• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.49-55
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• 2011

전자기기에서의 고장 중 대부분은 작동 중 발생하는 열과 충격에 기인한다. 이 열과 충격은 PCB(Printed Board) 부품의 접합부 계면에 균열을 야기 시키고, 이 균열은 금속간 화합물(Intermetallic Compound: IMC)의 형성과 밀접한 관계를 가진다. 본 연구에서는 Sn-Ag-Cu계의 Ag함량을 변화한 Sn-1.0Ag-0.5Cu와 Sn-1.2Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu의 3가지 조성의 솔더로 접합한 소재를 대상으로 1000시간 까지 등온시효(Isothermal Aging) 하였다. 등온시효 동 안 솔더(Solder)의 계면에 발생하는 IMC(Intermetallic Compound) 성장이 관찰되었으며, solder 접합부의 기계적 특성은 굽힘충격 시험법을 이용하여 평가되었다. 그 결과 시효처리 전에는 Ag 함량이 낮은 solder의 굽힘충격 특성이 우수하게 나타났으나, 시효처리 후에는 반대의 결과를 나타내었다. 이 결과는 IMC layer 주변에 생성된 미세한 $Ag_3Sn$ 및 조대한 $Cu_6Sn_5$와 관련되어, 미세한 $Ag_3Sn$이 충격을 완화한 것으로 나타나 이에 따라 굽힘충격 특성에 차이가 나타남을 알 수 있었다.

• 한국자동차공학회논문집
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• 제21권3호
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• pp.134-141
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• 2013

Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

• Journal of Welding and Joining
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• 제13권2호
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• pp.122-131
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• 1995

The effects of cooling rate on the microstructures, precipitation of Cu-cluster, .epsilon.-Cu and impact toughness of high strength low alloy(HSLA) steel were studied using hardness tester, impact tester, DSC(differential scanning calorimetry), AES(auger electron spectroscopy) and TEM(transmission electron microscopy). Not only the Cu-precipitates but also the segregation of Cu, As, Sb, P, S, N, Sn along grain boundary were not observed at the specimens heat treated from 800.deg. C to 300.deg. C with the cooling time of 12-125 sec. The Cu-cluster, .epsilon.-Cu are formed by introducing ageing after cooling and the effect of precipitates on hardening increase after cooling was the same in all cooling rate. The peak hardness was obtained at an ageing of 500.deg. C in all cooling conditions. The impact energy become higher as the cooling time increases. This fact can be explained to be due to the tempering effect applied on the cooling stage since the present alloy has a relatively high Ms temperature and the local high concentration of the retained austenite.

• 한국재료학회지
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• 제6권5호
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• pp.532-539
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• 1996

동과 동을 저온에서 단시간내에 접합시키는 가능성을 검토하기 위해서 직류 자기 스퍼터링을 이용한 코팅한 주석 및 주석-잡 합금층을 중간층으로 사용하였다. 접합은 대기중 200-35$0^{\circ}C$의 온도에서 수행되었고 접합온도에 도달직후 바로 냉각하였다. 접합 계면에는 액상의 주석과 고상의 동간의 반응에 의해 n-상(Cu6Sn5) 및 $\varepsilon$-상(Cu3Sn)으로 구성된 금속간화함물 층이 형성되었다. 전단강도로 측정된 접합강도는 접합온도에 따라 비례적으로 증가하지만 30$0^{\circ}C$ 이상에서 감소하였다. 접합강도는 2.8-6.2MPa 범위로 나타났으며, 중간층합금 성분에 따른 접합계면에서의 금속간화합물의 생성거동과 관련지어 설명되었다. 실험결과 실용적인 접합법으로서 저온 단시간 접합의 가능성이 확인되었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.284-284
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• 2015

반도체 Ball Grid Array(BGA)에 사용되던 종래의 Solder Ball은 Sn96.3 Ag3.0 Cu0.7의 용융솔더를 이용하여 제작하고 있다. 이는 SMT Reflow공정에서 BGA Ball의 퍼짐현상으로 인해 원래의 Ball Height에 영향을 미쳐 접합불량의 원인이 되고 있다. 이러한 문제를 해결하기 위해 Copper Core Ball위에 SnAgCu 삼원합금도금공정을 이용해 문제점을 해결하고자 했으며, 본 실험을 통해 구현한 CCSB를 이용해 SMT Reflow를 진행한 결과 종래의 BGA Ball보다 우수한 효과를 확인할 수 있었다.

• 한국주조공학회지
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• 제22권1호
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• pp.35-41
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• 2002

To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1057-1058
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• 2006

The preparation of $Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders was accomplished by the mechanical alloying of a pure Ti, Cu, Ni, Sn and carbon nanotube (CNT) powder mixture after 8 h milling. In the ball-milled composites, the initial CNT particles were dissolved in the Ti-based alloy glassy matrix. The bulk metallic glass composite was successfully prepared by vacuum hot pressing the as-milled CNT/$Ti_{50}Cu_{28}Ni_{15}Sn_7$ metallic glass composite powders. A significant hardness increase with the CNT additions was observed for the consolidated composite compacts.

• 한국재료학회지
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• 제11권5호
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• pp.405-412
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• 2001

본 연구에서는 $360^{\circ}C$ 물 및 $360^{\circ}C$, 70ppm LiOH 수용액 분위기의 static autoclave를 이용하여 새롭게 개발한 Zr 신합금 (Zr-0.4Nb-0.8Sn-xFeCrMn, Zr-0.2Nb-1.1Sn-xFeCrMn, Zr-1.0Nb-xFeCu) 의 부식 특성을 평가하였다. 합금의 미세구조를 광학현미경과 TEM을 이용하여 관찰하였고, 부식시험 중에 생성된 산화막은 SEM과 XRD를 이용하여 단면 및 결정구조를 조사하였다. 부식시험 결과, 3종의 합금 모두 $360^{\circ}C$ 물 분위기보다 $360^{\circ}C$, 70ppm LiOH 수용액 분위기에서의 부식저항성이 감소하였으며 특히, High Nb 합금의 경우 급격한 가속 부식현상을 나타내었다. 합금원소 첨가량과 관련하여 Nb의 함량을 고용도 이내로 줄이고 Sn을 적절히 첨가한 조성의 합금이 Sn을 첨가하지 않고 고용도 이상의 Nb을 가진 합금보다 우수한 부식저항성을 나타내었다. 또한 최종열처리가 부식에 미치는 영향의 경우에, 완전재결정 조직의 합금이 부분재결정 조직을 가진 합금보다 부식저항성이 감소되었는데 이는 기지조직에서 석출하늘 제 2상의 크기 및 분포에 의한 영향으로 사료된다.

• 열처리공학회지
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• 제16권6호
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• pp.320-328
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• 2003

A specimen of Cu-35%Sn alloy has been subjected to the unidirectional heat treatment in an attempt to examine the evolution of microstructures under varying thermal conditions. The specimen was cast in the form of a cylinder 10 mm in diameter and 200 mm in length, which was then installed in the temperature gradient field established inside a vertical tube furnace. The furnace temperature was adjusted to make the upper part at $750^{\circ}C$ and bottom end part at $300^{\circ}C$ of the specimen. The experiment was terminated by dropping it into water after the 30 minutes holding at given temperature. By the rapid cooling, the high temperature phases, ${\gamma}$ and ${\zeta}$, were retained at ambient temperature with some of ${\gamma}$ phase transformed to ${\varepsilon}$ phase, especially at the grain boundaries of ${\gamma}$ phase. The presence of ${\varepsilon}$ phase was found to determine the nature of phase transformations of the ${\zeta}$ phase undergoes upon cooling. In the close area of the ${\varepsilon}$ phase, ${\varepsilon}$ phase grew separately out of ${\zeta}$, and adds to the preexisting ${\varepsilon}$ whereas in areas away from ${\varepsilon}$, both ${\delta}$ and ${\varepsilon}$ grew simultaneously out of ${\zeta}$, and formed a lamella eutectoid structure. The transformation to ${\delta}$ was found to occur only in slow cooling. The hardness on each phase showed that the retained phases, ${\gamma}$ and ${\zeta}$, could be plastically deformed without brittle fracture while the phases, ${\varepsilon}$ and ${\delta}$, were too brittle to be deformed.

• 대한의용생체공학회:의공학회지
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• 제2권1호
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• pp.39-46
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• 1981

Microstructural phases of the dental amalgams have been studied by optical microscope, scanning electron microprobe and X-ray diffractometer. r1 ($Ag_2Hg_3$) phase and r2 ($Sn_{7-8}Hg$) phase are found on conventional compositioned alloys. On high copper single compositioned alloy, rl ($Ag_2Hg_3$) phase and V ($Cu_6Sn_5$) phase are found but brittle r2 ($Sn_(7-8)Hg$) phase.