, and $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to increase the filling rate of Cu into the via, a periodic-pulse-reverse wave current was applied to the Si chip during electroplating. In the bumping process, Sn-3.5Ag bumping was performed on the Cu plugs without lithography process. After electroplating, the cross sections of the vias and appearance of the bumps were observed by using a field emission scanning electron microscope. As a result, voids in the Cu-plugs were produced by via blocking around via opening and at the middle of the via when the vias were plated for 60 min at -9.66 $mA/cm^2$ and -7.71 $mA/cm^2$, respectively. The Cu plug with a void or a defect led to the production of imperfect Sn-Ag bump which was formed on the Cu-plug.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.11a
• /
• pp.63-66
• /
• 1996

The method for calculation of $Y_2$BaCuO$_{5}$ contents was set up. It was estimated that the optimum value of 211 contents in the textured YBCO superconductor as flux pinning center was about 20wt.%. Ag contents have no influence on the critical temperature, but have large influence on the critical current density of the textured YBCO. When Ag contents over 15wt.%, which was the solubility of condensed YBCO, the critical current densities tend to a stable value.e.

• Economic and Environmental Geology
• /
• v.53 no.4
• /
• pp.363-381
• /
• 2020

The polymetallic Co, Ni, Cu, As, Au, and Ag deposits of Bou Azzer East are located in the western part of the Bou Azzer inlier in the Central Anti Atlas, Morocco. Six stages of emplacement of the mineralization have been identified. Precious metals (native gold and electrum) are present in all stages of this deposit except the early nickeliferous stage. From the Statistical analysis of the Co, As, Ni, Au, and Ag contents of a set of 501 samples, shows that the Pearson correlation coefficient between As-Co elements (0.966) is the highest followed by that of the Au-Ag couple (0.506). Principal component analysis (PCA) and hierarchical ascending classification (HAC) of the grades show, that Ni is associated with the pair (As-Co) and Cu is rather related to the pair (Au-Ag). The kriging maps show that the highest values of the Co, As and Ni appear in the contact of the serpentinite with other facies, as for those of Au and Ag, in addition to anomalous zones concordant with those of Co, Ni and As, they show anomalies at the extreme South and North of the study area. The development of the anomalous Au and Ag zones is mainly along the N40-50°E and N145°E directions.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.08a
• /
• pp.219-219
• /
• 2012

The formation and thermal desorption behaviors of octanethiol (OT) SAMs on single crystalline Au (111) and polycrystalline Au, Ag, and Cu substrates were examined by X-ray photoelectron microscopy (XPS), thermal desorption spectroscopy (TDS), and contact angle (CA) measurements. XPS and CA measurements revealed that the adsorption of octanethiol (OT) molecules on these metals led to the formation of chemisorbed self-assembled monolayers (SAMs). Three main desorption fragments for dioctyl disulfide (C8SSC8+, dimer), octanethiolate (C8S+), and octanethiol (C8SH+) were monitored using TDS to understand the effects of surface morphology and the nature of metal substrates on the thermal desorption behavior of alkanethiols. TDS measurements showed that a sharp dimer peak with a very strong intensity on single crystalline Au (111) surface was dominantly observed at 370 K, whereas a broad peak on the polycrystalline Au surface was observed at 405 K. On the other hand, desorption behaviors of octanethiolates and octanethiols were quite similar. We concluded that substrate morphology strongly affects the dimerization process of alkanethiolates on Au surfaces. We also found that desorption intensity of the dimer is in the order of Au＞＞Ag＞Cu, suggesting that the dimerization process occurs efficiently when the sulfur-metal bond has a more covalent character (Au) rather than an ionic character (Ag and Cu).

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.2
• /
• pp.225-231
• /
• 2012

Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also, through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.20 no.5
• /
• pp.559-563
• /
• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Journal of the Korean Society for Heat Treatment
• /
• v.9 no.2
• /
• pp.103-111
• /
• 1996

In this paper, we studied on both electrochemical polarization behaviors and pitting characteristics of ultra high strength Al-Cu-Li-Mg-Ag-Zr alloys(named C1 and C2) and 2090 alloy according to their treatments in the deaerated 3.5% NaCl, using by the potentiodynamic and the potentiostatic method, SEM micrograph and surface roughness including depth of pitting attack. With the cyclic polarization curves, the hysteresis of the C1 and C2 alloys appeared more remarkably than that of the 2090 alloy, because of precipitation microstructural difference between C1, C2 alloys and 2090 alloy. In the pitting experiments, the correlations between pitting growth and aging conditions were analyzed with the SEM micrograph and measurement of the pit depth.

• Journal of Welding and Joining
• /
• v.29 no.5
• /
• pp.95-98
• /
• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Economic and Environmental Geology
• /
• v.27 no.6
• /
• pp.549-556
• /
• 1994

Geochemical studies on gold-bearing quartz veins and wallrocks from the Okgye mine were carried out in order to investigate the primary dispersion patterns of gold and associated elements and to quantify the dispersion width of elements with distance from the gold-bearing quartz veins. Gold-bearing quartz veins occur in basaltic trachyandesite of unknown age. Enrichment of $k_2O$, MnO, Au, As, Rb, Sb, Pb, Zn, Cu, Ag and Cd, and depletion of $Na_2O$ and Sr are found in altered wallrocks. The ratio of $k_2O(k_2O+Na_2O)$, alteration index for trace elements, and Rb/Sr in altered wallrocks are increased, whereas Sr/CaO ratio is decreased with approach to the gold-bearing quartz veins. The widths of primary dispersion range from 17 cm to 155 cm. The relative dispersion width increases in order Au=Cu=Zn=Ag=Cd$k_2O$=Rb and Ba< $Na_2O$ $Na_2O$, As, Sb, Sr, Pb, Au, Cu, Zn, Ag and Cd, and a quadratic function for $k_2O$, MnO, Rb and Ba.