• Title/Summary/Keyword: Cu6Sn5

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Studies on the Enzymatical Properties of Streptomyces sp. S-45 Isolated from Soil (토양(土壤)에서 분리(分離)한 Streptomyces sp. s-45의 효소학적(酵素學的) 성질(性質)에 관한 연구(硏究))

  • Kim, Yeong-Yil;Kim, Yong-Woong;Kim, Kwang-Sik
    • Korean Journal of Soil Science and Fertilizer
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    • v.21 no.2
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    • pp.129-134
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    • 1988
  • Enzymatical properties of Streptomyces sp. S-45 producing chitinase and ${\beta}$-1.3-glucanase isolated from soil were investigated. Chitinase activity was 3.01(U/ml) and ${\beta}$-1.3-glucanase activity was 2.49(U/ml). The optimum medium for mycolytic enzyme production of strain was composed of 0.7% colloidal chitin, 0.3% glucose, 0.5% asparagine, 0.2% peptone, 0.01% NaCl, 0.01% $K_2HPO_4$ and 0.01% $MgSO_4{\cdot}7H_2O$ in intial pH 7.0. The optimal condition for mycolytic enzyme activities were: pH 6.5-7.0, $45-50^{\circ}C$. Enzyme activities were activated by metal ion as $10^{-2}M\;Co^{{+}{+}}$, $Cu^{{+}{+}}$, $Mn^{{+}{+}}$, $Al^{{+}{+}{+}}$ and $10^{-3}M\;Sn^{{+}{+}}$ but $Ag^{{+}{+}}$, $Hg^{{+}{+}}$ inhibited.

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The Study on Natural Dyeability of Aloe Vera Extract (알로에 베라 추출물의 천연염색성에 관한 연구)

  • 박영득;김정화
    • Journal of the Korea Fashion and Costume Design Association
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    • v.4 no.1
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    • pp.73-84
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    • 2002
  • The purpose of this study was to investigate the natural dyeability on extract of Aloe Vera princeps. The experimental items were divided into the mordanting method, component of fabric, extracting portion, and kind of mordants. The experimental study was done to by laundering, abrasion(dry/wet), perspiration(acid/alkali), light fastness test and color difference by C.C.M system. The summerized finding resulted from experiments and investigation are suggested as follows: First, in the C.C.M test on mordanting method, color difference was significantly improved when mordants were treatmented. And the premordanting method showed the highest color difference. Second, in the C.C.M test on component of fabric, color difference of silk was higher than cotton. It was considered that silk has -$\NH_2$, -COOH, -OH more than cotton. Third, in the C.C.M Test on extracting portion, color difference of extracting in skin of Aloe leaf was three times higher than that of inside lump. Forth, in dyeing-fastness on mordants, laundering fastness showed 3 ~ 4 grade nearly. In perspiration-fastness(acid/alkali), Al(4~5/4~5) was the highest. In abrasion-fastness(dry/wet), cotton(4~5/4~5) was higher than silk (4~5/4) in all mordants. In light-fastness, silk(2~5) was higher than cotton(1~2) generally and especially Cu mordant of silk(4~5) was the highest. Sixth, in color difference analysis on 7 mordants Cu(29.9), Fe(28.7) and Cr(28.9) showed the highest in silk. And Cu(12.7), Fe(10.42) and Sn(10.43) showed the highest in cotton and Al(23.6, 8.0) showed the lowest in silk and cotton.

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Effect of the Dye Bath and Mordants on the Dyeing of Silk Fabric using Cochineal (견섬유의 코치닐 염색에서 염욕의 액성의 매염제가 미치는 영향)

  • Kim Kyung-Sun;Jeon Dong-Won;Kim Jong-Jun
    • Journal of the Korean Home Economics Association
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    • v.43 no.7 s.209
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    • pp.109-116
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    • 2005
  • Using buffer solutions, consisting of pH 4, 5, 6, 7, and 8, silk fiber fabric specimens, pre-mordanted with one of the mordanting agents, Sn, Al, Cu, Cr, and Fe, were dyed using cochineal dyestuff. The color of the dyed silk fabric specimens was predominantly red(R) for the acidic range of pH 4 and 5, and predominantly purple(RP) for the neutral range of pH 6,7, with 8, with the pH boundary differentiating between the shades being between pH 5 and 6. As a general trend, the chroma value decreased as the pH changed from acid to alkali, and the highest chroma value us attained between pH 4 and 5. Regardless of the mordanting conditions, the trend was that $ {\Delta}E$ showed the highest measured value in the acidic range of pH 4 and 5, and it dropped abruptly after the pH 6.

Direct Conversion for the Production of 5-HMF from Cellulose over Immobilized Acidic Ionic Liquid Catalyst with Metal Chloride (고정화 산성 이온성 액체 촉매와 금속염화물 촉매를 이용한 셀룰로우스의 5-HMF로의 직접 전환 연구)

  • Park, Yong Beom;Choi, Jae Hyung;Lim, Han-Kwon;Woo, Hee-Chul
    • Clean Technology
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    • v.20 no.2
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    • pp.108-115
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    • 2014
  • Various metal chlorides and acid catalysts in ionic liquid solvent were investigated to directly convert cellulose into 5-hydroxymethylfurfural (5-HMF). Metal chlorides containing Sn(II), Zn(II), Al(III), Fe(III), Cu(II), and Cr(III) were used and acidic ionic liquid immobilized on silica gel as an acid catalyst and commercial acid catalysts (sulfuric acid, chloric acid, Amberlyst-15,DOWEX50x8) were used for comparison studies. The acid strength and amount of acid catalysts were probed with Hammett indicator. The selectivity and yield of 5-HMF were determined with reaction temperature, reaction time and catalyst ratio. A catalyst containing $CrCl_3-6H_2O$ and $SiO_2-[ASBI]HSO_4$ showed the highest selectivity and it was found that this catalyst had higher activity than commercial solid acid catalysts such as Amberlyst-15 and DOWEX50x8. The selectivity of 5-HMF appeared to be mainly dependent on the acid strength and catalyst ratio, it was found that levulinic acid was produced from 5-HMF by rehydration.

An Analysis on the Thermal Shock Characteristics of Pb-free Solder Joints and UBM in Flip Chip Packages (플립칩 패키지에서 무연 솔더 조인트 및 UBM의 열충격 특성 해석)

  • Shin, Ki-Hoon;Kim, Hyoung-Tae;Jang, Dong-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.134-139
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    • 2007
  • This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

Geochemical Characteristics and Trace Metal Speciation of Soils in Major Source Area of Asian Dust (주요 황사발원지 토양의 지구화학적 특성 및 미량원소 존재형태 연구)

  • Lee, Pyeong-Koo;Youm, Seung-Jun;An, Gi-O
    • Economic and Environmental Geology
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    • v.45 no.1
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    • pp.9-21
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    • 2012
  • In this study, we investigated the chemical characteristics of soils collected from the several deserts and loess in China known as the typical source areas of Asian dust (the Taklamakan desert, the Alashan desert, the Ordos desert and the Loess Plateau). Based on our analysis, we examined the possibility of adverse effects on environments and human health. In each desert and loess, major elemental compositions of soils did not show large variations, implying that the long-periodic mixing of soils in each area made their chemical compositions homogeneous. Minor elements of soils in each desert and loess showed more complicated patterns with strong correlations each other (e.g., Cr, Cu, As, Co, Ni, V, Y, Sc, Sn, Pb, Zn, Cd, Cs, Li, Th, U). These results thus enable us to discriminate the soil of the Loess Plateau from those of the other deserts in China. The results of sequential extraction experiments for soils showed that the chemical speciation of Fe was dominant in residual fraction (>85%) in all deserts and loess, but the fractions of Mn and Ca chemical speciations were very different in each area. In the case of Mn, the fraction of amorphous Fe-Mn hydroxides (55.4%) in the Central Loess Plateau and the carbonate fraction (33.8%) in Taklamakan desert were higher as much as 2 to 5 times than other deserts. The chemical speciations of Ca are dominant in carbonate fraction in Taklamakan (75.9%) and Alashan (50.5%) deserts, but carbonate fractions of Ca in the Loess Plateau and Ordos deserts were low (6.6% and 2.1%, respectively). According to the mobility of trace elements inferred from the results of sequential extraction procedure, we could classify them into five groups, and the mobility of Cd, Pb and Cu are more than 87%, 33% and 30%, respectively. Therefore, Cd, Pb and Cu in soils of deserts and loess could be easily dissolved when interacted with surface water. As such, they could give adverse effects on surficial environments and human health.

Dyeing Properties and Ultraviolet-cut Ability of Silk and Nylon Fabrics Dyed with Rhus verniciflua Extracts (옻나무 추출액에 의한 견직물, 나일론 직물의 염색성과 자외선 차단성)

  • Choi, In-Ryu
    • The Research Journal of the Costume Culture
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    • v.16 no.1
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    • pp.158-165
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    • 2008
  • The purpose of this study was to investigate the dyeing property and ultraviolet-cut ability on silk 100% and nylon 100% fabrics dyed with Rhus verniciflua extracts. This study was investigated K/S values, surface color, washing fastness, dry cleaning fastness and ultraviolet-cut ability of the silk and nylon fabrics dyed with Rhus verniciflua extracts under the various dyeing conditions. As mordanting were used Tin(II) Chloride dihydrate $(SnCl_2{\cdot}2H_2O)$, Copper(II) sulfate pentahydrate$(CuSO_5{\cdot}5H_2O)$, Iron(II)Chloride$(FeC_2{\cdot}4H_2O)$. pH was adjusted by sodium carbonate$(Na_2CO_3)$ and formic acid(HCOOH). The optimum dyeing temperature, dyeing time, and pH of the silk fabrics dyed with Rhus verniciflua extracts were $90^{\circ}C$, 100min, and in the nylon fabrics were $90^{\circ}C$, 45min. It were colored(munsell value) 6.4Y 7.5/4.1 in the silk fabrics and colored 4.3Y 6.6/5.9 in the nylon fabrics dyed with Rhus verniciflua extracts. Washing fastness and dry-cleaning fastness in the silk and nylon fabrics dyed with mordanting agent improved in $4{\sim}5$ grade. UV-A test showed that nylon fabrics a high rate of 92% with Rhus verniciflua extracts.

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Migration Mechanism of Hazard Elements from Brass Kitchenwares (황동제 주방기구에서 유해중금속의 용출기작에 관한연구)

  • Lee, Kwang-Ho;Kwon, Ki-Sung;Jeon, Dae-Hoon;Choi, Byung-Hee;Kim, Sung-Wook;Lee, Sun-Hee;Lee, Chul-Won
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.5 no.2
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    • pp.24-30
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    • 1999
  • The migration mechanism of trace elements, Pb, Cd, Cu, Zn and Sn from brass food-contact utensiles was investigated. The migration of metals from brass was affected by the migration temperature (30, 60, 80 and $95^{\circ}C$), the simulant pH (2.5, 4.3, 6.0 and 7.0) and the migration time (30, 90, 180 and 360 min.). The amount of Pb migration was maximum at $95^{\circ}C$ with pH 2.5. This study indicated that the equilibrium of Pb migration was reached at 180 minutes. The mechanism of Pb migration was investigated with Scanning Electron Microscope (SEM) and Electron Probe Micro Analyzer (EPMA). To correlate the relations between the migration and the content of Pb in brass samples, ten brass samples having known content of Pb (the quantities of Pb in brass ; 0, 0.02, 0.09, 0.1, 0.2, 0.5, 0.9, 1.4, 5.4 and 9.2% (w/w)) were tested in the following conditions, 4% acetic acid, $95^{\circ}C$ and 30 minutes. The result represented that content of Pb in brass samples must be below 0.2% (w/w) to satisfy the 1.0 ppm (as Pb) of Korea Food Code.

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Flip-Chip Package of Silicon Pressure Sensor Using Lead-Free Solder (무연솔더를 이용한 실리콘 압력센서의 플립칩 패키지)

  • Cho, Chan-Seob
    • Journal of the Korean Society of Industry Convergence
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    • v.12 no.4
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    • pp.215-219
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    • 2009
  • A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

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An experimental study of the strength and internal structure of solder joint of fixed partial denture (가공의치(架工義齒) 납착부(蠟着部)의 강도(强度)와 내부구조(內部構造)에 관(關)한 실험적(實驗的) 연구(硏究))

  • Park, Sang-Nam;Kay, Kee-Sung
    • The Journal of Korean Academy of Prosthodontics
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    • v.23 no.1
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    • pp.39-59
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    • 1985
  • The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.

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