• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.526-530
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• 2004

We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

• 태양에너지
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• 제17권3호
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• pp.51-57
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• 1997

열벽 증착(hot-wall evaporation)방법으로 Cu를 첨가한 ZnTe박막을 성장하였다. doping을 하지 않은 ZnTe박막의 전기 전도형은 p-형으로 전기 전도도는 $10^{-6}({\Omega}{\cdot}cm)^{-1}$을 정도로 매우 낮았다. 첨가한 Cu의 양에 따라 전기 전도도는 $10^2({\Omega}{\cdot}cm)^{-1}$까지 증가하였으나 이동도는 크게 변하재 않았다. Cu를 매우 많이 첨가한 경우는 금속과 같은 전기 전도도를 관찰하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2014년도 추계학술대회 논문집
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• pp.250-251
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• 2014

This study introduces a simple deposition of $Cu_2O$ thin films with surface morphologies composed of columns, submicron-rods and submicron-branches on glass substrate from metallic Cu targets by tailoring the $Ar/O_2$ ratios during the sputtering. The obtained samples were used to fabricate gas sensor. The $H_2S$ sensing properties of the sensors at working temperatures from $100^{\circ}C$ to $300^{\circ}C$ were studied, in which $Cu_2O$ submicron-branches performed the best sensing property comparing with the rest morphologies. A transformation of $Cu_2O$ to $Cu_2S$ and CuS was consider as a main factor to the sensing mechanism of the sensors.

• 대한화학회지
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• 제38권9호
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• pp.632-639
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• 1994

가시부 영역에서 산화아연을 광증감시키기 위해 copper phthalocyanine(CuPc)과 sunfast yellow(SY)를 산화아연 분말에 이층 흡착시켰다. 산화아연에 대한 CuPc의 흡착상태를 알기 위하여 ZnO/CuPc의 광음향, IR 및 라만 스펙트럼을 측정한 결과, CuPc는 $\alpha$형 및 $\beta$형의 결정 특성을 유지한 이합체 또는 분자들의 집합체 상태로 산화아연에 흡착된다는 것을 알았다. 산화아연에 CuPc 및 SY를 순차적으로 이층 흡착시킨계(ZnO/CuPc/SY)는 SY를 먼저 흡착시킨 ZnO/SY/CuPc계보다 광기전력이 높게 나타났고, $ZnO/\beta-CuPc/SY$는 $ZnO/\alpha-CuPc/SY$보다 광기전력이 높게 나타났다. $ZnO/\beta-CuPc/SY$의 전자사진 감도를 측정하였더니 630 nm에서 $$S_{1/2}=2.99{\times}10^{-2}(erg/cm^2)^{-1}$ 이었다.

• Journal of Dairy Science and Biotechnology
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• 제22권2호
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• pp.107-112
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• 2004

과산화수소 형태의 반응성 산소에 대한 Lactobacillus Spp., Bifidobacterium spp. 및 Bacillus coagulans의 저항성과 세포 내에서 생성능력을 측정하기 위하여 본 연구가 수행되었다. Lactobacillus spp. 중에서 높은 과산화수소 저항성을 나타낸 균주는 L. acidophilus CU4111와 L. casei Cu4114인 것으로 나타났고 가장 낮은 저항성을 보인 균주는 L. brevis Cu4206이었다. Bifidobacterium longum CU4131은 높은 수준의 저항성을 나타내며 Bacillus coagulans를 포함하는 포자형성유산균주들은 전반적으로 과산화수소에 대한 저항성 이 높은 것으로 나타났다. 세포질 추출액 중의 과산화수소 함유 농도는 Bifidobacterium bifidum CU 4134가 가장 높고 Lactobacilli spp.의 세포질 추출액 중의 과산화수소 함유 농도는 L. casei CU 4114가 가장 높은 것으로 나타났다.

• 청정기술
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• 제8권1호
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• pp.53-59
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• 2002

공침-액상산화법으로 $Cu-CeO_2$ 촉매를 제조하여 선택적 산화반응에 대한 활성을 실험적으로 고찰하였다. $Cu-CeO_2$ 촉매는 일산화탄소의 선택적 산화반응에 우수한 활성을 보였으나, 구리의 담지량과 촉매 활성 사이의 일정한 상관관계를 찾을 수 없었다. 또한 구리의 담지량이 증가함에 따라 $CeO_2$의 세공 구조가 변하는 것을 확인할 수 있었으며 이는 Cu와 $CeO_2$가 고용체를 형성하기 때문으로 확인되었다. 촉매 전처리인 환원처리를 통한 Cu와 $CeO_2$의 고용체 형성이 촉매의 일산화탄소의 선택적 산화반응에 대한 활성을 증가시켰다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• 대한화학회지
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• 제55권4호
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• pp.666-672
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• 2011

Vanadium 치환체인 polyoxometalate 1, [Cu(2,2'-bipy)]$[Cu(2,2'-bipy)_2]_2[PMo_8V_6O_{42}]{\cdot}1.5H_2O$을 가지고 있는 inorganicorganic complex의 촉매 활성도를 Biginelli 반응에 적용하여 연구하였다. Dihydropyrimidinones를 one-pot 합성하는 반응에서, $H_3PMo_{12}O_{40}$ 촉매 보다[Cu(2,2'-bipy)]$[Cu(2,2'-bipy)_2]_2[PMo_8V_6O_{42}]{\cdot}1.5H_2O$ 촉매가 더 좋은 결과를 나타내었다.

• 한국표면공학회지
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• 제29권5호
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• pp.570-576
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• 1996

Cu films for future ULSI metallization were prepared by partially ionized beam (PIB) deposition and characterized in terms of preferred orientation, grain size, roughness and resistivity. PIB-Cu films were prepared on Si (100) at pressure of $8 \times 10^{-7}$~$1 \times 10^{-6}$ Torr. Effects of acceleration voltage and ionization potential on the properties of PIB-Cu films have been investigated. As the acceleration voltage increased at constant ionization potential of 400 V, the degree of preferred orientation and surface smoothness of the Cu film increased. At the ionization potential of 450 V, the degree of preferred orientation at the acceleration voltage higher than 2 kV decreased and surface roughness increased with acceleration voltage. Grain size of Cu films increased to 1100 $\AA$ initially up to applied acceleration voltage of 1 kV, above which a little increase occurred with the acceleration voltage. There was no indication of impurities such as C, O in all sample. Resistivity of Cu film had the same trends as the surface roughness with acceleration voltage and ionization potential. The increase of electrical resistivity of PIB-Cu films was explained in terms of grain size and surface roughness

• 센서학회지
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• 제29권3호
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• pp.156-161
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• 2020

In this study, hierarchical mesoporous CuO spheres, ZnO flowers, and heterojunction CuO/ZnO nanostructures were fabricated via a facile hydrothermal method. The as-prepared materials were characterized in detail using various analytical methods such as powder X-ray diffraction, micro Raman spectroscopy, X-ray photoelectron spectroscopy, field-emission scanning electron microscopy, and transmission electron microscopy. The obtained results are consistent with each other. The H₂S-sensing characteristics of the sensors fabricated based on the CuO spheres, ZnO flowers, and CuO/ZnO heterojunction were investigated at different temperatures and gas concentrations. The sensor based on ZnO flowers showed a maximum response of ~141 at 225 ℃. The sensor based on CuO spheres exhibited a maximum response of 218 at 175 ℃, whereas the sensor based on the CuO/ZnO nano-heterostructure composite showed a maximum response of 344 at 150 ℃. The detection limit (DL) of the sensor based on the CuO/ZnO heterojunction was ~120 ppb at 150 ℃. The CuO/ZnO sensor showed the maximum response to H₂S compared with other interfering gases such as ethanol, methanol, and CO, indicating its high selectivity.