• Journal of Biomedical Engineering Research
• /
• v.17 no.2
• /
• pp.247-254
• /
• 1996

The relationship between the isothermal age-hardening behavior and the phase transformation in the commercial dental Au-Ag-Cu-Pd alloy was investigated Age-hardening was mostly attributed to the lattice distortions of the supersaturated w phase resulting from the transformation to the metastable phasel which were more distinct at lower aging temperature. The lattice distortions resulting from the transformation of the metastable phases to the equilibrium phases also made a contribution to the age-hardening.

• Journal of Biomedical Engineering Research
• /
• v.15 no.4
• /
• pp.389-394
• /
• 1994

The age-hardening behavior and the structural changes in a commercial dental Au-Ag-Cu-Pd alloy were investigated by means of hardness test, optical and scanning electron microscopic observation, energy dispersive spectroscopy and X-ray diffraction study. The drastic reduction in hardness by prolonged aging occurred after a rapid increase in hardness at the initial stage by the isothermal aging at $350^{\circ}C$. This softening was due to the broad precipitates formation of the lamellar structure which was composed of the f.c.t. AuCu I ordered f.c.t. phase containing Pd and the f.c.c. Ag-rich $\alpha$1 solid solution f.c.c.phase containing Au.

• Journal of Welding and Joining
• /
• v.12 no.3
• /
• pp.48-55
• /
• 1994

In this experiment, to find optimum brazing conditions for Cu/Stainless Steel brazing using filler metals of Ag-Cu-Zn-Cd system, first of all spreading ratio was tested on 304 stainless Steel and low carbon steel. And then shear test of brazed joint was executed. As the result of that, the shear strengths of brazed joints were the range of 60-90 MPa. Through microstructure analysis for brazed interface layer, We found as follows. Firstly interface layer increased as time increased. Secondly continuous layer of Ag-Cd compound was observed along the side of stainless steel. Also by means of EDS analysis for fracture surface, ductile fracture was occurred and precipitates on the fracture surface were found to include Cr, Mn, Si in Ag-rich phase.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.11a
• /
• pp.284-284
• /
• 2015

반도체 Ball Grid Array(BGA)에 사용되던 종래의 Solder Ball은 Sn96.3 Ag3.0 Cu0.7의 용융솔더를 이용하여 제작하고 있다. 이는 SMT Reflow공정에서 BGA Ball의 퍼짐현상으로 인해 원래의 Ball Height에 영향을 미쳐 접합불량의 원인이 되고 있다. 이러한 문제를 해결하기 위해 Copper Core Ball위에 SnAgCu 삼원합금도금공정을 이용해 문제점을 해결하고자 했으며, 본 실험을 통해 구현한 CCSB를 이용해 SMT Reflow를 진행한 결과 종래의 BGA Ball보다 우수한 효과를 확인할 수 있었다.

• Bulletin of the Korean Chemical Society
• /
• v.29 no.3
• /
• pp.562-566
• /
• 2008

Reaction of AgNO3 with triethanolaminetriisonicotinate (L) produces 1 D coordination polymer of [Ag3(L)2](NO3)3 and the same treatment of Cu(NO3)2 with L gives 1D coordination polymer of [Cu(L)2](NO3)2. The nonrigid triethanolaminetriisonicotinate acts as a m 3-bridged tridentate for [Ag3(L)2](NO3)3 and a m 2-bridged bidentate for [Cu(L)2](NO3)2 to produce unusual motifs. The NO3- anions can be smoothly exchanged by PF6- anions in an aqueous suspension without destruction of the skeletal structure.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 2006.09b
• /
• pp.1076-1077
• /
• 2006

Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

• Journal of the Korean institute of surface engineering
• /
• v.35 no.1
• /
• pp.47-52
• /
• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.2
• /
• pp.73-76
• /
• 2021

This thesis described the optical and electrical properties of the alternating current powder electroluminescent device based on Ag nanowire as a transparent electrode. The Ag nanowire electrode showed the morphology of 20 nm in diameter and 15 ㎛ in length. The transparent electroluminescent devices that were fabricated using the nanomilled ZnS : Cu, Mn phosphor by bar-coating process showed the transmittance of 67%. In order to improve the luminous efficiency, it is necessary to apply the transparent dielectric layer and increase the amount of the nanophosphor while maintaining the transmittance.

• Advances in materials Research
• /
• v.13 no.2
• /
• pp.141-151
• /
• 2024

The aim of this work was to determine the behavior of alloy elements and compounds formed during solidification in the manufacturing process of the CuAgZrCr alloy under an oxidizing environment. Bulk and surface analysis techniques, such as Scanning Electron Microscopy (SEM), X-ray Photoelectron Spectroscopy (XPS), Raman and X-ray diffraction (XRD) were used to characterize the phases obtained in the solidification process. In order to focus the analysis on the on grain boundary interface, partial removal of the matrix phase by acid attack was performed. The compositional differences obtained by SEM-EDX, Raman and XPS on post-manufacturing materials allowed us to conclude that the composition of grain boundaries of the alloy is directly influenced by the oxidizing environment of alloy manufacturing.

• Journal of the Korean Ceramic Society
• /
• v.40 no.5
• /
• pp.447-454
• /
• 2003

Samples were prepared by the solid-state reaction method. The nominal composition of the samples was B $i_{1.84}$P $b_{0.34}$S $r_{1.91}$C $a_{2.03}$C $u_{3.06}$ $O_{10+{delta}$ prepared from powder of B $i_2$ $O_3$, PbO, SrC $O_3$, CaC $O_3$, and CuO. They were pulverized, mixed with AgO, A $u_2$ $O_3$and MgO of 50 wt%. Finally, they were sintered at 820 to 85$0^{\circ}C$ in air. The structural characteristics, the microstructure of surface and the critical temperature with respect to the each samples were analyzed by XRD, $T_{c}$, SEM and EDS respectively. It was found that the the critical temperature of the silver oxide additive samples (99.58 K) is higher than those of gold or magnesium oxides additive samples, but all those values are lower than that of pure Bi-2223 phase. The microstructure of surface showed the tendency which the AgO additive samples become more minuteness than A $u_2$ $O_3$ and MgO additive samples.s.samples.s.