• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.303-303
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• 2010

국제적으로 에너지 고갈에 대한 문제점과 환경적은 측면에서 대체 에너지 개발에 대한 관심이 뜨거워 지고 있는 지금 그중에서 에너지 하베스팅에 대한 연구가 활발히 이루어지고 있다 에너지 하베스팅 이란 "자연에서 버려지는 에너지를 수확하여 저장하는 기술" 이며 에너지 하베스팅 방법으로는 태양광을 이용한 태양광발전, 기계적인 운동과 전자기적 현상을 이용한 발전 등이 있다. 태양광발전 같은 경우에 흐린날 이나 실내에서는 사용 할 수 없는 반면 날씨와 관계없는 진동의 기계적 에너지를 전기적 에너지로 변환 할 수 있는 압전 세라믹스를 이용한 에너지 하베스팅의 연구가 이루어 지고 있다. 에너지 하베스팅을 하기 위한 여러 가지 type의 소자가 있지만, 본 논문에서는 무연 압전 세라믹스를 이용한 cantilever type의 실험을 진행하였으며 에너지 하베스팅 시스템에서 핵심이 되는 것은 압전 세라믹스의 성능이므로 비교적 높은 $d_{33}$ 와 $g_{33}$를 가진 소자를 선정하였다. 압전 세라믹스를 이용한 에너지 하베스팅의 장점으로 소형 경량으로 이용할 수 있는 범의가 넓으며 진동 또는 충격을 효과적인 방법으로 에너지로 변환할수 있다. 실험 과정으로 KNNS에 CuO를 첨가하여 1차 밀링후 $Ag_2O$를 첨가하여 2차밀링 하여 $900^{\circ}C$ 하소 cantilever type으로 성형 후 $1080^{\circ}C$ 소성을 하여 세라믹스를 제작하여 그에대한 발전 특성을 조사하였다.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.9-17
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• 1998

BiNbO$_{4}$ ceramics with 0.07wt% V$_{2}$O$_{5}$ and 0.03wt% CuO (BNC3V7) sintered at 900 .deg. C where it is possible for these to be co-fired with ag electronde. Dielectric constant of 44.3 TCF (Thermal Coefficient of resonance Frequency) of 2 ppm/.deg. C and Qxf value 22,000 GHz can be obtained from BNC3V7. the laminatedchip LC filter is indispensible to the minimaturization of PCS (Personal Communication System) terminals. Therefore, multilayer type BPF has been fabricated by screen-printing with silver electrode after tape casting. The simulated characteristics of the fabricated filters sintered at 900.deg. C werecomparedwith the designed ones. for Band Pass Filter widths was similar that ofdesigned ones. For Low Pass Filter (LPF), insertion loss value of band pass widths (2.4 dB) which is a few higher than that of designed (1dB), but characteristization of band pass widths was similar that of designed ones.s.of designed ones.s.

• ETRI Journal
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• v.13 no.2
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• pp.42-53
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• 1991

고유전율 적충세라믹 커패시터 소재인 $BaTiO_3$ 자기물은 일반적으로 큐리오도인 약 $120^{\circ}C$부근에서 유전율이 최고 약 10,000정도로 증가한 다음 급격히 감소하므로 적절한 이동체를 첨가하여 큐리온도를 상온으로 이동시켜 상온에서 최대 유전율을 이용하여야 한다. 그리고$BaTiO_3$ 자기물은 $1300^{\circ}C$이상의 고온소결시 고가인 Pd전극이 요구된다. 그러나 자기물의 소결온도를 저온화화면 저가의 Ag합금으로 전극재료를 대체할 수 있다. 본 연구에서는 이동제로서 $CaSnO_3$ 를 이용하여 큐리온도를 상온으로 이동시켰다. 또한 소결온도를 저온화하기 위하여 $BaTiO_3$ 세라믹에 여러가지 산화물을 첨가하여 소결현상을 살펴보았다. 실험결과 첨가제를 넣지 않은 경우 소결온도는 $1350^{\circ}C$의 고온이 필요한 반면, $CuO,B_2O_3$는 $1050^{\circ}C$의 낮은 온도에서도 치밀화와 입도성장이 잘 일어났다. 특히 $B_2$$O_3$ 를 첨가한 경우는 $1250^{\circ}C$이상에서 소결할 때 절연저항이 낮아 유전손실이 큰 문제점을 보였지만, 최대 유전율이 11,000 정도로 높고, 양호한 유전율의 온도변화 특성을 나타내어 우수한 고유전율 소재의 첨가제로 응용될 가능성을 보였다

• Economic and Environmental Geology
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• v.30 no.2
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• pp.123-135
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• 1997

In order to investigate the dispersion patterns and contamination level of heavy metals in the soil-ecosystem and to evaluate the efficiency of soil remediation by reversed soil method, soils and plants were collected from the Dongjin Au-Ag-Cu mine area and analysed for heavy metals. The dispersion patterns of heavy metals in soils and plants show that heavy metal pollutions caused by waste rump around Dongjin mine are mainly found in the vicinity of the waste rump and in the southward slanting of mine. Toxic metallic pollutants from the mine influence heavy metal contents in paddy soils in downstream area, and may be a potential sources of heavy metal pollution on crop plants. Soil samples collected from the remediated rice farming field by reversed method show similar levels of heavy metal content to those from the polluted rice farming field, but topsoil enrichment of heavy metals are not found. Heavy metal contents of the rice plants collected from remediated rice farming field are significantly lower than those from polluted rice farming field, and it suggests that the reversed soil method is effective for the reduction of bioavailability of heavy metals.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.77-77
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• 2010

본 연구에서는 Sn-3.0Ag-0.5Cu (SAC305) 무연솔더의 최적 인쇄성을 위한 PCB 및 마스크설계, 스크린프린팅 공정변수의 최적값을 실험계획법을 통해 평가하였다. 사용된 칩은 가로 0.4mm 세로 0.2mm의 0402 MLCC칩이며, 사용된 시험보드는 OSP 표면처리된 PCB이었다. 인쇄성을 판단하기 위한 공정인자는 금속마스크 두께, 마스크홀 크기, 패드크기 및 모양, 인쇄각도, 인쇄속도, 판분리속도이었다. ANOVA분석을 통해 주인자를 파악하였으며, 인쇄성에 영향을 미치는 주인자는 마스크두께와 인쇄각도임이 확인되었다. 그 후 중심 합성법을 이용하여 인쇄성 최적 조건을 확인하였다. 결과로 나타난 등고선/표면도를 통해, 마스크두께가 작을 때에는 인쇄각도가 작아야 높은 인쇄성을 갖으며, 또한 마스크 두께가 클 경우에는 인쇄각도가 커야 높은 인쇄성을 가짐을 알 수 있었다. 추가실험을 통해서 인쇄성 표면도의 정확도를 확인하였으며, 실험값은 표면도에서 표시된 인쇄성값과 비슷함을 알 수 있었다. 또한, 인쇄성이 낮은 영역과 높은 영역에서 접합강도값을 측정하였으며, 인쇄성이 좋은 영역에서 접합강도도 높음을 알 수 있었다.

• Journal of Welding and Joining
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• v.27 no.1
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.74-80
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• 2014

Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Journal of the Korean Ceramic Society
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• v.56 no.4
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• pp.394-398
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• 2019

In this paper, the joining characteristics of GDC-LSM ceramics with Crofer 22 APU metal alloys was investigated at different brazing temperatures and holding times by reactive air brazing. Brazing was performed using Ag-10 wt% CuO filler, at three different temperatures (1000, 1050, and 1100℃ for 30 minutes) as well as for three different holding times (10, 30, and 60 minutes at 1050℃). The interfacial microstructures were examined by scanning electron microscopy and the joining strengths were assessed by measuring shear strengths at room temperature. The results show that with increasing brazing temperature and holding time, joint microstructure changed obviously and shear strength was decreased. Shear strength varied from a maximum of 100±6 MPa to a minimum of 18±5 MPa, depending on the brazing conditions. These changes were attributed to an increase in the thickness of the oxide layer at the filler/metal alloy interface.

• Asian-Australasian Journal of Animal Sciences
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• v.25 no.6
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• pp.852-860
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• 2012

An Antarctic bacterial isolate displaying extracellular ${\alpha}$-galactosidic activity was named Paenibacillus sp. LX-20 based on 16S rRNA gene sequence analysis. Optimal activity for the LX-20 ${\alpha}$-galactosidase occurred at pH 6.0-6.5 and $45^{\circ}C$. The enzyme immobilized on the smart polymer Eudragit L-100 retained 70% of its original activity after incubation for 30 min at $50^{\circ}C$, while the free enzyme retained 58% of activity. The enzyme had relatively high specificity for ${\alpha}$-D-galactosides such as p-nitrophenyl-${\alpha}$-galactopyranoside, melibiose, raffinose and stachyose, and was resistant to some proteases such as trypsin, pancreatin and pronase. Enzyme activity was almost completely inhibited by $Ag^+$, $Hg^{2+}$, $Cu^{2+}$, and sodium dodecyl sulfate, but activity was not affected by ${\beta}$-mercaptoethanol or EDTA. LX-20 ${\alpha}$-galactosidase may be potentially useful as an additive for soybean processing in the feed industry.