• Transactions of Materials Processing
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• v.28 no.6
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• pp.354-360
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• 2019

The plastic strain ratio is one of the factors that affect the deep drawability of metal sheets. The plastic strain ratio of fully annealed Cu sheet is low because its texture has {001}<100>. In order to improve the deep drawability of Cu sheet, it is necessary to increase the plastic strain ratio of Cu sheet. This study investigate the increase of plastic strain ratio of a Cu sheet after the first asymmetry rolling and annealing, and the second asymmetry rolling and annealing in air and Ar gas conditions. The average plastic strain ratio (R_m) was 0.951 and |ΔR| value was 1.27 in the initial Cu sheet. After the second 30.1% asymmetric rolling and annealing of Cu sheet at 1000℃ in air condition, the average plastic strain ratio (R_m) was 1.03 times higher. However, |ΔR| was 0.12 times lower than that of the initial specimen. After the second 18.8% asymmetric rolling and annealing of Cu sheet at 630℃ in Ar gas condition, the average plastic strain ratio (R_m) was 1.68 times higher and |ΔR| was 0.82 times lower than that of the initial specimen. These results are attributed to the change of the texture of Cu sheet due to the different annealing conditions.

• Design & Manufacturing
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• v.6 no.1
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• pp.95-100
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• 2012

In this study, a novel Cu composite sheet with embedded high electric conduction path was developed as another alternative for the interconnect materials possessing high electrical conductivity as well as high strength. The Cu composite sheet was fabricated by forming Ag conduction paths not within the interior but on the surface of a high strength Cu substrate by damascene electroplating process. As a result, the electrical conductivity increased by 40% thanks to mesh type Ag conduction paths, while the ultimate tensile strength decreased by 20%. The interfacial fracture resistance of Cu composite sheet prepared by damascene electroplating increased by above 50 times compared to Cu composite sheet by conventional electroplating. For feasibility test for practical application, a leadframe for LED module was manufactured by a progressive blanking and piercing processes, and the blanked surface profile was evaluated as a function of the volume fraction of Ag conduction paths. As Ag conduction path became finer, pressing formability improved.

• Transactions of Materials Processing
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• v.29 no.2
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• pp.69-75
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• 2020

The plastic strain ratio is one of the factors that affect the deep drawability of metal sheets. The plastic strain ratio of fully annealed Cu sheet is low, due to its texture being {001}<100>. In this study, in order to increase the plastic strain ratio of Cu sheets we investigated the effect of two treatments: 1^st the sheet was asymmetrically rolled and annealed, and 2^nd the sheet was symmetrically and asymmetrically rolled and subsequently annealed. The average plastic strain ratio (R_m) of the initial Cu sheet was 0.95 and |Δr| was 1.27. After the 2^nd treatment of 5.3% symmetric rolling and annealing of Cu sheet at 1000℃ for 60 min in Ar gas condition, the R_m was 2.29 times higher and the |Δr| was 1.44 times higher than that of initial Cu sheet specimen. After the 2^nd treatment of 8.2% asymmetric rolling and annealing of Cu sheet at 1000℃ for 60 min in Ar gas conditions, the R_m was 2.51 times higher and |Δr| was 0.53 times lower than that of the initial Cu sheet specimen. These results can be attributed to the change in texture of the Cu sheets due to the differences in the two methods of rolling.

• Journal of Magnetics
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• v.16 no.1
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• pp.31-35
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• 2011

A silica aerogel sheet with a very low thermal conductivity is used to suppress the temperature increase of the Cu coil in an induction cooker by reducing the heat flow from the heat source (cooking pot). It is found that the temperature of the Cu coil is reduced significantly by the insertion of an insulation sheet between the heat source and the Cu coil, demonstrating the effectiveness of the insulation sheet in the suppression of the heat flow between the cooking pot and the coil. Furthermore, the temperature of the cooking pot increases more rapidly with the use of the insulation sheet, allowing for an increased efficiency of the induction cooker.

• Journal of Sensor Science and Technology
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• v.21 no.1
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Transactions on Electrical and Electronic Materials
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• v.10 no.5
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• pp.165-168
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• 2009

Transparent and conducting ITO/Cu/ITO multilayered films were deposited by magnetron sputtering on unheated polycarbonate (PC) substrates. The thickness of the Cu intermediate film was varied from 5 to 20 nm. Changes in the microstructure and optoelectrical properties of ITO/Cu/ITO films were investigated with respect to the thickness of the Cu intermediated layer. The optoelectrical properties of the films were significantly influenced by the thickness of the Cu interlayer. The sandwich structure of ITO 50 nm/Cu 5 nm/ITO 45 nm films had a sheet resistance of $36{\Omega}$/Sq. and an optical transmittance of 67% (contain substrate) at a wavelength of 550 nm, while the ITO 50 nm/Cu 20 nm/ITO 30 nm films had a sheet resistance of $70{\Omega}$/Sq. and an optical transmittance of 36%. The electrical and optical properties of ITO/Cu/ITO films were determined mainly by the Cu film properties. From the figure of merit, it is concluded that the ITO/Cu/ITO films with a 5 nm Cu interlayer showed the better performance in transparent conducting electrode applications than the conventional ITO films.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.217.2-217.2
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• 2014

We prepared a flexible and transparent CuO/Cu/CuO multilayer electrodes on a polyethylene terephthalate (PET) substrate using a specially designed roll-to-roll sputtering system at room temperature for GFF-type touch screen panels (TSPs). By the continuous roll-to-roll sputtering of the CuO and Cu layer, we fabricated a flexible CuO(150nm)/Cu(150nm)/CuO(150nm) multilayer electrodes with a sheet resistance of $0.289{\Omega}/square$, resistivity of $5.991{\times}10^{-23}{\Omega}-cm$, at the optimized condition without breaking the vacuum. To investigate the feasibility of the CuO/Cu/CuO multilayer as a transparent electrode for GFF-type TSPs, we fabricated simple GFF-type TSPs using the diamond patterned CuO/Cu/CuO electrode on PET substrate as function of mesh line width. Using diamond patterned CuO/Cu/CuO electrode of mesh line $5{\mu}m$ with sheet resistance of 38 Ohm/square, optical transmittance of 90% at 550 nm and an average transmittance of 89% at wavelength range from 380 to 780 nm, we successfully demonstrated GFF-type touch panel screens (TPSs). The successful operation of GFF-type TPSs with CuO/Cu/CuO multilayer electrodes indicates that the CuO/Cu/CuO multilayer is a promising transparent electrode for large-area capacitive-type TPSs due to its low sheet resistance and high transparency.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.