• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.551-554
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• 2002

As a general rule, the brazing process between cemented carbides and steel used by Silver (Ag) type brazing filler. The composition of Ag type filler were used Ag-Cu-Zn-Cd type filler mainly. But, the demand of Cadmium (Cd)-free in Ag type filler was raised recently. The reason why Cd-free in Ag brazing filler were occupied to vaporize as a CdO$_2$ when brazing process, because of Cd element was almost low boiling point of all Ag type filler elements. And, CdO$_2$ was a very harmful element for the human body. This experiment was developed Cd-freeing on Ag type filler that was used Indium (In) instead of Cd element. In this experiment, there were changed from 0 to 5% In addition in Ag brazing filler and investigated to most effective percentage of Indium. As a result, the change of In addition instead of Cd, there was a very useful element and obtained same property only 3% In added specimens compared to Cd 19% added specimens. These specimens were obtained same or more deflective strength. In this case, there were obtained 70 MPa over strength and wide brazing temperature range 650-800 C. A factor of deflective strength were influenced by composition and the shape of $\beta$ phase and between $\beta$ phase and cemented carbides interface. Indium element presented as $\alpha$ phase and non-effective factor directly, but it's occupied to solid solution hardening as a phase. $\beta$ phase were composed 84-94% Cu-Ni-Zn elements mainly. Especially, the presence of Ni element in interface was a very important factor. Influence of condensed Ni element in interface layer was increased the ductility and strength of brazing layer. Therefore, these 3% In added Ag type filler were caused to obtain a high brazing strength.

• 한국자기학회지
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• 제12권3호
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• pp.94-98
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• 2002

20nm이하의 얇은 박막에서도 높은 보자력이 요구되는 Ti/CoCrPt 수직자기기록박막의 보자력 향상을 위해 Al, Cu, Ni, Cr, Ag, Mg, Fe, Co, Pd, Au, Pt, Mo, Hf등의 여러 하지층과 제조조건이 보자력에 미치는 영향을 조사하였다 이들 중 Ag과 Mg하지층은 Ti/CoCrPt박막의 보자력을 향상시켰으며 특히 2nm Ag 하지층을 사용할 경우 10nm CoCrPt 박막에서 2200 Oe의 높은 보자력을 보일뿐 아니라 $\alpha$값을 낮추는 효과가 있었다. 그러나 Ag를 하지층으로 사용하면 기대와는 달리 Ti(002)면의 우선배향 성장이 전혀 일어나지 않아 보자력 증대에 다른 기구가 작용하는 것으로 판단되었다. 그리고 표면의 거칠기가 큰 기판에서는 보자력뿐만 아니라 역자구생성자계도 감소하였다.

• 센서학회지
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• 제6권6호
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• pp.500-507
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• 1997

형상기억 합금의 정밀한 동작 온도 조절을 위한 불순물의 종류에 따른 형상기억합금의 열처리 효과를 연구하였다. 급냉온도에 따른 전기 저항 측정으로 Cu-17.25Zn-15Al 및 Cu-17.25Zn-15Al-1Ag/Fe 의 열처리에 의한 마르텐사이트 변태온도의 변화를 측정하였다. 승온율에 따른 DSC(Differential scanning calorimeter) 측정으로 고온모상에서의 상전이 온도와 종류를 구별하였다. 그리고 XRD 측정으로 구조 변화를 관찰하였다. Cu-17.25Zn-15Al 합금에서 고온 모상의 규칙-불규칙 전이온도인 $T_{B2}$, $T_{L21}$은 각각 809K와 610K이고. Cu-17.25Zn-15Al-1Ag 및 Cu-17.25Zn-15Al-1Fe 시료의 $T_{B2}$, $T_{L21}$은 각각 794K, 610K 그리고 803K, 613K 이다. 모든 시료에서 $T_{B2}$ 근방에서의 급냉은 마그텐사이트. 변태온도를 높이지만 $T_{L21}$ 근방에서의 급냉은 마르텐사이트 변태온도를 낮춘다.

• Journal of Mechanical Science and Technology
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• 제16권7호
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• Journal of Welding and Joining
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• 제30권6호
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• pp.1-5
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• 2012

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 춘계학술발표회 초록집
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• pp.78-78
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.207-208
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• 2009

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.921.1-921.1
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• 2006

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 마이크로전자및패키징학회지
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• 제30권3호
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• pp.64-72
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• 2023

본 연구에서는 Cu 기판 위에 그래핀(graphene)을 전사하고 Cu 기판 위에 Sn-3.0Ag-0.5Cu 무연(Pb-free) 솔더페이스트를 도포한 후에, 리플로우 솔더링 공정 및 다양한 온도(125, 150, 175 ℃)에서 등온 시효 1000 h 동안 Cu 기판과 솔더 계면에서 발생하는 금속간화합물(intermetallic compound, IMC)의 형성과 성장 거동에 전사된 graphene의 미치는 영향에 대하여 보고하였다. Graphene이 계면에 존재하는 경우 graphene이 존재하지 않은 경우와 비교할 때, 솔더링 공정 및 시효 동안 형성되어 성장하는 Cu₆Sn₅과 Cu₃Sn IMC의 두께가 감소하는 것을 확인 할 수 있었다. 또한, 계면에 존재하는 전사된 graphene 층(layer)은 시효 온도와 시간에 따라 IMC들의 성장 거동과 관계된 Cu₆Sn₅과 Cu₃Sn IMC의 성장 속도 상수와 성장 속도 상수 제곱 값들도 크게 감소시킬 수 있는 것으로 나타났다.