• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.51-56
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• 2014

After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.8-10
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• 2010

We report the enhancement of hole injection using thermally evaporated $CuO_x$ layer between Ag anode and 4,4'-Bis[N-(1-naphthyl)-N-phenylamino]biphenyl ($\alpha$-NPD) in top-emitting organic light-emitting diode (TEOLED). The operation voltage at the current density of $1mA/cm^2$ of TEOLEDs decreased from 6.2 V to 5.0 V as the $CuO_x$ layer inserted between Ag and $\alpha$-NPD. $\alpha$-NPD was deposited in situ on Ag/$CuO_x$ and Ag anodes, and their interface dipole energies were quantitatively determined using synchrotron radiation photoemission spectroscopy. The dipole energy of Ag/$CuO_x$ was lower by 0.05 eV even though Ag/$CuO_x$ had a higher work function. The work function of Ag/$CuO_x$ is higher by 0.53 eV than that of Ag, resulting in a decrease of the turn-on voltage via reduction of hole injection barrier.

• Journal of the Korean Ceramic Society
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• v.33 no.12
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• pp.1421-1425
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• 1996

Sintered Si3N4 and Inconel composed of Ni(58-63%) Cr(21-25%) Al(1-17%) Mn(<1%) fe(balance) were pressurelessly joined by using Ag-Cu-Ti brazing filler metal at 950℃ and 1200℃ under N2 gas atmosphere of 1atm and their interfacial structures were investigated. In case that the reaction temperature was low as 950℃ its interfacial structure was "Inconel metal/Ti-rich phase layer/brazing filler metal layer/Si3N4 " Ti used as reactive metal existed in between inconel steel and brazing metal and moved to the interface of between brazing filler metal nd Si3N4 according as reaction temperature increased up to 1200℃. The interfacial structure of inconel steel-Si3N4 reacted at 1200℃ was ' inconel metal/Ni-rich phase layer containing of Fe. Cr and Si/Cu-rich phase layer containing of Mn and Si/Si3N4 " Cr Mn, Ni and Fe diffused to the interface of between brazing filler metal and Si3N4 and reacted with Si3N4 The most reactive components of ingredients of inconel metal were Cr and Mn. On the other hand Ti added as reactive components to Ag-Cu eutectic segregated into Ni-rich phase layer,.

• Journal of the Mineralogical Society of Korea
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• v.6 no.2
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• pp.94-104
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• 1993

The compositional variation of electrums from gold-silver and antimony deposits in the Dunjeon Baegjeon mining area, range from 22.6 to 69.5 atom% of Ag. Ag contents in electrums vary with paragenetic sequences and associated minerals. Ag contents increase from core to margin in a single grain. Compositional range of electrums from the North ore deposits of the Dunjeon gold mine are from 22.6 to 29.5 atom% of Ag. Electrums contain Cu(0.40 to 0.55 atom%) and Bi(0.35 to 0.67 atom%). Composition of electrums from the South ore deposits of the Dunjeon gold mine vasies from 33.6 to 69.5 atom% of Ag. Cu and As contents in electrums range from 0.20 to 1.92 and from 0.70 to 1.90 atom%, respectively. As the content of Ag in electrums increase, the contents of Bi and As in electrums increase but that of Cu decrease. Electrums of the Baegjeon gold deposits contain 35.6 to 63.5 atom% of Ag, suggesting that Au contents in electrums associated with base metal sulfied be higher than those associate with Ag-minerals. Ag/Au rations in electrums increase with decreasing temperature, salinity and $fs_2$ of the mineralizing solution.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.57-63
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• 2015

In order to prepare a low-cost conductive filler material possessing improved anti-oxidation property, Ag-coated Cu flakes were fabricated and the effects of an applying method of ammonium-based pretreatment solution on the Cu flakes were analyzed. The pretreatment solution was used to remove the surface oxide layer on Cu flake. During a single-stage pretreatment process, hole-shaped defects were formed on the flake surface during the pretreatment after 2 min, and the number and size increased in proportion to the pretreatment time. In the case that Ag plating solution was injected in the pretreatment solution after the pretreatment for 2 min, the defects were also formed during Ag plating. In contrast, the defects tremendous decreased in the case that the pretreatment solution was removed after the first pretreatment for 2 min and the Ag plating proceeded after the second pretratment using a low concentration pretreatment solution. As the final result, the 15 wt% Ag-coated Cu flake sample which was fabricated using the single-stage pretreatment oxidized at $166^{\circ}C$, but the sample fabricated by the double-stage pretreatment oxidized at $224^{\circ}C$, indicating definitely improved anti-oxidation property.

• Economic and Environmental Geology
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• v.26 no.2
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• pp.117-127
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• 1993

Ag-Au vein ores from the Weolyu mine, Youngdong district, contain significant germanium (up to 145g/t, average 34.9g/t), in the form of argyrodite ($Ag_8GeS_6$). Mineral chemistries of argyrodite and its associated minerals were determined by electron probe microanalysis. Twenty eight elements in thirteen ore samples were analyzed using an ICP mass spectrometer. Argyrodite occurs in the paragenetically later mineral assemblage consisting of carbonates+quartz+native silver+argentite+Ag-sulfosalts, indicating that the germanium mineralization represents the culmination of a complex mineral sequence which includes early gold and late silver deposition. The mean formula of the argyrodite is $Ag_{7.90}\;(Ge_{0.76}Sn_{0.04})S_6$, with minor amounts of Cu, Fe, Sb, As, Sn, and Zn. The Weolyu argyrodite shows systematic substitutions of Ag by Cu, and of Ge by Sb. Chemical analyses of vein ores indicate that metals were precipitated in the order of $Fe{\rightarrow}Pb$, $Zn{\rightarrow}Cu{\rightarrow}Ag$, Sb, As, Ge. Germanium has a strong geochemical affmity with As and Sb, and Cu, Pb, Zn, Mo, and Sr show weak positive correlations with Ge. Germanium deposition at Weolyu was mainly a result of cooling of hydrothermal fluids (down to $175^{\circ}C{\sim}210^{\circ}C$, due to increasing involvement of cooler meteoric waters in the epithermal system.

• Proceedings of the KWS Conference
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• 2004.05a
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• pp.45-47
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• 2004

We have investigated the microstructures and the mechanical properties of TiA1/Cerameti1721 (Ag-Cu-Ti insert metal)/AISI4140 joints at 800$^{\circ}C$ for 60 to 300s using induction brazing method. Two continuous reaction layers of AICuTi and AICu$_2$Ti were formed at the interface between the braze and TiAl, whose thickness increased with the brazing time. The braze consisted of Ag-rich, Ti-rich, CuTi and CuTi$_2$ phases. The maximum tensile strength achieved 296MPa, which was 71% of that of TiAl base metal, for the specimen bonded at 800$^{\circ}C$. Further increase of the brazing temperature and time resulted in constant deterioration of its bonding strength due to large amount of brittle IMC.

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.445-449
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• 2008

Micrometer-sized copper (mCu) powders are weakly surface-enhanced Raman scattering (SERS) active by the excitation at 632.8 nm, but nearly ineffective as a SERS substrate at 514.5 nm excitation. The SERS activity of mCu powders at both excitation wavelengths can be increased dramatically by a simple method of the galvanic exchange reaction with AgNO3 in aqueous medium. In this work, the SERS activity of the Ag-exchanged Cu powders (mCu@Ag) has been evaluated by taking a series of Raman spectra using benzenethiol (BT) as the probe molecule. It is clearly confirmed by field emission scanning electron microscopy and X-ray diffractometry that the SERS activity of mCu@Ag powders is, in fact, highly dependent on the extent of galvanic reaction.

• Bulletin of the Korean Chemical Society
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• v.15 no.1
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• pp.20-22
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• 1994

The preparation of $YBa_2Cu_4O_8$ thick film on Ag substrate by electrophoretic deposition was directly studied. Electrophoretic deposition was carried out in solution, which was composed of presintered $YBa_2Cu_4O_8$ powder, sodium, and 2-propanol as a solvent. The deposited thick films were heat-treated in $O_2$ at 815$^{\circ}$C for 12 hours and at 450$^{\circ}$C for 12 hours. We succeeded in obtaining superconducting $YBa_2Cu_4O_8$ films on Ag substrate. Even though the chemical reactions at the $YBa_2Cu_4O_8$/Ag interface occurred in the range of 10 ${\mu}$m, superconductivity was not depressed. The thickness of the films was in the range of 60-80 ${\mu}$ m. The characteristics of the films were examined by electric resistance measurements, X-ray diffraction, and SEM observations.

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.259-262
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• 1999